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1. 发明申请

US20100104838A1 Optical Article and Method for Manufacturing the Same 审中-公开
标题翻译：光学制品及其制造方法
公开(公告)号：US20100104838A1
公开(公告)日：2010-04-29
申请号：US12510836
申请日：2009-07-28
申请人： Takashi Noguchi , Keiji Nishimoto , Tomohito Fukui
发明人： Takashi Noguchi , Keiji Nishimoto , Tomohito Fukui
IPC分类号： B32B7/02 , C23C16/513
CPC分类号： G02B1/115 , Y10T428/24942
摘要： An optical article includes an anti-reflection layer on a substrate, wherein the anti-reflection layer is formed of nine layers obtained by alternately stacking low refractive index layers and high refractive index layers, the layer closest to the substrate among the high and low refractive index layers that form the anti-reflection layer is called a first layer and the numbers of the following layers are incremented by one so that the odd-numbered layers are low refractive index layers and the even-numbered layers are high refractive index layers, and at least one of the following equations is satisfied: 0.8λ0≦λ1≦1.2λ0 (1) 0.8λ0≦λ3≦1.2λ0 (2) where λ0 represents a design primary wavelength greater than or equal to 480 nm but smaller than or equal to 550 nm, and λk represents the optical thickness of the corresponding one of the high and low refractive index layers (k represents the layer number).
摘要翻译：光学制品包括在基片上的抗反射层，其中抗反射层由9层通过交替堆叠低折射率层和高折射率层形成，层间距离基底最靠近高低折射率层形成防反射层的折射率层被称为第一层，并且随后的层的数量增加1，使得奇数层是低折射率层，偶数层是高折射率层，并且满足以下等式中的至少一个：0.8λ0＆nlE;λ1＆nlE;1.2λ0（1）0.8λ0＆nlE;λ3＆nlE;1.2λ0（2）其中λ0表示大于或等于480nm但小于或等于 550nm，λk表示高折射率层和低折射率层中的相应一个的光学厚度（k表示层数）。

2. 发明授权

US08215766B2 Optical article and method for producing the same 有权
标题翻译：光学制品及其制造方法
公开(公告)号：US08215766B2
公开(公告)日：2012-07-10
申请号：US12643762
申请日：2009-12-21
申请人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
发明人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
IPC分类号： G02C5/00 , G02C7/02 , B32B9/04 , B05D5/06 , G02B5/28
CPC分类号： G02B27/0018 , C23C14/083 , C23C14/5846 , G02B1/115 , Y10T428/31504
摘要： A method for producing an optical article. A first layer that is light-transmissive is formed on an optical substrate directly or with an additional layer in between. A silicide material, light-transmissive thin film is formed on the surface of the first layer.
摘要翻译：一种光学制品的制造方法。透光性的第一层直接形成在光学基板上，或者在其之间形成附加层。在第一层的表面上形成硅化物材料，透光性薄膜。

3. 发明授权

US08789944B2 Optical article and optical article production method 有权
标题翻译：光学制品和光学制品的生产方法
公开(公告)号：US08789944B2
公开(公告)日：2014-07-29
申请号：US13172587
申请日：2011-06-29
申请人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
发明人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
IPC分类号： G02C7/02
CPC分类号： G02B1/116 , C23C14/083 , C23C14/30 , G02B1/12 , G02B1/16 , G02B1/18 , Y10T428/265
摘要： An optical article comprising: an optical base material; and a translucent layer that contains TiOx (0
摘要翻译：一种光学制品，包括：光学基材; 以及包含TiO x（0

4. 发明授权

US08128225B2 Optical article and process for producing the same 有权
标题翻译：光学制品及其制造方法
公开(公告)号：US08128225B2
公开(公告)日：2012-03-06
申请号：US12710701
申请日：2010-02-23
申请人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
发明人： Keiji Nishimoto , Takashi Noguchi , Hiroyuki Seki
IPC分类号： G02C7/10 , G02C7/02 , B32B17/06 , B05D5/06
CPC分类号： G02B1/115 , G02C7/108 , G02C2202/16
摘要： A process for producing an optical article having an antireflection layer formed directly or via another layer on an optical base material, includes: forming a primary layer contained in the antireflection layer; and forming a light transmissive conductive layer containing a metal containing germanium as a main component and/or a compound of germanium and a transition metal on a surface of the primary layer.
摘要翻译：一种光学制品的制造方法，其特征在于，在光学基材上直接或经由另一层形成具有抗反射层的光学物品的制造方法，其特征在于，包括：形成所述防反射层中含有的主层; 以及在所述主层的表面上形成含有锗作为主要成分的金属和/或锗和过渡金属的化合物的透光导电层。

5. 外观设计

USD580889S1 Light source of light-emitting diode 有权
公开(公告)号：USD580889S1
公开(公告)日：2008-11-18
申请号：US29283240
申请日：2007-08-08
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito

6. 外观设计

USD576970S1 Light source of light-emitting diode 有权
标题翻译：发光二极管的光源
公开(公告)号：USD576970S1
公开(公告)日：2008-09-16
申请号：US29317275
申请日：2008-04-25
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito

7. 外观设计

USD573730S1 Lighting apparatus 有权
公开(公告)号：USD573730S1
公开(公告)日：2008-07-22
申请号：US29299101
申请日：2007-12-19
申请人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
设计人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata

8. 外观设计

USD573553S1 Light source of light-emitting diode 有权
公开(公告)号：USD573553S1
公开(公告)日：2008-07-22
申请号：US29283235
申请日：2007-08-08
申请人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito
设计人： Takaari Uemoto , Keiji Nishimoto , Satoshi Shida , Hiroyuki Naito

9. 发明申请

US20070189007A1 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module 有权
标题翻译： LED安装模块，LED模块，LED安装模块的制造方法和LED模块的制造方法
公开(公告)号：US20070189007A1
公开(公告)日：2007-08-16
申请号：US10591081
申请日：2005-03-18
申请人： Keiji Nishimoto , Hideo Nagai
发明人： Keiji Nishimoto , Hideo Nagai
IPC分类号： B60Q1/26
CPC分类号： H01L24/97 , F21K9/23 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/00
摘要： The following explains an LED module that can achieve favorable light extraction efficiency without increasing a cost. An LED module (100) includes LED devices (110), an LED mounting module (120) on which the LED devices (110) are mounted, and a lens board (130) attached to a front surface of the LED mounting module (120). The LED mounting module (120) includes a printed wiring board (123) and a reflecting board (126). The printed wiring board (123) is an insulation board (122) on which a wiring pattern (124), used to mount the LED devices (110), is formed. The reflecting board (126) is made of a resin material, and has therein reflecting holes (126a) provided in correspondence with locations, on the printed wiring board (123), where the LED devices (110) are mounted. The reflecting board (126) and the printed wiring board (123) are directly adhered to each other at their surfaces that face each other.
摘要翻译：以下说明能够在不增加成本的情况下实现良好的光提取效率的LED模块。 LED模块（100）包括LED装置（110），安装有LED装置（110）的LED安装模块（120），以及附接到LED安装模块（120）的前表面的透镜板）。 LED安装模块（120）包括印刷电路板（123）和反射板（126）。印刷电路板（123）是形成用于安装LED器件（110）的布线图案（124）的绝缘板（122）。反射板（126）由树脂材料制成，并且在安装有LED器件（110）的印刷电路板（123）上具有与位置对应设置的反射孔（126a）。反射板（126）和印刷电路板（123）在彼此相对的表面上彼此直接粘接。

10. 发明授权

US07906731B2 Light emitting module, lighting device and display device 有权
标题翻译：发光模块，照明装置和显示装置
公开(公告)号：US07906731B2
公开(公告)日：2011-03-15
申请号：US12612553
申请日：2009-11-04
申请人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
发明人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
IPC分类号： H01L33/00
CPC分类号： F21V29/004 , F21V19/0055 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K3/0061 , H05K2201/09018 , H05K2201/10106 , Y10S362/80 , H01L2924/00014
摘要： A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.
摘要翻译：照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在散热器70确保LED模块60的翘曲的中心部分接触散热器70。

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