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1. 发明申请

US20040099824A1 Wafer processing apparatus capable of mapping wafers 有权
标题翻译：能够映射晶片的晶片处理装置
公开(公告)号：US20040099824A1
公开(公告)日：2004-05-27
申请号：US10301841
申请日：2002-11-22
申请人： TDK CORPORATION
发明人： Hiroshi Igarashi , Tsutomu Okabe , Toshihiko Miyajima
IPC分类号： G01V008/00 , G01N021/86
CPC分类号： H01L21/67265 , G01V8/12 , H01L21/67772 , Y10S414/137
摘要： A wafer processing apparatus on which a pod having an opening is detachably mounted is provided with a door unit and a mapping unit provided with a transmitting type sensor having an emitter and a detector forming a slot therebetween. The emitter and the detector are moved toward the opening in the pod and are plunged into the interior of the pod after a door is opened by the door unit, and the slot between the emitter and the detector crosses an end portion of a wafer to thereby detect the presence or absence of the wafer. Thereby, a mechanism portion liable to produce dust which may adhere to the wafer and cause the contamination thereof can be disposed separately from the pod.
摘要翻译：具有可拆卸地安装有开口的容器的晶片处理装置设置有门单元和映射单元，该单元设置有具有发射器的传输型传感器和在其间形成狭槽的检测器。发射器和检测器朝向容器中的开口移动，并且在门被门单元打开之后被插入到容器的内部，并且发射器和检测器之间的槽与晶片的端部相交，由此检测晶片的存在或不存在。因此，可以与容器分开设置容易产生可能附着在晶片上并导致其污染的灰尘的机构部分。

2. 发明申请

US20040187793A1 Wafer processing apparatus having dust proof function 有权
公开(公告)号：US20040187793A1
公开(公告)日：2004-09-30
申请号：US10706915
申请日：2003-11-14
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi
IPC分类号： C23C016/00
CPC分类号： H01L21/67772 , Y10S414/135 , Y10S414/139
摘要： The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

3. 发明申请

US20040147122A1 Wafer processing apparatus having dust proof function 有权
公开(公告)号：US20040147122A1
公开(公告)日：2004-07-29
申请号：US10706914
申请日：2003-11-14
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： H01L21/67772 , Y10S414/135 , Y10S414/139
摘要： The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

4. 发明申请

US20040146378A1 Wafer processing apparatus having dust proof function 有权
标题翻译：晶圆加工设备具有防尘功能
公开(公告)号：US20040146378A1
公开(公告)日：2004-07-29
申请号：US10706977
申请日：2003-11-14
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi
IPC分类号： B65G001/00 , B65G049/07
CPC分类号： H01L21/67772 , Y10S414/135 , Y10S414/139
摘要： The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.
摘要翻译：晶片处理装置包括被加压到比其外部的压力高的压力的室，室的内部和外部通过该开口部彼此连通，以及关闭开口部分。当开口部分被门关闭时，开口的一部分保持为未被门覆盖的孔。在传统的半导体晶片处理装置中，为了在晶片处理部分保持高度的清洁度，装置的内部被密封和加压，因此由于装置的内部和外部之间的压差而产生气流。利用本发明的上述特征，可以抑制这种气流的产生，防止灰尘进入晶片处理装置以消除晶片污染。

5. 发明申请

US20040127048A1 Wafer processing apparatus including clean box stopping mechanism 审中-公开
公开(公告)号：US20040127048A1
公开(公告)日：2004-07-01
申请号：US10703498
申请日：2003-11-10
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi , Toshihiko Miyajima
IPC分类号： H01L021/461 , H01L021/302
CPC分类号： H01L21/67772
摘要： The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.

6. 发明申请

US20040127028A1 Wafer processing apparatus having dust proof function 有权
公开(公告)号：US20040127028A1
公开(公告)日：2004-07-01
申请号：US10330092
申请日：2002-12-30
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： H01L21/67772 , Y10S414/135 , Y10S414/139
摘要： The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

7. 发明申请

US20040127029A1 Wafer processing apparatus including clean box stopping mechanism 有权
标题翻译：晶圆加工设备包括清洁箱停止机构
公开(公告)号：US20040127029A1
公开(公告)日：2004-07-01
申请号：US10330098
申请日：2002-12-30
申请人： TDK CORPORATION
发明人： Tsutomu Okabe , Hiroshi Igarashi , Toshihiko Miyajima
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： H01L21/67772
摘要： The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.
摘要翻译：半导体晶片处理装置包括具有开口的清洁盒，用于封闭开口的盖，与盖接触并将盖与清洁盒分离的门，适于与第干净的盒子与其相对的位置关系不会改变，并且有一个不动的第二个止动器。利用这种结构，即使根据规定的标准通过使用强化塑料的成型而制造的清洁盒包括其尺寸的制造误差，也可以防止在半导体晶片处理装置上移动的清洁盒与装置碰撞。

8. 发明申请

US20040099826A1 Wafer processing apparatus capable of mapping wafers 审中-公开
公开(公告)号：US20040099826A1
公开(公告)日：2004-05-27
申请号：US10698421
申请日：2003-11-03
申请人： TDK CORPORATION
发明人： Hiroshi Igarashi , Tsutomu Okabe , Toshihiko Miyajima
IPC分类号： G01V008/00
CPC分类号： H01L21/67265 , G01V8/12 , H01L21/67772 , Y10S414/137
摘要： A wafer processing apparatus on which a pod having an opening is detachably mounted is provided with a door unit and a mapping unit provided with a transmitting type sensor having an emitter and a detector forming a slot therebetween. The emitter and the detector are moved toward the opening in the pod and are plunged into the interior of the pod after a door is opened by the door unit, and the slot between the emitter and the detector crosses an end portion of a wafer to thereby detect the presence or absence of the wafer. Thereby, a mechanism portion liable to produce dust which may adhere to the wafer and cause the contamination thereof can be disposed separately from the pod.

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