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1. 发明授权

US07207871B1 Carrier head with multiple chambers 有权
标题翻译：具有多个腔室的承载头
公开(公告)号：US07207871B1
公开(公告)日：2007-04-24
申请号：US11245867
申请日：2005-10-06
申请人： Steven M. Zuniga , Hung Chih Chen , Thomas Brezoczky , Steven T. Mear
发明人： Steven M. Zuniga , Hung Chih Chen , Thomas Brezoczky , Steven T. Mear
IPC分类号： B24B5/00
CPC分类号： B24B37/30 , B24B49/16
摘要： A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.
摘要翻译：描述了一种用于化学机械抛光的系统，该系统具有可被构造成压力区的具有可加压室的载体头。该系统包括具有用于在抛光期间接触基底的膜的载体头部。膜后面的可加压室与压力输入连通。压力输入可以为可加压室提供不同的压力。一些可加压室可以与多于一个的压力输入连通。可以布置压力区域，其中每个区域包括一个或多个可加压室。这些区域可以通过改变构成每个区域的可加压室来配置。

2. 发明授权

US06361419B1 Carrier head with controllable edge pressure 有权
标题翻译：承载头具有可控边缘压力
公开(公告)号：US06361419B1
公开(公告)日：2002-03-26
申请号：US09536249
申请日：2000-03-27
申请人： Steven M. Zuniga , Gopalakrishna B. Prahbu , Steven T. Mear
发明人： Steven M. Zuniga , Gopalakrishna B. Prahbu , Steven T. Mear
IPC分类号： B24B500
CPC分类号： B24B37/30
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A volume between the flexible membrane and a carrier structure provides a chamber. A body located in the chamber has a first portion that applies pressure to a first region of an upper surface of a central portion of the flexible membrane and a second portion that is separable and movable into contact with a second region of the upper surface of the central portion of the flexible membrane.
摘要翻译：用于化学机械抛光装置的载体头包括向基底施加载荷的柔性膜。柔性膜和载体结构之间的体积提供了一个室。位于腔室中的主体具有第一部分，该第一部分对柔性膜的中心部分的上表面的第一区域施加压力，第二部分可分离并可移动地与第二部分接触，柔性膜的中心部分。

3. 发明授权

US06439964B1 Method of controlling a polishing machine 有权
标题翻译：控制抛光机的方法
公开(公告)号：US06439964B1
公开(公告)日：2002-08-27
申请号：US09608418
申请日：2000-06-30
申请人： Gopalakrishna B. Prahbu , Steven T. Mear
发明人： Gopalakrishna B. Prahbu , Steven T. Mear
IPC分类号： B24B4900
CPC分类号： B24B49/16 , B24B37/04 , B24B37/042 , H01L21/30625
摘要： Recipes for the polishing machine, such as recipes for carrier head pressure, are generated from empirical data, and consequently can provide a more accurate prediction than techniques based upon theoretical models. A plurality of test substrates are polished with a plurality of parameter sets. A polishing profile is measured for each of the plurality of test substrates, and a polishing time is calculated for each polishing parameter set which minimizes the difference between a predicted substrate profile and a desired substrate profile.
摘要翻译：用于抛光机的配方，如载体头部压力的配方，是从经验数据生成的，因此可以提供比基于理论模型的技术更准确的预测。多个测试基板用多个参数组进行抛光。对于多个测试基板中的每一个测量抛光轮廓，并且对于每个抛光参数组计算抛光时间，其最小化预测的衬底轮廓和期望的衬底轮廓之间的差异。

4. 发明授权

US06217426B1 CMP polishing pad 失效
公开(公告)号：US06217426B1
公开(公告)日：2001-04-17
申请号：US09287575
申请日：1999-04-06
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

5. 发明授权

US06220942B1 CMP platen with patterned surface 有权
公开(公告)号：US06220942B1
公开(公告)日：2001-04-24
申请号：US09285508
申请日：1999-04-02
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
IPC分类号： B24B704
CPC分类号： B24B37/16
摘要： A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

6. 发明申请

US20090044838A1 OZONATION FOR ELIMINATION OF BACTERIA FOR WET PROCESSING SYSTEMS 审中-公开
标题翻译：消除湿处理系统细菌的危害
公开(公告)号：US20090044838A1
公开(公告)日：2009-02-19
申请号：US12249954
申请日：2008-10-12
申请人： Bruce Willing , Daniel P. Forster , David Datong Huo , Robert D. Tolles , Christopher L. Haynes , Steven T. Mear , David Paul , William M. Evans
发明人： Bruce Willing , Daniel P. Forster , David Datong Huo , Robert D. Tolles , Christopher L. Haynes , Steven T. Mear , David Paul , William M. Evans
IPC分类号： B08B3/08
CPC分类号： B08B3/04 , B08B3/08 , B08B2203/005 , C02F1/78 , C02F9/005 , C02F2103/02 , C02F2201/782 , C11D11/0047 , G03F7/423 , H01L21/6704
摘要： In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.
摘要翻译：在第一方面，提供一种适于清洁半导体器件制造部件的装置。该装置包括适于（1）获得臭氧的臭氧模块; （2）将臭氧与流体混合以产生臭氧化流体; 和（3）将臭氧化流体输送到半导体器件制造部件以清洁半导体器件制造部件。提供了许多其他方面。

7. 发明授权

US06592438B2 CMP platen with patterned surface 有权
标题翻译：带有图案表面的CMP压板
公开(公告)号：US06592438B2
公开(公告)日：2003-07-15
申请号：US09759556
申请日：2001-01-12
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
IPC分类号： B24B700
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.
摘要翻译：提供了具有一个以上抛光站的化学机械抛光系统。抛光站包括安装到压板上表面的压板和衬垫。将压板的上表面图案化以限定凸起区域和凹陷区域。凸起区域为衬垫提供刚性的安装表面，并且凹陷区域在衬垫与衬底接触时向衬垫提供期望程度的柔性和顺应性。

8. 发明授权

US06575825B2 CMP polishing pad 有权
标题翻译： CMP抛光垫
公开(公告)号：US06575825B2
公开(公告)日：2003-06-10
申请号：US09759858
申请日：2001-01-12
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
IPC分类号： B24D1102
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.
摘要翻译：提供了一种用于化学机械抛光系统的抛光垫。衬垫安装到可旋转的压板上并且包括抛光表面和偏转表面，当与衬底接触时，该抛光表面和偏转表面提供期望的刚度和顺应性。偏转表面可以包括延伸穿过垫的一个或多个通道，其通向大气。在一个实施例中，偏转区域限定凸起区域和凹陷区域。凸起区域为压板提供安装表面，而凹陷区域允许焊盘的顺应性。在另一个实施例中，偏转区域包括限定多个倾斜突起的多个通道。通道可以不相交，使得倾斜突起是设置在垫上的细长部分。或者，通道可以相交，使得倾斜的突起彼此隔离并且以间隔的关系设置在垫上。

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