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    • 2. 发明申请
    • TERMINAL CONNECTING STRUCTURE FOR ELECTRONIC COMPONENT, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC INSTRUMENT, AND RADIO TIMEPIECE
    • 电子元器件,封装,压电振动器,振荡器,电子仪器和无线电时钟的端子连接结构
    • US20130077449A1
    • 2013-03-28
    • US13627704
    • 2012-09-26
    • Seiko Instruments Inc.
    • Kiyoshi ARATAKE
    • H01L41/047H03B1/00G04C11/02H05K1/09
    • H03H9/1021G04R20/10
    • To provide a terminal connecting structure for an electronic component which achieves prevention of an increase in the electric resistance value between a through electrode and an electrode connected thereto and ensuring preferable conductive performance, a package, a piezoelectric vibrator, an oscillator, an electronic instrument, and a radio timepiece having a substrate of this terminal connecting structure for the electronic component. There is provided a terminal connecting structure for an electronic component including; a through electrode penetrating through a base substrate: and an external electrode electrically connected to the through electrode, wherein an outer end surface of the through electrode is formed with a coating film of a conductive oxide which covers the outer end surface, and the through electrode and the external electrode are electrically connected via the film of the conductive oxide.
    • 为了提供一种电子部件的端子连接结构,能够防止贯通电极与连接的电极之间的电阻值的增加,并且确保优选的导电性能,封装,压电振动器,振荡器,电子仪器, 以及具有用于电子部件的该端子连接结构的基板的无线电钟表。 提供一种用于电子部件的端子连接结构,包括: 贯穿基底基板的贯通电极和与贯通电极电连接的外部电极,其中,贯通电极的外端面形成有覆盖外端面的导电氧化物的涂膜,通孔电极 并且外部电极经由导电氧化物的膜电连接。