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1. 发明申请

US20090216486A1 Method for measuring three-dimension shape 审中-公开
标题翻译：测量三维形状的方法
公开(公告)号：US20090216486A1
公开(公告)日：2009-08-27
申请号：US12453321
申请日：2009-05-07
申请人： Min Young Kim , Hee Tae Kim , Byung Min Yoo , Se Hyun Han , Seung Jun Lee
发明人： Min Young Kim , Hee Tae Kim , Byung Min Yoo , Se Hyun Han , Seung Jun Lee
IPC分类号： G06F15/00 , G01B11/24
CPC分类号： G01B11/28 , G01B11/2531 , G06T7/521
摘要： A method of measuring a 3D shape, which can measure a 3D shape of target objects on a board by searching a database for bare board information when a measuring object is not set to a normal inspection mode or by performing bare board teaching when the board is supplied from a supplier having not the bare board information is provided. The method of measuring a 3D shape includes operation S100 of measuring a brightness of a first illumination source 41a, operation S200 of measuring a phase-to-height conversion factor, operation S300 of determining whether the measurement is performed in a normal inspection mode, operation S400 of measuring a 3D shape of a board 62 according to the normal inspection mode, operation S500 of determining whether bare board information about the board 62 is included, operation S600 of performing bare board teaching when the bare board information is excluded, operation S700 of measuring the 3D shape of target objects on the board 62 when the bare board information is included or bare board teaching information is generated, and operation S800 of analyzing whether the board 62 is normal or abnormal by using 3D shape information. Therefore, the 3D shape of target objects on the board may be more readily measured.
摘要翻译：一种测量3D形状的方法，其可以通过在测量对象未设置为正常检查模式时通过在数据库中查找裸板信息来测量板上的目标对象的3D形状，或者当板是板时，执行裸板教学提供从没有裸板信息的供应商提供的。测量3D形状的方法包括测量第一照明源41a的亮度的操作S100，测量相位到高度转换因子的操作S200，确定是否在正常检查模式下执行测量的操作S300，操作 S400，根据普通检查模式测量板62的3D形状，确定是否包括关于板62的裸板信息的操作S500;当裸板信息被排除时执行裸板教学的操作S600，操作S700 当生成裸板信息或者产生裸板教学信息时，测量板62上的目标对象的3D形状，以及通过使用3D形状信息来分析板62是正常还是异常的操作S800。因此，可以更容易地测量板上目标物体的3D形状。

2. 发明授权

US07545512B2 Method for automated measurement of three-dimensional shape of circuit boards 有权
标题翻译：自动测量电路板三维形状的方法
公开(公告)号：US07545512B2
公开(公告)日：2009-06-09
申请号：US11656458
申请日：2007-01-23
申请人： Min Young Kim , Hee Tae Kim , Byung Min Yoo , Se Hyun Han , Seung Jun Lee
发明人： Min Young Kim , Hee Tae Kim , Byung Min Yoo , Se Hyun Han , Seung Jun Lee
IPC分类号： G01B11/02
CPC分类号： G01B11/28 , G01B11/2531 , G06T7/521
摘要： A method of measuring a 3D shape includes the steps of measuring a brightness of a first illumination source 41a, measuring a phase-to-height conversion factor, measuring a 3D shape of a circuit board 62 according to the normal inspection mode, and determining whether bare board information about the circuit board 62 is included. If the information is not included, performing bare board teaching to acquire the information. Then, the 3D shape of target objects on the circuit board 62 are measured, when the bare board information is included or bare board teaching information is generated. Next, the circuit board 62 is analyzed to determine if it is normal or abnormal by using 3D shape information.
摘要翻译：测量3D形状的方法包括以下步骤：测量第一照明源41a的亮度，测量相位到高度的转换因子，根据正常检查模式测量电路板62的3D形状，以及确定是否包括关于电路板62的裸板信息。如果不包括信息，执行裸板教学以获取信息。然后，当包括裸板信息或生成裸板教学信息时，测量电路板62上的目标对象的3D形状。接下来，通过使用3D形状信息来分析电路板62以确定其是正常还是异常。

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