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1. 发明授权

US5713508A Stabilization of conductive adhesive by metallurgical bonding 失效
公开(公告)号：US5713508A
公开(公告)日：1998-02-03
申请号：US629178
申请日：1996-04-08
申请人： Michael Anthony Gaynes , Kostas Papathomas , Giana M. Phelan , Charles Gerard Woychik
发明人： Michael Anthony Gaynes , Kostas Papathomas , Giana M. Phelan , Charles Gerard Woychik
IPC分类号： B23K1/00 , B23K1/20 , B23K20/02 , B23K35/00 , B23K35/02 , B23K35/30 , H01B1/22 , H05K3/32
CPC分类号： B23K20/023 , B23K35/007 , B23K35/0244 , B23K35/3006 , B23K35/3013 , H05K3/321 , B23K2201/32 , H01L2224/293 , H01L2924/01079 , H01L2924/01322 , H05K2201/0218 , H05K2203/0278 , H05K2203/0425
摘要： A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

2. 发明授权

US5542602A Stabilization of conductive adhesive by metallurgical bonding 失效
标题翻译：通过冶金粘合稳定导电胶
公开(公告)号：US5542602A
公开(公告)日：1996-08-06
申请号：US366582
申请日：1994-12-30
申请人： Michael A. Gaynes , Kostas Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K1/00 , B23K1/20 , B23K20/02 , B23K35/00 , B23K35/02 , B23K35/30 , H01B1/22 , H05K3/32 , B23K20/00
CPC分类号： B23K20/023 , B23K35/007 , B23K35/0244 , B23K35/3006 , B23K35/3013 , H05K3/321 , B23K2201/32 , H01L2224/293 , H01L2924/01079 , H01L2924/01322 , H05K2201/0218 , H05K2203/0278 , H05K2203/0425
摘要： A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.
摘要翻译：可替代焊接工艺的冶金结合物通过在低温下通过瞬态液相（TLP）反应而形成金属与金属涂层的合金，该金属涂层施加到至少一个待结合的表面上。通过反复热循环可以稳定地进行电连接的贵金属的机械结合可以在特别低的温度下使用铟，锡或铅的涂层材料进行。各向异性或各向异性导电连接可以通过将包含导电颗粒的聚合物粘合剂施加到待粘合的至少一个表面上，并且通过在低于共晶合金的熔点的温度下固化聚合物粘合剂而在表面之间产生压缩力在允许进行TLP处理之前选择的金属系统。

3. 发明授权

US07951421B2 Vapor deposition of a layer 有权
标题翻译：蒸镀一层
公开(公告)号：US07951421B2
公开(公告)日：2011-05-31
申请号：US11407840
申请日：2006-04-20
申请人： Yuan-Sheng Tyan , Michael Long , Giana M. Phelan , Thomas R. Cushman
发明人： Yuan-Sheng Tyan , Michael Long , Giana M. Phelan , Thomas R. Cushman
IPC分类号： C23C16/00
CPC分类号： C23C14/246 , C23C14/12 , H01L27/3209 , H01L51/5278
摘要： A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.
摘要翻译：一种在衬底上沉积层的方法，包括将蒸发器加热到能够完全蒸发要沉积的蒸发剂的温度，将蒸发器完全蒸发的蒸发器的一个或多个量化单元分配到蒸发器中，从而提供面积蒸气分配器具有多个孔，并且将蒸发的蒸发器从蒸发器引导到区域蒸气分配器，使得蒸发器通过孔分配以将层沉积在基底上。

4. 发明授权

US07132140B2 Plural metallic layers in OLED donor 有权
标题翻译： OLED供体中的多个金属层
公开(公告)号：US07132140B2
公开(公告)日：2006-11-07
申请号：US10855679
申请日：2004-05-27
申请人： Kelvin Nguyen , Donald R. Preuss , Lee W. Tutt , Michael L. Boroson , Giana M. Phelan
发明人： Kelvin Nguyen , Donald R. Preuss , Lee W. Tutt , Michael L. Boroson , Giana M. Phelan
IPC分类号： B41M5/40 , H05B33/00 , H01L51/50
CPC分类号： H01L51/0013 , C23C14/048 , H01L51/56 , Y10S428/917
摘要： A donor element for transferring organic material to form an OLED device includes a transparent support, a first metallic layer responsive to radiation which passes through the transparent support to produce heat, a second metallic layer that is reactive to moisture or oxygen or both provided over the first metallic layer, and an organic layer having transferable organic material disposed over the second metallic layer which, in response to radiation absorbed by the first metallic layer, will cause the organic material to be transferred to an OLED device.
摘要翻译：用于传送有机材料以形成OLED器件的施主元件包括透明支撑体，响应于辐射的第一金属层，其穿过透明支撑体以产生热量，第二金属层，其对水分或氧气或二者均设置在第一金属层，以及设置在第二金属层上的可转移有机材料的有机层，其响应于被第一金属层吸收的辐射，将使有机材料转移到OLED器件。

5. 发明授权

US6087021A Polymer with transient liquid phase bondable particles 失效
标题翻译：具有瞬态液相可粘结颗粒的聚合物
公开(公告)号：US6087021A
公开(公告)日：2000-07-11
申请号：US86399
申请日：1998-05-28
申请人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L21/60 , H05K3/32 , B22F7/00
CPC分类号： H01L24/31 , B23K35/0244 , H01L24/29 , H01L24/83 , H05K3/321 , B23K35/26 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译：提供了在两个表面上的焊盘之间形成冶金结合的技术。放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。第一和第二种金属包括低熔点成分。两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。核心金属和涂覆金属一起包括低熔点成分。以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相材料和贱金属进入涂料。

6. 发明授权

US06853411B2 Light-producing high aperture ratio display having aligned tiles 有权
标题翻译：具有排列瓦片的产生高孔径率的显示器
公开(公告)号：US06853411B2
公开(公告)日：2005-02-08
申请号：US09788923
申请日：2001-02-20
申请人： Henry R. Freidhoff , Giana M. Phelan
发明人： Henry R. Freidhoff , Giana M. Phelan
IPC分类号： G09F9/40 , G02F1/133 , G02F1/1333 , G06F3/14 , G09F9/30 , G09G3/20 , H01L27/32 , G02F1/1347
CPC分类号： H01L27/3293 , G06F3/1446 , G09G3/20 , G09G2300/026 , H01L27/3244 , H01L27/3297
摘要： A high aperture ratio emissive tiled display comprised of a plurality of tiles including a substrate with discrete layers of integrated drive circuits, thin film transistors, circuit conductor layer and light-emitting pixel array wherein all the electronic circuitry is contained under the pixel array. Vertical interconnects are made between the drive circuits, circuits and pixel electrodes, as necessary, and can include vertical interconnections through the substrate. Large flat panel displays including at least two of said tiles are aligned to maintain pixel pitch from one tile to another to produce a seamless image.
摘要翻译：包括多个瓦片的高开口率发光平铺显示器，包括具有离散层的集成驱动电路的基板，薄膜晶体管，电路导体层和发光像素阵列，其中所有电子电路都包含在像素阵列下方。根据需要，在驱动电路，电路和像素电极之间形成垂直互连，并且可以包括通过衬底的垂直互连。将包括至少两个所述瓦片的大平板显示器对准以将像素间距从一个瓦片维持到另一个瓦片以产生无缝图像。

7. 发明授权

US08033643B2 Recyclable continuous ink jet print head and method 有权
标题翻译：可回收连续喷墨打印头和方法
公开(公告)号：US08033643B2
公开(公告)日：2011-10-11
申请号：US12466422
申请日：2009-05-15
申请人： Samuel Chen , Stephen C. Stoker , Giana M. Phelan
发明人： Samuel Chen , Stephen C. Stoker , Giana M. Phelan
IPC分类号： B41J2/135
CPC分类号： B41J2/1408 , B41J2/145 , B41J2002/14362 , B41J2202/20
摘要： A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold. When the die wears out, the high thermal conductivity of the interposing member allows the die to be easily removed from the manifold, thereby facilitating re-cycling of the manifold.
摘要翻译：提供了可回收的连续喷墨打印头，其包括由诸如不锈钢的金属形成的歧管，具有由诸如硅的陶瓷材料形成的喷墨嘴的模具，通过微连接连接到模具的控制电路，以及插入构件设置在歧管和模具之间。插入构件由诸如Al-SiC的复合材料形成，该复合材料的导热系数高于硅模的导热系数，并且热膨胀系数（CTE）在模具和歧管的热膨胀系数之间。在制造过程中，插入部件的CTE值允许使用持久的热固化环氧组合物来将管芯连接到歧管并且在管芯和控制电路之间封装微连接，同时保持模具的适当对准歧管上的喷墨喷嘴。当模具磨损时，插入构件的高热导率允许模具容易地从歧管移除，从而便于歧管的重新循环。

8. 发明申请

US20110204385A1 Vapor Deposition of a Layer 审中-公开
标题翻译：层的气相沉积
公开(公告)号：US20110204385A1
公开(公告)日：2011-08-25
申请号：US13090802
申请日：2011-04-20
申请人： Yuan-Sheng TYAN , Michael Long , Giana M. Phelan , Thomas R. Cushman
发明人： Yuan-Sheng TYAN , Michael Long , Giana M. Phelan , Thomas R. Cushman
IPC分类号： H01L33/00 , C23C16/448
CPC分类号： C23C14/246 , C23C14/12 , H01L27/3209 , H01L51/5278
摘要： A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.
摘要翻译：一种在衬底上沉积层的方法，包括将蒸发器加热到能够完全蒸发要沉积的蒸发剂的温度，将蒸发器完全蒸发的蒸发器的一个或多个量化单元分配到蒸发器中，从而提供面积蒸气分配器具有多个孔，并将蒸发的蒸发器从蒸发器引导到区域蒸气分配器，使得蒸发器通过孔分配以将层沉积在基底上。

9. 发明授权

US07108392B2 Tiled flat panel lighting system 有权
标题翻译：平铺平板照明系统
公开(公告)号：US07108392B2
公开(公告)日：2006-09-19
申请号：US10838697
申请日：2004-05-04
申请人： David R. Strip , Giana M. Phelan , Ronald S. Cok
发明人： David R. Strip , Giana M. Phelan , Ronald S. Cok
IPC分类号： F21S8/00
CPC分类号： H01L51/5203 , F21S2/005 , F21V33/006 , F21W2121/00 , F21Y2105/00 , F21Y2115/15 , G06F1/1601 , G09F9/3026 , H01L27/3276 , H01L27/3293 , H01L2251/5361 , H05B33/0803 , H05B33/0896
摘要： A tiled flat panel lighting system includes flat panel light emitting units, each unit comprising a light emitting region and at least two pairs of first and second electrical contacts which are accessible external to the unit, wherein the first electrical contacts of the pairs are electrically connected within the unit, the second electrical contacts of the pairs are electrically connected within the unit, the light emitting region is electrically connected to the connected first contacts and to the connected second contacts. A plurality of units may be electrically interconnected through pairs of the externally accessible first and second electrical contacts positioned at one or more adjacent edges of each of the units. In a further embodiment, a tiled flat panel lighting system comprising a plurality of flat panel light emitting units, wherein at least two of the flat panel light emitting units contain controllers, where the plurality of units are interconnected through contacts positioned at one or more adjacent edges of each of the units, wherein the interconnections provide for communications signals between the controllers.
摘要翻译：平铺平板照明系统包括平板发光单元，每个单元包括发光区域和可在该单元外部访问的至少两对第一和第二电触头，其中该对的第一电触点电连接在单元内，成对的第二电触点在单元内电连接，发光区域电连接到连接的第一触点和连接的第二触点。多个单元可以通过位于每个单元的一个或多个相邻边缘处的可外部访问的第一和第二电触点的成对电连接。在另一个实施例中，一种平铺平板照明系统，包括多个平板发光单元，其中至少两个平板发光单元包含控制器，其中多个单元通过位于一个或多个相邻每个单元的边缘，其中互连提供控制器之间的通信信号。

10. 发明授权

US06509941B2 Light-producing display having high aperture ratio pixels 有权
公开(公告)号：US06509941B2
公开(公告)日：2003-01-21
申请号：US09815076
申请日：2001-03-22
申请人： Henry R. Freidhoff , Giana M. Phelan
发明人： Henry R. Freidhoff , Giana M. Phelan
IPC分类号： G02F1133
CPC分类号： H01L27/3293 , H01L25/046 , H01L2924/0002 , Y10S345/903 , H01L2924/00
摘要： A method of making a tiled emissive display having at least two aligned tiles including finishing at least one edge of each tile and aligning the finished edges of such tiles and forming a monolithic structure including aligned tiles, each such aligned tile having a substrate, TFT circuits, drive circuits and bottom pixel electrodes for providing electrical signals to pixels in the corresponding tile. The method also includes coating the aligned tiles with material that produces light when activated by an electric field and forming at least one top pixel electrode over the coated material so that the coated material produces light when activated by an electric field from the electrode.

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