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1. 发明授权

US08461690B2 Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process 有权
标题翻译：能够抑制制造工序中的半导体芯片产生裂纹的半导体装置
公开(公告)号：US08461690B2
公开(公告)日：2013-06-11
申请号：US12969909
申请日：2010-12-16
申请人： Masanori Yoshida , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
发明人： Masanori Yoshida , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
IPC分类号： H01L29/40
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.
摘要翻译：一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

2. 发明申请

US20110147945A1 SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING GENERATION OF CRACKS IN SEMICONDUCTOR CHIP DURING MANUFACTURING PROCESS 有权
标题翻译：在制造过程中抑制半导体芯片中裂纹产生的半导体器件
公开(公告)号：US20110147945A1
公开(公告)日：2011-06-23
申请号：US12969909
申请日：2010-12-16
申请人： Masanori YOSHIDA , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
发明人： Masanori YOSHIDA , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
IPC分类号： H01L23/52
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.
摘要翻译：一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

3. 发明授权

US09374886B2 Signal line path and manufacturing method therefor 有权
标题翻译：信号线路径及其制造方法
公开(公告)号：US09374886B2
公开(公告)日：2016-06-21
申请号：US13343738
申请日：2012-01-05
申请人： Noboru Kato , Jun Sasaki
发明人： Noboru Kato , Jun Sasaki
IPC分类号： H05K1/00 , H05K1/03 , H05K3/02 , H05K3/10 , H05K1/02 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0218 , H05K1/028 , H05K3/28 , H05K3/4635 , H05K2201/0715 , Y10T29/49155
摘要： A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.
摘要翻译：容易弯曲的信号线包括至少包括绝缘体层的层叠体，该绝缘体层包括柔性材料，并且从Z轴方向的正方向侧到其负向侧层叠。接地导体牢固地固定在绝缘片的正方向侧的主面上，在z轴方向上。信号线在z轴方向上牢固地固定在绝缘体层的正极侧的主表面上。接地导体牢固地固定在绝缘体层的正方向侧的主面上，在z轴方向。接地导体和信号线定义了带状线结构。与绝缘体层的位置相比，层叠体弯曲，使得绝缘体层位于内周侧。

4. 发明授权

US09104950B2 Antenna and wireless IC device 有权
标题翻译：天线和无线IC器件
公开(公告)号：US09104950B2
公开(公告)日：2015-08-11
申请号：US13190670
申请日：2011-07-26
申请人： Noboru Kato , Jun Sasaki , Teppei Miura , Naoki Gouchi
发明人： Noboru Kato , Jun Sasaki , Teppei Miura , Naoki Gouchi
IPC分类号： G06K19/07 , H01Q1/22 , H01Q7/00 , H01Q9/16 , G06K19/077 , H01Q1/36 , H01Q9/28
CPC分类号： G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2283 , H01Q1/36 , H01Q7/00 , H01Q9/285
摘要： An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip.
摘要翻译：利用无线IC提高能量传递效率的无线IC器件的天线以及配备有天线的无线IC器件，其构成为：天线包括设置在线圈图案的端部的线圈图案和螺旋形耦合图案，以便相互面对。包括无线IC芯片和馈线电路基板的耦合模块安装在耦合模式上，以便限定无线IC器件。线圈图案是开放式线圈图案。耦合图案彼此靠近地布置以限定单个LC谐振器。因此，能量集中在耦合图案中，从而提高天线和无线IC芯片之间的能量传递效率。

5. 发明授权

US08915448B2 Antenna device and radio frequency IC device 有权
标题翻译：天线装置和射频IC装置
公开(公告)号：US08915448B2
公开(公告)日：2014-12-23
申请号：US13232102
申请日：2011-09-14
申请人： Katsumi Taniguchi , Jun Sasaki , Noboru Kato
发明人： Katsumi Taniguchi , Jun Sasaki , Noboru Kato
IPC分类号： G06K19/06 , G06K19/07 , H01Q1/22 , H01Q1/52 , H01Q7/00
CPC分类号： G06K19/0723 , G06K19/0726 , H01Q1/2208 , H01Q1/52 , H01Q7/00
摘要： An antenna device is arranged to transmit or receive a radio frequency communication signal to or from an external device such as a reader/writer, and is arranged such that an antenna resonance circuit including an antenna coil and a capacitor is connected to an additional resonance circuit including an inductor and a capacitor. A radio frequency IC device preferably includes the antenna device and a radio frequency IC. The antenna device is constructed such that a change in characteristics thereof caused by a change in the distance between a radio frequency IC device and a reader/writer is minimized, and the radio frequency IC device performs communication with high reliability.
摘要翻译：天线装置被布置为向诸如读取器/写入器的外部设备发送或接收射频通信信号，并且被布置为使得包括天线线圈和电容器的天线谐振电路连接到附加谐振电路包括电感和电容。射频IC装置优选地包括天线装置和射频IC。天线装置被构造为使得由射频IC器件和读取器/写入器之间的距离的变化引起的特性变化最小化，并且射频IC器件以高可靠性进行通信。

6. 发明授权

US08610636B2 Radio frequency IC device 有权
标题翻译：射频IC器件
公开(公告)号：US08610636B2
公开(公告)日：2013-12-17
申请号：US13163803
申请日：2011-06-20
申请人： Noboru Kato , Jun Sasaki , Kosuke Yamada
发明人： Noboru Kato , Jun Sasaki , Kosuke Yamada
IPC分类号： H01Q1/50
CPC分类号： H01Q1/2225 , G06K19/07749 , H01F2017/002
摘要： A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.
摘要翻译：射频IC器件包括射频IC芯片，馈电电路基板和散热板。供电电路基板包括电连接到无线电IC芯片并且包括谐振电路和/或包括电感元件的匹配电路的馈电电路。供电电路基板被接合到辐射板，辐射从馈电电路提供的传输信号，并将接收到的信号提供给馈电电路。电感元件以相反方向缠绕的螺旋图案布置，并以相反的方式相互耦合。无线射频IC器件能够获得不易受到使用环境影响的射频IC器件，使辐射特性的变化最小化，可以在宽频带中使用。

7. 发明授权

US08596545B2 Component of wireless IC device and wireless IC device 有权
标题翻译：无线IC器件和无线IC器件的组成部分
公开(公告)号：US08596545B2
公开(公告)日：2013-12-03
申请号：US12944099
申请日：2010-11-11
申请人： Noboru Kato , Jun Sasaki
发明人： Noboru Kato , Jun Sasaki
IPC分类号： G06K19/06 , H01L23/02
CPC分类号： G06K19/07749 , H01Q1/2225 , H01Q7/00
摘要： A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.
摘要翻译：无线IC器件的组件包括无线IC芯片和包括多个层叠树脂层的馈电电路基板。无线IC芯片包括在供电电路基板的内部，环状电极配置在供电电路基板的内部。无线IC器件的组件和辐射板限定无线IC器件。

8. 发明申请

US20130300277A1 BULB-TYPE LAMP AND LUMINAIRE 有权
标题翻译： BULB型灯和LUMINAIRE
公开(公告)号：US20130300277A1
公开(公告)日：2013-11-14
申请号：US13601264
申请日：2012-08-31
申请人： Jun Sasaki , Ryotaro Matsuda , Naoto Mori , Yoshiyuki Matsunaga , Hideki Okawa , Takeo Yasuda
发明人： Jun Sasaki , Ryotaro Matsuda , Naoto Mori , Yoshiyuki Matsunaga , Hideki Okawa , Takeo Yasuda
IPC分类号： H05B33/02
CPC分类号： F21V3/02 , F21K9/232 , F21V3/0615 , F21V3/0625 , F21V29/506 , F21Y2115/10
摘要： According to one embodiment, in a constricted part of a globe, one end is set to a minimum diameter, the other end is set to a maximum diameter, and a diameter thereof increases from the one end side to the other end side. The constricted part of the globe is concaved into the inside of an imaginary straight line connecting an outer edge of the one end and an outer edge of the other end when viewed in section. A light source part includes a semiconductor light-emitting element and is contained in the globe so that a light-emitting part is positioned between both the ends of the constricted part of the globe. A cap is positioned on one end side of the globe.
摘要翻译：根据一个实施例，在球形体的收缩部分中，一端被设定为最小直径，另一端被设定为最大直径，并且其直径从一端侧增加到另一端侧。当在截面中观察时，球体的收缩部分凹陷在连接一端的外边缘和另一端的外边缘的假想直线的内侧。光源部分包括半导体发光元件并且被包含在球体中，使得发光部分位于球形体的收缩部分的两端之间。盖子位于地球的一端。

9. 发明授权

US08461463B2 Composite module 有权
标题翻译：复合模块
公开(公告)号：US08461463B2
公开(公告)日：2013-06-11
申请号：US13080783
申请日：2011-04-06
申请人： Noboru Kato , Jun Sasaki , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Katsumi Taniguchi
IPC分类号： H05K1/16
CPC分类号： H05K1/186 , H01L23/49822 , H01L23/50 , H01L23/645 , H01L25/16 , H01L2224/16225 , H01L2924/19106 , H05K1/141 , H05K1/165 , H05K3/284 , H05K2201/09481 , H05K2201/10045 , H05K2203/1316
摘要： A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.
摘要翻译：获得了组合模块，其可以在不增加其尺寸的情况下实现组件的高密度安装。复合模块包括作为多层电路板的主衬底，安装在主衬底的下表面上的子衬底，设置在主衬底的下表面以覆盖副衬底的密封层，密封层限定安装在安装板上的安装表面和设置在安装表面上的端子电极。端子电极包括从主衬底直接绘制的至少一个第一端子电极和直接从该辅助衬底引出的至少一个第二端子电极。

10. 发明授权

US08193873B2 High-frequency coupler and communication device 有权
标题翻译：高频耦合器和通讯装置
公开(公告)号：US08193873B2
公开(公告)日：2012-06-05
申请号：US13159491
申请日：2011-06-14
申请人： Noboru Kato , Jun Sasaki , Teppei Miura
发明人： Noboru Kato , Jun Sasaki , Teppei Miura
IPC分类号： H03H2/00 , H01Q19/10
CPC分类号： H01Q1/38 , H01Q7/00 , H01Q9/16 , H01Q9/27 , H01Q19/10
摘要： A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased.
摘要翻译：高频耦合器和通信设备紧凑，能够在短距离内有效地传送大量数据，并且可以与非接触式IC卡组合使用。高频耦合器包括磁场产生模式和围绕其周围设置的周围模式，并且用于在使用宽带频率的通信系统中在短距离内传送大量数据。在与来自磁场产生图案的图案的平面垂直或基本垂直的方向上辐射的磁场中，在图案的平面中横向延伸的部分被周围图案阻挡，磁场被延长与图案的平面垂直或基本垂直的方向和通信距离增加。

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