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1. 发明授权

US10504878B2 LED module assemblies for displays 有权
公开(公告)号：US10504878B2
公开(公告)日：2019-12-10
申请号：US16152380
申请日：2018-10-04
申请人： LUMENS CO., LTD.
发明人： Chunki Min , Keunoh Kim , Huikyeong Noh , Kyungmin Cho
IPC分类号： H01L25/13 , H01L33/54 , H01L33/44 , H01L25/075
CPC分类号： H01L25/13 , H01L25/0753 , H01L33/44 , H01L33/54
摘要： Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other.

2. 发明授权

US10872882B2 LED module assemblies for displays 有权
公开(公告)号：US10872882B2
公开(公告)日：2020-12-22
申请号：US16674570
申请日：2019-11-05
申请人： LUMENS CO., LTD.
发明人： Chunki Min , Keunoh Kim , Huikyeong Noh , Kyungmin Cho
IPC分类号： H01L25/13 , H01L33/54 , H01L33/44 , H01L25/075
CPC分类号： H01L25/13 , H01L25/0753 , H01L33/44 , H01L33/54
摘要： Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other.

3. 发明授权

US10210795B2 LED display module 有权
公开(公告)号：US10210795B2
公开(公告)日：2019-02-19
申请号：US15814253
申请日：2017-11-15
申请人： LUMENS CO., LTD.
发明人： Jinmo Kim , Keunoh Kim , Junhyung Lim , Huikyeong Noh , Seongbok Yoon , Jinwon Choi , Jimin Her , Younghwan Shin , Kyujin Lee , Sol Han
IPC分类号： G09G3/32 , G02F1/133 , B41J2/45 , H01L27/15 , H01L25/075 , H04N13/337 , H05K1/02 , H01L33/48 , H01L27/32
摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

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