会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明授权
    • EEPROM cell and EEPROM device with high integration and low source resistance and method of manufacturing the same
    • EEPROM单元和EEPROM器件具有高集成度和低源电阻及其制造方法
    • US07588983B2
    • 2009-09-15
    • US12012593
    • 2008-02-04
    • Weon-ho ParkByoung-ho KimHyun-khe YoonSeung-beom YoonSung-chul ParkJu-ri KimKwang-Tae KimJeong-wook Han
    • Weon-ho ParkByoung-ho KimHyun-khe YoonSeung-beom YoonSung-chul ParkJu-ri KimKwang-Tae KimJeong-wook Han
    • H01L21/336H01L21/8238
    • H01L27/11524H01L27/105H01L27/11521H01L27/11526H01L27/11546
    • Provided are an EEPROM cell, an EEPROM device, and methods of manufacturing the EEPROM cell and the EEPROM device. The EEPROM cell is formed on a substrate including a first region and a second region. A first EEPROM device having a first select transistor and a first memory transistor is disposed in the first region, while a second EEPROM device having a second select transistor and a second memory transistor is disposed in the second region. In the first region, a first drain region and a second floating region are formed apart from each other. In the second region, a second drain region and a second floating region are formed apart from each other. A first impurity region, a second impurity region, and a third impurity region are disposed in a common source region between the first and second regions of the substrate. The first and third impurity regions form a DDD structure, and the first and second impurity region form an LDD structure. That is, the first impurity region completely surrounds the second and third impurity regions in horizontal and vertical directions, the second impurity region surrounds the third impurity region in a horizontal direction, and the junction depth of the third impurity is greater than that of the second impurity region.
    • 提供了EEPROM单元,EEPROM器件以及EEPROM单元和EEPROM器件的制造方法。 EEPROM单元形成在包括第一区域和第二区域的基板上。 具有第一选择晶体管和第一存储晶体管的第一EEPROM器件设置在第一区域中,而具有第二选择晶体管和第二存储晶体管的第二EEPROM器件设置在第二区域中。 在第一区域中,分开形成第一漏极区域和第二浮动区域。 在第二区域中,第二漏极区域和第二浮动区域彼此分开地形成。 第一杂质区域,第二杂质区域和第三杂质区域设置在基板的第一和第二区域之间的公共源极区域中。 第一和第三杂质区形成DDD结构,第一和第二杂质区形成LDD结构。 也就是说,第一杂质区域在水平和垂直方向上完全围绕第二和第三杂质区域,第二杂质区域在水平方向上包围第三杂质区域,并且第三杂质的结深度大于第二杂质区域的结深度 杂质区。
    • 10. 发明授权
    • Nonvolatile memory devices and methods of manufacturing the same
    • 非易失存储器件及其制造方法
    • US07968405B2
    • 2011-06-28
    • US12026812
    • 2008-02-06
    • Eun-Mi HongKwang-Tae KimJi-Hoon Park
    • Eun-Mi HongKwang-Tae KimJi-Hoon Park
    • H01L21/336
    • H01L21/28273H01L27/115H01L27/11521H01L27/11524H01L29/42324H01L29/7881
    • A method of manufacturing a nonvolatile memory device is provided. The method includes forming an isolation layer in a semiconductor substrate defining an active region and forming a molding pattern on the isolation layer. A first conductive layer is formed on a sidewall and a top surface of the molding pattern and on the semiconductor substrate. The first conductive layer on the top surface of the molding pattern is selectively removed forming a conductive pattern. The conductive pattern includes a body plate disposed on the active region and a protrusion which extends from an edge of the body plate onto the sidewall of the molding pattern. The molding pattern is then removed. An inter-gate dielectric layer is formed on the isolation layer and the conductive pattern. Nonvolatile memory devices manufactured using the method are also provided.
    • 提供一种制造非易失性存储器件的方法。 该方法包括在限定活性区域的半导体衬底中形成隔离层并在隔离层上形成模制图案。 第一导电层形成在模制图案的侧壁和顶表面上以及半导体衬底上。 选择性地去除模制图案的顶表面上的第一导电层,形成导电图案。 导电图案包括设置在有源区域上的主体板和从主体板的边缘延伸到模制图案的侧壁上的突起。 然后移除模制图案。 在隔离层和导电图案上形成栅极间电介质层。 还提供了使用该方法制造的非易失性存储器件。