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1. 发明授权

US06235225B1 Process for producing biocompatible implant material 有权
标题翻译：用于生产生物相容性植入材料的方法
公开(公告)号：US06235225B1
公开(公告)日：2001-05-22
申请号：US09635500
申请日：2000-08-09
申请人： Kohji Okada , Tsunetoshi Okura , Jun Sugimoto , Masahiko Okuyama
发明人： Kohji Okada , Tsunetoshi Okura , Jun Sugimoto , Masahiko Okuyama
IPC分类号： B22F510
CPC分类号： C04B38/065 , A61L27/12 , A61L27/56 , A61L2400/18 , C04B2111/00836 , C04B35/01 , C04B38/067 , C04B41/0018 , C04B35/447
摘要： A process for producing a biocompatible implant material which can be suitably shaped into a variety of forms. A binder is added to a mixture of hydroxylapatite powder and calcium phosphate glass frit (5 wt. %), to thereby prepare a slurry, and the resultant slurry is granulated, to prepare spherical raw material granules. Separately, spherical polyisobutyl methacrylate particles are prepared, and the particles are dry-mixed with the above-prepared granules, to thereby obtain a powder mixture. The powder mixture is compacted using a mold press, to thereby form a cuboid sample. The resultant compact is heated in a drier at 170° C. for three hours, to thereby melt spherical polyisobutyl methacrylate particles. Thereafter, the compact is allowed to cool, to thereby bind the raw material granules together via the polyisobutyl methacrylate that solidifies after melting. After the compact is allowed to cool, the compact is subjected to shaping by use of a copy machining machine and also to drilling. Thereafter, the compact is heated at a rate of 300° C. hour, and fired at 1,250° C. for three hours, to thereby produce a biocompatible implant material.
摘要翻译：一种生物相容性植入材料的制造方法，其可适当地成形为各种形式。向羟基磷灰石粉末和磷酸钙玻璃料（5重量％）的混合物中加入粘合剂，制备浆料，将得到的浆料造粒，制备球状原料颗粒。分别制备甲基丙烯酸球形聚异丁烯酸颗粒，将颗粒与上述制备的颗粒干混，得到粉末混合物。使用模压机将粉末混合物压实，从而形成长方体样品。将所得的压块在170℃的干燥器中加热3小时，从而熔化球形的聚异丁烯酸甲酯颗粒。此后，使压坯冷却，从而通过熔融后固化的聚甲基丙烯酸异丁酯将原料颗粒粘合在一起。在压实体冷却后，通过使用复印加工机进行成型，并进行钻孔。此后，以300℃的时间加热压块，并在1250℃下烧制3小时，从而制备生物相容的植入材料。

2. 发明授权

US06518657B2 Semiconductor device and lead frame assembly/lead frame for making a semiconductor device 有权
公开(公告)号：US06518657B2
公开(公告)日：2003-02-11
申请号：US09878637
申请日：2001-06-11
申请人： Hideshi Hanada , Jun Sugimoto , Yuichi Douki
发明人： Hideshi Hanada , Jun Sugimoto , Yuichi Douki
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L23/49548 , H01L23/49551 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.

3. 发明授权

US5246462A Insert for identifying an implantable ceramic joint head 失效
标题翻译：用于识别可植入陶瓷接头的插入件
公开(公告)号：US5246462A
公开(公告)日：1993-09-21
申请号：US926399
申请日：1992-08-10
申请人： Katsutoshi Bekki , Jun Sugimoto
发明人： Katsutoshi Bekki , Jun Sugimoto
IPC分类号： A61L27/00 , A61F2/00 , A61F2/30 , A61F2/36
CPC分类号： A61F2/3609 , A61F2002/30113 , A61F2002/30332 , A61F2002/30714 , A61F2002/30733 , A61F2002/30968 , A61F2002/3611 , A61F2002/3619 , A61F2002/3631 , A61F2002/365 , A61F2220/0033 , A61F2230/0006 , A61F2250/0089 , A61F2310/00179 , A61F2310/00203
摘要： An object of this invention is to provide an implantable ceramic joint head which can be readily marked without a reduction in the strength of the ceramic. In the artificial ceramic joint head of the present invention having a recess into which a stem is inserted, an insert with a marking is provided in the bottom of the recess.
摘要翻译：本发明的目的是提供一种可植入的陶瓷接头，其可以容易地标记而不降低陶瓷的强度。在具有插入杆的凹部的本发明的人造陶瓷接头中，具有标记的插入件设置在凹部的底部。

4. 发明授权

US06566740B2 Lead frame for a semiconductor device and method of manufacturing a semiconductor device 有权
标题翻译：半导体器件的引线框架和半导体器件的制造方法
公开(公告)号：US06566740B2
公开(公告)日：2003-05-20
申请号：US09813261
申请日：2001-03-20
申请人： Shoshi Yasunaga , Jun Sugimoto
发明人： Shoshi Yasunaga , Jun Sugimoto
IPC分类号： H01L23495
CPC分类号： H01L23/49565 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A lead frame for a semiconductor device. The lead frame has a layer defining a first unit lead frame including a first support for a semiconductor chip and a plurality of leads spaced around the first support. The first support has a peripheral edge. The layer further defines a guide rail extending along at least a portion of the peripheral edge and connected to at least one of the leads. At least one notch is formed in the layer between the at least one lead and a part of the guide rail so as to define a first tie bar.
摘要翻译：一种用于半导体器件的引线框架。引线框架具有限定第一单元引线框架的层，该第一单元引线框架包括用于半导体芯片的第一支撑件和围绕第一支撑件间隔开的多个引线。第一个支架具有外围边缘。该层进一步限定沿着周边边缘的至少一部分延伸并连接到至少一个引线的导轨。在所述至少一个引线和所述导轨的一部分之间的所述层中形成至少一个凹口，以便限定第一连接杆。

5. 发明授权

US06700186B2 Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device 有权
标题翻译：用于半导体器件的引线框架，由引线框架制成的半导体器件，以及制造半导体器件的方法
公开(公告)号：US06700186B2
公开(公告)日：2004-03-02
申请号：US10024827
申请日：2001-12-17
申请人： Shoshi Yasunaga , Hideshi Hanada , Takahiro Ishibashi , Jun Sugimoto , Yuichi Dohki , Hitoshi Etoh
发明人： Shoshi Yasunaga , Hideshi Hanada , Takahiro Ishibashi , Jun Sugimoto , Yuichi Dohki , Hitoshi Etoh
IPC分类号： H01L23495
CPC分类号： H01L23/49541 , H01L21/565 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.
摘要翻译：一种用于半导体器件的引线框架。半导体器件具有相对面对的片材和相对面对侧之间的厚度。片材具有第一和第二单元引线框架。每个单元引线框架具有对于半导体芯片的支持和至少一个来自支撑件的引导空间。该片材具有连接杆网络，其将支撑件连接到第一和第二引线框架中的每一个上的至少一个引线，以及b）第一引线框架和第二引线框架。片材具有分割线，沿着该分割线可以切割片材以使第一和第二引线框架彼此分离。连杆网络由至少一个沿着分割线的相当长度延伸的连杆构成。支撑件在片材的相对面侧之间具有第一厚度。所述至少一个连接杆在所述分隔线的相当长度上小于所述第一厚度的所述片材的相对面对之间具有第二厚度。

6. 发明授权

US06220501B1 Method of joining metallic members, and joined metallic members 有权
标题翻译：连接金属构件和接合的金属构件的方法
公开(公告)号：US06220501B1
公开(公告)日：2001-04-24
申请号：US09169981
申请日：1998-10-13
申请人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
发明人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
IPC分类号： B23K120
CPC分类号： B23K35/262 , B23K35/3613 , C22C13/00 , H05K3/3463
摘要： Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.
摘要翻译：公开了将金属构件连接在一起的方法。金属构件涂覆有由锡和锌的合金构成的底涂层，并通过包含锡和锌的焊料和助熔剂的混合物彼此接触，同时加热金属构件以熔化焊料。然后将熔融的焊料固化，以将金属构件接合。这里，底涂层中的锌的比例由x（重量％）表示，焊料中的锌的比例由y（重量％）表示，x的比例和y的比例为y 在由图1中的线A或B包围的区域内。 1，其满足以下公式：1 <= x <= 20,3 <= y <= 13和3 <=（x + y）/ 2 <= 13或式：0.1 <= x <= 25,2 = y <= 15和2 <=（x + y）/ 2 <= 15。

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