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1. 发明申请

US20100244282A1 ASSEMBLY OF ELECTRONIC COMPONENTS 失效
标题翻译：电子元件组装
公开(公告)号：US20100244282A1
公开(公告)日：2010-09-30
申请号：US12813472
申请日：2010-06-10
申请人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H01L23/49 , H01L23/498
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/4899 , H01L2224/78313 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.
摘要翻译：具有支撑结构的电子部件组件，具有多个接触焊盘的集成电路芯片，具有多个导体的印刷电路板，所述集成电路管芯和所述PCB通过管芯附着膜安装到所述支撑结构，它们彼此相邻并且彼此分开，并且引线将电接触焊盘电连接到导体。每个线接合的中间部分粘附到管芯附着膜上以降低引线接合弧的轮廓。

2. 发明授权

US07803659B2 Method of encapsulating wire bonds 失效
标题翻译：封装线接合方法
公开(公告)号：US07803659B2
公开(公告)日：2010-09-28
申请号：US12611922
申请日：2009-11-03
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , H01L21/56 , H01L23/13 , H01L24/00 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method encapsulating wire bonds that extend between a die and conductors on a supporting substrate, by contacting an edge of a profiling blade with the encapsulant material to form a bead of the encapsulant on the edge, positioning the edge such that the bead contacts the die and, moving the profiling blade relative to the die to cover the wire bonds with the encapsulant. Wiping the encapsulant over the wire bonds with a profiling blade provides control of the encapsulant front as well as the height of the encapsulant relative to the die. The movement of the profiling surface relative to the die can closely controlled to shape the encapsulant to a desired form. Using the example of a printhead die, the encapsulant can be shaped to present an inclined face rising from the nozzle surface to a high point over the wire bonds. This can be used by the printhead maintenance facilities to maintain contact pressure on the wiping mechanism. However, it will be appreciated that the encapsulant can be shaped to have ridges, gutters, grooves and so on by using a particular shape of profiling blade edge and relative movement with the die.
摘要翻译：一种封装线接合的方法，其通过使成型叶片的边缘与密封剂材料接触而在模具和导体之间延伸在支撑衬底上，以在边缘上形成密封剂的珠粒，定位边缘使得胎圈与模具接触并且使成型刀片相对于管芯移动以覆盖与密封剂的引线接合。通过线材与成型刀片擦拭密封剂提供密封剂前端以及密封剂相对于管芯的高度的控制。轮廓表面相对于模具的移动可以被紧密地控制，以将密封剂成形为期望的形式。使用打印头芯片的示例，密封剂可以被成形为呈现从喷嘴表面升高到线接合处的高点的倾斜面。这可以被打印头维护设施用来保持擦拭机构的接触压力。然而，应当理解，通过使用特定形状的成型叶片边缘和与模具的相对运动，密封剂可以成形为具有脊，沟槽，凹槽等。

3. 发明申请

US20090081833A1 WIRE BOND ENCAPSULANT APPLICATION CONTROL 有权
标题翻译： WIRE BOND ENCAPSULANT应用控制
公开(公告)号：US20090081833A1
公开(公告)日：2009-03-26
申请号：US11860541
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/56
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of applying encapsulant to a die mounted to a support structure by providing a die mounted to the support structure, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads, positioning a barrier proximate the electrical contact pads and spaced from the active surface to define a gap and, depositing a bead of encapsulant onto the electrical contact pads such that one side of the bead contacts the barrier and a portion of the bead extends into the gap and onto the active surface. Placing a barrier over the active surface so that it defines a narrow gap allows the geometry of the encapsulant front (the line of contact between the encapsulant and the active surface) can be more closely controlled. Any variation in the flowrate of encapsulant from the needle tends to cause bulges or valleys in the height of the bead and or the PCB side of the bead. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：一种通过提供安装到支撑结构的模具将密封剂施加到安装到支撑结构上的模具的方法，模具具有与支撑结构接触的后表面和与背面相对的活动表面，活性表面具有电接触焊盘，邻近电接触焊盘定位屏障并且与有源表面间隔开以限定间隙，并且将密封剂珠填充到电接触焊盘上，使得焊道的一侧接触屏障并且一部分焊珠延伸成间隙和活动表面。在活性表面上设置阻挡层，使得其限定窄的间隙允许密封剂前部的几何形状（密封剂和活性表面之间的接触线）可以被更加严密地控制。密封剂从针头流出的任何变化趋向于在珠子的高度和珠子的PCB侧产生凸起或凹陷。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

4. 发明申请

US20090081832A1 METHOD OF REDUCING WIRE BOND PROFILE HEIGHT IN INTEGRATED CIRCUITS MOUNTED TO CIRCUIT BOARDS 有权
标题翻译：在电路板安装的集成电路中减少线束配置高度的方法
公开(公告)号：US20090081832A1
公开(公告)日：2009-03-26
申请号：US11860539
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/56
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of profiling a wire bond between a contact pad on a die, and a conductor on a supporting structure, by electrically connecting the contact pad on the die to the conductor on the supporting structure with a wire bond, the wire bond extending in an arc from the contact pad to the conductor, pushing on the wire bond to collapse the arc and plastically deform the wire bond, and then releasing the wire bonds such that the plastic deformation maintains the wire bond in a flatter profile shape. The strength of the wire bond is known to be relatively small; of the order of 3 to 5 grams force. However, the Applicant's work has found that the wire bond structure is robust enough to withstand a certain degree of work hardening from plastic deformation. The arc of the wire bond can be deformed into a flatter profile without compromising the electrical connection with the PCB.
摘要翻译：通过用导线接合将模具上的接触垫与支撑结构上的导体电连接在一起，在芯片上的接触焊盘与支撑结构上的导体之间形成引线接合的方法，电弧从接触焊盘到导体，推动导线接合以使电弧塌陷并塑性变形引线接合，然后释放引线接合，使得塑性变形使线接合保持平坦的轮廓形状。已知线键的强度相对较小; 的次数为3〜5克力。然而，申请人的工作已经发现，线接合结构足够坚固以承受塑性变形的一定程度的加工硬化。引线接合的弧可以变形成更扁平的轮廓，而不会损害与PCB的电连接。

5. 发明授权

US08293589B2 Wire bond encapsulant control method 有权
标题翻译：电线键合密封剂控制方法
公开(公告)号：US08293589B2
公开(公告)日：2012-10-23
申请号：US12694101
申请日：2010-01-26
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of depositing encapsulant on a line of wire bonds to a die is described, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads and functional elements spaced from the contact pads. The method involves the steps of providing a die mounted to the support structure, positioning a barrier between the contact pads and the functional elements, the barrier being proximate to, but spaced from the active surface, depositing a bead of encapsulant onto the electrical contact pads while the barrier remains stationary such that the barrier prevents the encapsulant from contacting the functional elements, removing the barrier when the bead of encapsulant has been deposited. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：描述了将密封剂沉积在与管芯接合的线上的方法，所述管芯具有与支撑结构接触的后表面和与背面相对的有效表面，活性表面具有电接触焊盘和功能元件与接触垫。该方法包括以下步骤：提供安装到支撑结构的模具，在接触垫和功能元件之间定位阻挡层，阻挡层邻近但与活性表面隔开，将密封剂珠填充到电接触垫同时屏障保持静止，使得屏障防止密封剂与功能元件接触，当已经沉积密封剂珠时去除阻挡层。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

6. 发明授权

US07659141B2 Wire bond encapsulant application control 有权
标题翻译：电线键合密封剂应用控制
公开(公告)号：US07659141B2
公开(公告)日：2010-02-09
申请号：US11860541
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of applying encapsulant to a die mounted to a support structure by providing a die mounted to the support structure, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads, positioning a barrier proximate the electrical contact pads and spaced from the active surface to define a gap and, depositing a bead of encapsulant onto the electrical contact pads such that one side of the bead contacts the barrier and a portion of the bead extends into the gap and onto the active surface. Placing a barrier over the active surface so that it defines a narrow gap allows the geometry of the encapsulant front (the line of contact between the encapsulant and the active surface) can be more closely controlled. Any variation in the flowrate of encapsulant from the needle tends to cause bulges or valleys in the height of the bead and or the PCB side of the bead. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：一种通过提供安装到支撑结构的模具将密封剂施加到安装到支撑结构上的模具的方法，模具具有与支撑结构接触的后表面和与背面相对的活动表面，活性表面具有电接触焊盘，邻近电接触焊盘定位屏障并且与有源表面间隔开以限定间隙，并且将密封剂珠填充到电接触焊盘上，使得焊道的一侧接触屏障并且一部分焊珠延伸成间隙和活动表面。在活性表面上设置阻挡层，使得其限定窄的间隙允许密封剂前部的几何形状（密封剂和活性表面之间的接触线）可以被更加严密地控制。密封剂从针头流出的任何变化趋向于在珠子的高度和珠子的PCB侧产生凸起或凹陷。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

7. 发明授权

US08025204B2 Method of wire bond encapsulation profiling 有权
标题翻译：线粘结封装方法
公开(公告)号：US08025204B2
公开(公告)日：2011-09-27
申请号：US11860538
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： B21D39/00 , H01L21/66
CPC分类号： H01L21/56 , H01L21/67126 , H01L23/13 , H01L23/3157 , H01L23/4952 , H01L24/00 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method for profiling a bead of encapsulant extending along an edge of a die mounted to a supporting structure, by depositing a bead of encapsulant onto wire bonds along the edge of the die, positioning a profiling surface over the die at a predetermined spacing from the die, moving the profiling surface across the bead before the bead of encapsulant has cured to reshape the bead profile and, curing the bead of encapsulant. The invention has found that the encapsulant can be effectively shaped by a profiling surface without stripping the encapsulant from the wire bonds. The normally convex-shaped upper surface of the encapsulant bead can be pushed to one side of the bead with the profiling surface. With a lower encapsulant bead, the active surface can be brought into closer proximity with another surface without making contact. For example, the nozzle array on a printhead IC can be 300 microns to 400 microns from the paper path. By collapsing or flattening the wire bond arcs before applying and profiling a bead of encapsulant, the nozzle array on the printhead IC can be less than 100 microns from the paper path.
摘要翻译：一种用于对沿安装到支撑结构的模具的边缘延伸的密封剂珠粒进行成形的方法，通过将密封剂珠沿着模具的边缘沉积到引线接合上，将成型表面以与模具的预定间隔在密封剂珠密封固化以重新形成胎圈轮廓并固化密封剂珠之前，将成型表面移动穿过胎圈。本发明已经发现，密封剂可以通过成型表面有效地成形，而不会剥离密封剂与引线接合。密封剂珠的通常凸形的上表面可以用轮廓表面推到珠的一侧。使用较低的密封剂珠，活性表面可以与另一表面更接近而不接触。例如，打印头IC上的喷嘴阵列可以距离纸路径为300微米至400微米。通过在施加和成形密封剂珠之前，将引线接合弧折叠或变平，打印头IC上的喷嘴阵列可以距纸张路径小于100微米。

8. 发明授权

US07946465B2 Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards 有权
标题翻译： Wirebonder在集成电路管芯和印刷电路板之间形成薄型线材
公开(公告)号：US07946465B2
公开(公告)日：2011-05-24
申请号：US12046452
申请日：2008-03-12
申请人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： B23K37/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/49175 , H01L2224/78313 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2224/45099
摘要： A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such that they have a flatter profile shape.
摘要翻译：用于将集成电路管芯与印刷电路板上的导体电连接的引线键合器。引线键合器具有用于将集成电路管芯的引线接合附接到印刷电路板的导体的接合工具和用于使引线接合变形的引线接合结构，使得它们具有更平坦的轮廓形状。

9. 发明授权

US07824013B2 Integrated circuit support for low profile wire bond 有权
标题翻译：集成电路支持低配线接合
公开(公告)号：US07824013B2
公开(公告)日：2010-11-02
申请号：US11860540
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： B41J2/14
CPC分类号： B41J2/14 , B41J2002/14491 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A microprocessor device that has a support structure with a chip mounting area and a conductor mounting area. An inkjet printhead IC is supported on the chip mounting area. The inkjet printhead IC has a back surface in contact with the chip mounting area and an active surface opposing the back surface. The active surface has electrical contact pads and an array of ink ejection nozzles. The active surface has electrical contact pads for its circuitry and functional elements. A plurality of electrical conductors are, at least partially, supported on the conductor mounting area and a series of wire bonds extending from the electrical contact pads to the plurality of electrical conductors supported on the conductor mounting area wherein, the chip mounting area is raised relative to the conductor mounting area. By raising the chip mounting area relative to the rest of the PCB, or at least the conductors connected to the PCB end of the wire bonds, the top of the arc formed by the layer is much closer to the active surface of the die. This, in turn, allows the bead of encapsulant to have a lower profile relative to the active surface. With a lower encapsulant bead, the active surface can be brought into closer proximity with another surface without making contact. For example, the nozzle array on a printhead IC can be 300 microns to 400 microns from the paper path.
摘要翻译：一种微处理器设备，其具有带有芯片安装区域和导体安装区域的支撑结构。喷墨打印头IC支撑在芯片安装区域上。喷墨打印头IC具有与芯片安装区域接触的后表面和与背面相对的有效表面。活性表面具有电接触焊盘和喷墨喷嘴阵列。有源表面具有用于其电路和功能元件的电接触焊盘。多个电导体至少部分地被支撑在导体安装区域上，并且一系列线接合从电接触垫延伸到支撑在导体安装区域上的多个电导体，其中芯片安装区域相对升高到导体安装区域。通过相对于PCB的其余部分提高芯片安装面积，或者至少连接到引线的PCB端部的导体结合，由该层形成的电弧的顶部更靠近模具的有效表面。这又使得密封剂珠粒相对于活性表面具有较低的轮廓。使用较低的密封剂珠，活性表面可以与另一表面更接近而不接触。例如，打印头IC上的喷嘴阵列可以距离纸路径为300微米至400微米。

10. 发明申请

US20100133323A1 METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRCUIT BOARD 失效
标题翻译：一体化电路与印刷电路板的接线方法
公开(公告)号：US20100133323A1
公开(公告)日：2010-06-03
申请号：US12702203
申请日：2010-02-08
申请人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： B23K31/02 , B23K1/20
CPC分类号： B23K20/004 , B23K20/10 , B23K2101/42 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/4899 , H01L2224/78313 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure. The method involves electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective wire bond, each of the wire bonds extending in an arc from the contact pad to the conductor and, pushing on each of the wire bonds individually to collapse the arc and plastically deform the wire bond such that the plastic deformation maintains the wire bond in a flatter profile shape. The support structure has a chip mounting area for supporting the die. The die has a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.
摘要翻译：在模具上的接触焊盘线与支撑结构上的相应导体组之间绘制一系列引线接合的方法。该方法包括通过相应的引线接合将管芯上的每个接触焊盘电连接到支撑结构上的相应导体上，每个引线接合件从接触焊盘延伸到导体，并且每个引线单独的线接合以使电弧塌缩并塑性变形导线接合，使得塑性变形使线接合保持平坦的轮廓形状。支撑结构具有用于支撑模具的芯片安装区域。模具具有与芯片安装区域接触的后表面和与后表面相对的活动表面，活动表面具有接触垫，并且芯片安装区域相对于支撑结构的其余部分升高，使得接触垫相对于导体而升高。

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