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    • 7. 发明授权
    • Process for producing semiconductor substrate
    • 半导体衬底的制造方法
    • US06258698B1
    • 2001-07-10
    • US09046600
    • 1998-03-24
    • Yukiko IwasakiKatsumi NakagawaTakao YoneharaShoji NishidaKiyofumi Sakaguchi
    • Yukiko IwasakiKatsumi NakagawaTakao YoneharaShoji NishidaKiyofumi Sakaguchi
    • H01L2130
    • H01L21/2007
    • A process for producing a semiconductor substrate is provided which comprises a first step of anodizing a surface of a first substrate to form a porous layer on the surface, a second step of simultaneously forming a semiconductor layer on the surface of the porous layer and a semiconductor layer on a surface of the first substrate on its side opposite to the porous layer side, a third step of bonding the surface of the semiconductor layer formed on the surface of the porous layer to a surface of a second substrate, and a fourth step of separating the first substrate and the second substrate at the part of the porous layer to transfer to the second substrate the semiconductor layer formed on the surface of the porous layer, thereby providing the semiconductor layer on the surface of the second substrate. This makes it possible to produce semiconductor substrates at a low cost while making good use of expensive substrate materials.
    • 提供了一种制造半导体衬底的方法,其包括:第一步骤,阳极氧化第一衬底的表面以在表面上形成多孔层;第二步骤,在多孔层的表面上同时形成半导体层,半导体 在与第一基板的与多孔层侧相反的一侧的表面上的第三步骤,将形成在多孔层的表面上的半导体层的表面接合到第二基板的表面上的第三步骤, 在所述多孔层的一部分处分离所述第一基板和所述第二基板,以将所述半导体层转移到所述第二基板,所述半导体层形成在所述多孔层的表面上,从而在所述第二基板的表面上提供所述半导体层。 这使得可以以低成本制造半导体衬底,同时充分利用昂贵的衬底材料。