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1. 发明申请

US20100129986A1 DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造半导体器件的贴片电镀膜和工艺
公开(公告)号：US20100129986A1
公开(公告)日：2010-05-27
申请号：US12625680
申请日：2009-11-25
申请人： Katsuhiko KAMIYA , Hironao OOTAKE , Takeshi MATSUMURA , Shuuhei MURATA
发明人： Katsuhiko KAMIYA , Hironao OOTAKE , Takeshi MATSUMURA , Shuuhei MURATA
IPC分类号： H01L21/78 , B32B5/18
CPC分类号： B32B7/12 , B32B3/08 , B32B5/18 , B32B7/06 , B32B15/04 , B32B23/04 , B32B25/12 , B32B25/14 , B32B27/18 , B32B27/20 , B32B27/22 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , B32B27/40 , B32B29/002 , B32B2255/205 , B32B2262/101 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/516 , B32B2307/518 , B32B2307/54 , B32B2457/14 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2433/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/68377 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/19042 , Y10T428/249971 , Y10T428/249984 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.
摘要翻译：本发明涉及一种切片模片接合薄膜，其包括：具有设置在基材上的压敏粘合剂层的切割膜; 以及设置在压敏粘合剂层上的芯片接合膜，其中切割膜的压敏粘合剂层具有包含发泡剂的热膨胀性压敏粘合剂层和活性能量射线可固定的防污压敏粘合剂层，其依次层压在基材上，并且其中芯片接合膜由含有环氧树脂的树脂组合物构成。此外，本发明提供一种半导体器件的制造方法，其包括使用上述切割芯片接合膜。

2. 发明申请

US20100129987A1 DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造半导体器件的贴片电镀膜和工艺
公开(公告)号：US20100129987A1
公开(公告)日：2010-05-27
申请号：US12625682
申请日：2009-11-25
申请人： Katsuhiko KAMIYA , Hironao OOTAKE , Takeshi MATSUMURA , Shuuhei MURATA
发明人： Katsuhiko KAMIYA , Hironao OOTAKE , Takeshi MATSUMURA , Shuuhei MURATA
IPC分类号： H01L21/78 , B32B27/38
CPC分类号： B32B7/12 , B32B3/08 , B32B5/18 , B32B7/06 , B32B15/04 , B32B23/04 , B32B25/14 , B32B27/065 , B32B27/18 , B32B27/20 , B32B27/22 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/30 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B27/40 , B32B29/002 , B32B2255/205 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/516 , B32B2307/518 , B32B2307/54 , B32B2457/14 , C08J2205/052 , C09J7/22 , C09J7/38 , C09J2205/11 , C09J2433/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/68377 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/19042 , Y10T428/31511 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2═CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer. The heat-expandable pressure-sensitive adhesive layer has a surface free energy of 30 mJ/m2 or less. The die-bonding film is constituted by a resin composition containing an epoxy resin.
摘要翻译：本发明涉及一种切片模片接合薄膜，其包括：具有设置在基材上的压敏粘合剂层的切割膜; 以及设置在压敏粘合剂层上的芯片接合膜。切割膜的压敏粘合剂层是由含有丙烯酸类聚合物A和发泡剂的热膨胀性压敏粘合剂形成的热膨胀性压敏粘合剂层。丙烯酸类聚合物A是由包含50重量％以上的由CH 2 = CHCOOR（其中R为碳原子数6〜10的烷基）表示的丙烯酸酯和1重量％〜1重量％ 30重量％的含羟基单体，不含羧基单体。热膨胀性压敏粘合剂层的表面自由能为30mJ / m 2以下。芯片接合膜由含有环氧树脂的树脂组合物构成。

3. 发明申请

US20100279109A1 LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：层压膜和制造半导体器件的方法
公开(公告)号：US20100279109A1
公开(公告)日：2010-11-04
申请号：US12763585
申请日：2010-04-20
申请人： Hironao OOTAKE , Katsuhiko KAMIYA
发明人： Hironao OOTAKE , Katsuhiko KAMIYA
IPC分类号： B32B7/12 , B32B38/10
CPC分类号： B32B7/10 , B32B7/12 , B32B27/26 , B32B27/30 , H01L21/67011 , H01L24/29 , H01L2924/15747 , H01L2924/15788 , Y10T428/269 , Y10T428/28 , Y10T428/2891 , H01L2924/00
摘要： The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is formed of a pressure-sensitive adhesive composition containing a base polymer and a thermal crosslinking agent, and the pressure-sensitive adhesive layer is such that the gel fraction thereof before heating is less than 90% by weight and the gel fraction thereof after heating is changed to 90% by weight or more.
摘要翻译：本发明提供一种层压膜，其包括压敏粘合剂层的压敏粘合片和层叠在压敏粘合片的压敏粘合剂层上的模片粘合层，压敏粘合片的粘合剂层由含有基础聚合物和热交联剂的压敏粘合剂组合物形成，并且压敏粘合剂层使得其加热前的凝胶分数小于90％，加热后的凝胶分数变为90重量％以上。

4. 发明申请

US20100279468A1 LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：层压膜和制造半导体器件的方法
公开(公告)号：US20100279468A1
公开(公告)日：2010-11-04
申请号：US12763588
申请日：2010-04-20
申请人： Hironao OOTAKE , Katsuhiko KAMIYA
发明人： Hironao OOTAKE , Katsuhiko KAMIYA
IPC分类号： H01L21/50 , B32B7/12
CPC分类号： B32B7/12 , B32B7/10 , B32B27/30 , H01L2224/83101 , Y10T428/28 , Y10T428/2891
摘要： The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, the laminated film being for use in a production step of a semiconductor device, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet contains a water-supporting body, and the pressure-sensitive adhesive layer has a gel fraction of 90% by weight or more.
摘要翻译：本发明提供一种层压膜，其包括压敏粘合剂层的压敏粘合片和层叠在压敏粘合片的压敏粘合剂层上的芯片粘附层，该层压膜用于在粘合片的压敏粘合剂层含有水支持体的半导体装置的制造工序中使用，并且该粘合剂层的凝胶分数为90重量％以上。

5. 发明申请

US20120277368A1 AQUEOUS DISPERSION PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET 审中-公开
标题翻译：水溶性压敏粘合剂组合物和压敏胶粘剂
公开(公告)号：US20120277368A1
公开(公告)日：2012-11-01
申请号：US13458329
申请日：2012-04-27
申请人： Masatsugu KOSO , Katsuhiko KAMIYA , Hironao OOTAKE
发明人： Masatsugu KOSO , Katsuhiko KAMIYA , Hironao OOTAKE
IPC分类号： C09J133/10
CPC分类号： C09J133/08
摘要： The present invention relates to an aqueous dispersion pressure-sensitive adhesive composition containing: an acrylic emulsion polymer (A); and a compound (B) in which the compound (B) has a solubility in water (25° C.) of 1 g/100 g or more, and has, in the molecule, at least one nitrogen atom and two or more substituents represented by the following formula (1) and bonded to the nitrogen atom: (wherein R represents a divalent group selected from the group consisting of linear or branched alkylene having a carbon number of 1 to 10, phenylene, alkyl group-substituted phenylene, halogen-substituted phenylene, and heteroatom-containing alkylene).
摘要翻译：本发明涉及含有丙烯酸乳液聚合物（A）的水性分散体粘合剂组合物; 和化合物（B）在水（25℃）中的溶解度为1g / 100g以上的化合物（B），并且在分子中具有至少一个氮原子和两个以上的取代基由下式（1）表示并键合到氮原子上：（其中R表示选自碳数为1至10的直链或支链亚烷基的二价基团，亚苯基，烷基取代的亚苯基，卤素 - 取代的亚苯基和含杂原子的亚烷基）。

6. 发明申请

US20100129988A1 DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造半导体器件的贴片电镀膜和工艺
公开(公告)号：US20100129988A1
公开(公告)日：2010-05-27
申请号：US12625735
申请日：2009-11-25
申请人： Hironao OOTAKE , Katsuhiko KAMIYA
发明人： Hironao OOTAKE , Katsuhiko KAMIYA
IPC分类号： H01L21/78 , C09J7/00
CPC分类号： B32B7/12 , B32B3/08 , B32B5/18 , B32B15/04 , B32B23/04 , B32B25/12 , B32B25/14 , B32B25/18 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/22 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/30 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B27/40 , B32B29/002 , B32B2255/205 , B32B2262/101 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/516 , B32B2307/518 , B32B2307/54 , B32B2457/14 , C08J9/10 , C08J2207/02 , C08K5/23 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/102 , C09J2433/006 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/19042 , Y10T428/31786 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is a pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer, the base polymer is an acrylic polymer A composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2═CHCOOR (in which R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer, and the die-bonding film is formed of a die-adhering layer.
摘要翻译：本发明提供一种切片模片接合薄膜，包括：切割薄膜，其具有设置在基材上的压敏粘合剂层; 以及设置在压敏粘合剂层上的芯片接合膜，其中切割膜的压敏粘合剂层是含有气体发生剂的压敏粘合剂层，其比例为10-200份基于100重量份的基础聚合物的重量，基础聚合物是由包含50重量％以上的由CH 2 = CHCOOR表示的丙烯酸酯（其中R是烷基）的单体组合物构成的丙烯酸类聚合物A 具有6〜10个碳原子）和1重量％〜30重量％的含羟基单体，不含有羧基的单体，并且芯片接合膜由模具粘附层形成。

7. 发明申请

US20100129985A1 DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 有权
标题翻译：用于制造半导体器件的贴片电镀膜和工艺
公开(公告)号：US20100129985A1
公开(公告)日：2010-05-27
申请号：US12625634
申请日：2009-11-25
申请人： Hironao OOTAKE , Katsuhiko KAMIYA
发明人： Hironao OOTAKE , Katsuhiko KAMIYA
IPC分类号： H01L21/78 , C09J7/02
CPC分类号： B32B7/12 , B32B3/08 , B32B5/18 , B32B15/04 , B32B23/04 , B32B27/18 , B32B27/20 , B32B27/22 , B32B27/281 , B32B27/285 , B32B27/30 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B27/40 , B32B29/002 , B32B2255/205 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/516 , B32B2307/518 , B32B2307/54 , B32B2457/14 , C09J7/35 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2221/68377 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/19042 , Y10T428/31551 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer which is a specific acrylic polymer A, and the die-bonding film is formed of a die-adhering layer.
摘要翻译：本发明提供一种切片模片接合薄膜，包括：切割薄膜，其具有设置在基材上的压敏粘合剂层; 以及设置在压敏粘合剂层上的芯片接合膜，其中切割膜的压敏粘合剂层是含有气体发生剂的活性能量射线固化型压敏粘合剂层，其比例为基于100重量份作为特定丙烯酸类聚合物A的基础聚合物，10〜200重量份，并且芯片接合膜由模具粘附层形成。

8. 发明申请

US20120231267A1 DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET 审中-公开
标题翻译：双面压敏粘合片
公开(公告)号：US20120231267A1
公开(公告)日：2012-09-13
申请号：US13415191
申请日：2012-03-08
申请人： Hironao OOTAKE , Akiko TAKAHASHI , Mitsuyoshi SHIRAI
发明人： Hironao OOTAKE , Akiko TAKAHASHI , Mitsuyoshi SHIRAI
IPC分类号： C09J7/02 , B32B7/12 , C09J4/02 , B32B27/08 , B32B27/36 , B32B27/38 , B32B27/30 , B32B27/32 , B32B5/00 , B32B27/40
CPC分类号： C09J133/04 , C08G2170/40 , C08L75/06 , C09J7/50 , C09J2201/128 , C09J2411/003 , C09J2427/003 , C09J2433/00 , C09J2467/003 , C09J2475/003 , Y10T428/265 , Y10T428/2848
摘要： A pressure-sensitive adhesive sheet according to the present invention is a double-sided pressure-sensitive adhesive sheet having a plastic substrate and pressure-sensitive adhesive layers provided on each side thereof. The pressure-sensitive adhesive layers are formed from a water-dispersed pressure-sensitive adhesive composition having an acrylic polymer dispersed in an aqueous solvent. An anchor layer formed from an anchor composition containing polyester-polyurethane dissolved in an organic solvent is provided between at least a first side of the substrate and the pressure-sensitive adhesive layer.
摘要翻译：根据本发明的压敏粘合片是具有设置在其每一面上的塑料基材和压敏粘合剂层的双面粘合片。压敏粘合剂层由分散在水性溶剂中的丙烯酸类聚合物的水分散型压敏粘合剂组合物形成。在基材的至少第一面和压敏粘合剂层之间设置由包含溶解在有机溶剂中的聚酯 - 聚氨酯的锚固组合物形成的锚定层。

9. 发明申请

US20120157593A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF 审中-公开
标题翻译：压敏粘合剂组合物及其用途
公开(公告)号：US20120157593A1
公开(公告)日：2012-06-21
申请号：US13327301
申请日：2011-12-15
申请人： Hironao OOTAKE , Akiko TAKAHASHI , Kenichi YAMAMOTO
发明人： Hironao OOTAKE , Akiko TAKAHASHI , Kenichi YAMAMOTO
IPC分类号： C09J11/06 , C09J133/00 , C09J193/04
CPC分类号： C09J133/00
摘要： A pressure-sensitive adhesive (PSA) composition comprising an aqueous dispersion solution containing an aqueous solvent and a PSA constituent dispersed in the aqueous solvent is provided. The PSA constituent contains an acrylic polymer and a tackifier L having a viscosity of 2000 Pa·s or lower at 30° C. In addition, the PSA constituent contains a surfactant S containing in the molecular structure an aryloxy group serving as a hydrophobic group and an anionic or non-ionic hydrophilic group. Here, the aryloxy group is a phenyloxy group having at least one substituent having an aromatic ring. Such a PSA composition has excellent dispersion stability, as well as rough-surface adhesion property and water-resistance of the PSA sheet formed from the composition.
摘要翻译：提供了包含含有水性溶剂的水分散液和分散在水性溶剂中的PSA成分的压敏粘合剂（PSA）组合物。 PSA成分含有丙烯酸类聚合物和在30℃下粘度为2000Pa·s以上的增粘剂L.此外，PSA成分含有分子结构中含有作为疏水基团的芳氧基的表面活性剂S，阴离子或非离子亲水基团。这里，芳氧基是具有至少一个具有芳环的取代基的苯氧基。这样的粘合剂组合物具有优异的分散稳定性，以及由该组合物形成的粘合片的粗糙表面粘附性和耐水性。

10. 发明申请

US20120114930A1 PRESSURE-SENSITIVE ADHESIVE SHEET 审中-公开
标题翻译：压敏粘合片
公开(公告)号：US20120114930A1
公开(公告)日：2012-05-10
申请号：US13288264
申请日：2011-11-03
申请人： Kenichi YAMAMOTO , Akiko TAKAHASHI , Hironao OOTAKE , Eriko FUNATSU
发明人： Kenichi YAMAMOTO , Akiko TAKAHASHI , Hironao OOTAKE , Eriko FUNATSU
IPC分类号： B32B7/12 , C09J133/00
CPC分类号： C09J7/385 , C09J2201/622 , Y10T428/249983
摘要： A PSA sheet 40 including a PSA layer formed from an aqueous PSA composition and having adequate bonding workability with respect to elastic foams is provided. When this PSA sheet 40 is pressure-bonded to a flexible urethane foam 42 of 10 mm in thickness under conditions where the urethane foam 42 is compressed to a thickness of 5 mm, the 180° peel adhesive strength 30 minutes after the pressure-bonding is 1.5 N/20 mm or greater. ECS (gray), a product from Inoac Corporation, is used as the flexible urethane foam 42.
摘要翻译：提供一种粘合片40，其包含由PSA组合物形成的粘合剂层，并且具有相对于弹性泡沫塑料具有适当的粘结可加工性。在将聚氨酯泡沫42压缩至厚度5mm的条件下，将该粘合片40压接至厚度为10mm的柔性聚氨酯泡沫42时，压接后30分钟的180°剥离粘合强度为 1.5N / 20mm以上。使用来自Inoac Corporation的产品ECS（灰色）作为柔性聚氨酯泡沫42。

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