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1. 发明申请

US20130167369A1 APPARATUSES FOR MOUNTING SEMICONDUCTOR CHIPS 审中-公开
标题翻译：用于安装半导体芯片的装置
公开(公告)号：US20130167369A1
公开(公告)日：2013-07-04
申请号：US13618755
申请日：2012-09-14
申请人： Joo-Young OH , Juhyun LYU
发明人： Joo-Young OH , Juhyun LYU
IPC分类号： H01L21/677 , H05K3/30
CPC分类号： H01L21/67144 , H01L2224/16225 , H01L2224/75 , H05K3/3436 , Y10T29/53178
摘要： A delivering unit for a semiconductor chip provided with a solder bump may include a shuttle configured to move translationally along a direction; at least one chip supporting plate provided on the shuttle to support the semiconductor chip; a pick-up head configured to pick up the semiconductor chip from the at least one chip supporting plate; and at least one buffering member supporting the at least one chip supporting plate and relieving an impact between the pick-up head and the semiconductor chip. A semiconductor chip mounting apparatus may include a chip providing unit configured to provide semiconductor chips having one or more solder bumps; a mounting unit configured to mount the semiconductor chips on printed circuit boards in a surface mounting manner; and a chip delivering unit configured to deliver the semiconductor chips from the chip providing unit to the mounting unit.
摘要翻译：设置有焊料凸块的半导体芯片的传送单元可以包括构造成沿着方向平移地移动的梭子; 至少一个芯片支撑板，设置在梭子上以支撑半导体芯片; 拾取头构造成从所述至少一个芯片支撑板拾取所述半导体芯片; 以及支撑所述至少一个芯片支撑板并减轻所述拾取头与所述半导体芯片之间的冲击的至少一个缓冲构件。半导体芯片安装装置可以包括芯片提供单元，其被配置为提供具有一个或多个焊料凸块的半导体芯片; 安装单元，其构造成以表面安装方式将所述半导体芯片安装在印刷电路板上; 以及芯片传送单元，被配置为将半导体芯片从芯片提供单元传送到安装单元。

2. 发明申请

US20120104074A1 APPARATUS FOR MOUNTING SEMICONDUCTOR CHIP 有权
标题翻译：安装半导体芯片的装置
公开(公告)号：US20120104074A1
公开(公告)日：2012-05-03
申请号：US13228088
申请日：2011-09-08
申请人： Juhyun LYU
发明人： Juhyun LYU
IPC分类号： H05K13/04 , B23K3/00
CPC分类号： H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/73204 , H01L2224/7501 , H01L2224/75651 , H01L2224/7598 , H01L2924/01005 , H01L2924/01006 , H01L2924/01021 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/014
摘要： Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a wiring board support part, a transfer head, and a mounting head. The flux reservoir includes an accommodation recess in an upper surface to accommodate flux. The flux reservoir moving unit linearly moves the flux reservoir. The wafer support part is adjacent to a moving path of the flux reservoir and supports a wafer including a semiconductor chip. The wiring board support part is adjacent to the moving path and supports a wiring board. The transfer head picks up and places the semiconductor chip in the accommodation recess. The mounting head picks up the semiconductor chip from the accommodation recess and mounts the semiconductor chip on the wiring board through a surface mount process.
摘要翻译：提供一种用于安装半导体芯片的装置和方法。半导体芯片安装装置包括磁通储存器，磁通储存器移动单元，晶片支撑部分，布线板支撑部分，转印头和安装头。助熔储存器包括在上表面中的容纳凹槽以适应助焊剂。助流储存器移动单元线性移动通量储存器。晶片支撑部分与助焊剂储存器的移动路径相邻并且支撑包括半导体芯片的晶片。布线板支撑部分与移动路径相邻并支撑布线板。转印头拾取并将半导体芯片放置在容纳凹槽中。安装头从容纳凹部拾取半导体芯片，并通过表面安装工艺将半导体芯片安装在布线板上。

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