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1. 发明授权

US06258627B1 Underfill preform interposer for joining chip to substrate 失效
标题翻译：用于将芯片连接到基板的底部填充预成型件插入件
公开(公告)号：US06258627B1
公开(公告)日：2001-07-10
申请号：US09233388
申请日：1999-01-19
申请人： Joseph A. Benenati , William T. Chen , Lisa A. Fanti , Wayne J. Howell , John U. Knickerbocker
发明人： Joseph A. Benenati , William T. Chen , Lisa A. Fanti , Wayne J. Howell , John U. Knickerbocker
IPC分类号： H01L2144
CPC分类号： H01L24/28 , H01L21/563 , H01L24/11 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/3512 , H01L2924/00
摘要： An apparatus for and method of minimizing the thermo-mechanical fatigue of flip-chip packages. The interposer of the present invention, preferably comprising an organic polymer such as polyimide, contains apertures having conductive plugs inserted therein for joining a chip to a substrate in an electronic module utilizing flip-chip packaging. The interposer is selected to provide optimum spacing between the chip and substrate having a coefficient of thermal expansion adapted to the thermal cycling temperature extremes of the module components. The interposer may comprise an inner core with two adhesive outer layers which may comprise different materials to promote adhesion at their respective interfaces within a module. Conductive plugs are disposed within the apertures of the interposer comprising of a first and second solder or comprising a conductive plug having top and bottom surfaces coated with a conductive adhesive. Preferably, the first solder is disposed within an interior of the apertures and the second solder is disposed within an exterior of the apertures such that the first solder is between a first portion and a second portion of the second solder. Upon reflow, the second solder is reflowed while the first solder remains solid.
摘要翻译：用于最小化倒装芯片封装的热机械疲劳的装置和方法。本发明的插入物优选包含有机聚合物如聚酰亚胺，其中包含插入其中的导电插塞孔，其中使用倒装芯片封装将芯片连接到电子模块中的基片。选择插入器以在芯片和衬底之间提供适合于模块部件的热循环温度极限的热膨胀系数的最佳间隔。插入器可以包括具有两个粘合剂外层的内芯，其可以包括不同的材料以促进在其模块内的各自界面处的粘附。导电插头设置在插入件的孔内，包括第一和第二焊料或包括具有涂覆有导电粘合剂的顶表面和底表面的导电插塞。优选地，第一焊料设置在孔的内部，并且第二焊料设置在孔的外部内，使得第一焊料位于第二焊料的第一部分和第二部分之间。在回流时，第二焊料回流，而第一焊料保持固体。

2. 发明授权

US06358627B2 Rolling ball connector 有权
标题翻译：滚球连接器
公开(公告)号：US06358627B2
公开(公告)日：2002-03-19
申请号：US09768112
申请日：2001-01-23
申请人： Joseph A. Benenati , Claude L. Bertin , William T. Chen , Thomas E. Dinan , Wayne F. Ellis , Wayne J. Howell , John U. Knickerbocker , Mark V. Pierson , William R. Tonti , Jerzy M. Zalesinski
发明人： Joseph A. Benenati , Claude L. Bertin , William T. Chen , Thomas E. Dinan , Wayne F. Ellis , Wayne J. Howell , John U. Knickerbocker , Mark V. Pierson , William R. Tonti , Jerzy M. Zalesinski
IPC分类号： H01L2144
CPC分类号： H01L24/16 , G01R1/0483 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/83 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/1319 , H01L2224/17051 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H05K1/111 , H05K3/321 , H05K2201/0133 , H05K2201/0212 , H05K2201/0221 , H05K2201/0233 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/0307 , Y10T428/12472 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.
摘要翻译：集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。柔韧的材料将球与芯片和衬底的焊盘可动地接触。由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

3. 发明授权

US06177729B1 Rolling ball connector 失效
标题翻译：滚球连接器
公开(公告)号：US06177729B1
公开(公告)日：2001-01-23
申请号：US09303290
申请日：1999-04-03
申请人： Joseph A. Benenati , Claude L. Bertin , William T. Chen , Thomas E. Dinan , Wayne F. Ellis , Wayne J. Howell , John U. Knickerbocker , Mark V. Pierson , William R. Tonti , Jerzy M. Zalesinski
发明人： Joseph A. Benenati , Claude L. Bertin , William T. Chen , Thomas E. Dinan , Wayne F. Ellis , Wayne J. Howell , John U. Knickerbocker , Mark V. Pierson , William R. Tonti , Jerzy M. Zalesinski
IPC分类号： H01L2348
CPC分类号： H01L24/16 , G01R1/0483 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/83 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/1319 , H01L2224/17051 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H05K1/111 , H05K3/321 , H05K2201/0133 , H05K2201/0212 , H05K2201/0221 , H05K2201/0233 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/0307 , Y10T428/12472 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.
摘要翻译：集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。柔韧的材料将球与芯片和衬底的焊盘可动地接触。由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

4. 发明申请

US20130015440A1 INTEGRATED CIRCUIT (IC) TEST PROBE 有权
标题翻译：集成电路（IC）测试探针
公开(公告)号：US20130015440A1
公开(公告)日：2013-01-17
申请号：US13179868
申请日：2011-07-11
申请人： Bing Dang , John U. Knickerbocker , Yang Liu
发明人： Bing Dang , John U. Knickerbocker , Yang Liu
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/481 , G01R1/06761 , G01R1/07314 , G01R3/00 , H01L21/76898 , H01L2924/0002 , H01L2924/00
摘要： A test probe head for probing integrated circuit (IC) chips and method of making test heads. The test head includes an array of vias (e.g., annular vias or grouped rectangular vias) through, and exiting one surface of, a semiconductor layer, e.g., a silicon layer. The vias, individual test probe tips, may be on a pitch at or less than fifty microns (50 μm). The probe tips may be stiffened with SiO2 (and optionally silicon) extending along the sidewalls. A redistribution layer connects individual test probe tips externally. The probe tips may be capped with a hardening cap that also caps stiffening SiO2 and silicon along the tip sidewall.
摘要翻译：用于探测集成电路（IC）芯片的测试头和制造测试头的方法。测试头包括穿过半导体层（例如硅层）并离开半导体层（例如硅层）的一个表面的通孔阵列（例如，环形通孔或分组的矩形通孔）。通孔，单独的测试探针尖端可以在等于或小于50微米（50μm）的间距上。探针尖端可以用沿着侧壁延伸的SiO 2（和任选的硅）加强。再分配层外部连接各个测试探针。探针尖端可以用硬化帽盖住，硬化帽也可以沿着尖端侧壁封闭加强SiO 2和硅。

5. 发明授权

US08227264B2 Reworkable electronic device assembly and method 有权
标题翻译：可再生电子装置组装及方法
公开(公告)号：US08227264B2
公开(公告)日：2012-07-24
申请号：US13071894
申请日：2011-03-25
申请人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
发明人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
IPC分类号： H01L21/30
CPC分类号： H01L23/49827 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/00 , H01L2224/05552
摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.
摘要翻译：提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

6. 发明授权

US07936060B2 Reworkable electronic device assembly and method 有权
标题翻译：可再生电子装置组装及方法
公开(公告)号：US07936060B2
公开(公告)日：2011-05-03
申请号：US12431827
申请日：2009-04-29
申请人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
发明人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
IPC分类号： H01L23/52
CPC分类号： H01L23/49827 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/00 , H01L2224/05552
摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.
摘要翻译：提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

7. 发明授权

US07836353B2 Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing 有权
标题翻译：通过减少热点脉冲的影响来提高微C4可靠性的方法
公开(公告)号：US07836353B2
公开(公告)日：2010-11-16
申请号：US11745172
申请日：2007-05-07
申请人： John U. Knickerbocker , Gerard McVicker , Sri M. Sri-Jayantha
发明人： John U. Knickerbocker , Gerard McVicker , Sri M. Sri-Jayantha
IPC分类号： G06F11/00
CPC分类号： G06F1/206
摘要： A system for reducing an impact of hot spot pulsing of a semiconductor device including: first generating means for generating a plurality of local op-codes; a sequencer for augmenting customer op-codes with the plurality of local op-codes; selecting means for selecting one or more of the randomly arriving customer op-codes awaiting execution; monitoring means for tracking which of the one or more randomly arriving customer op-codes have been selected; separating means for separating the plurality of local op-codes from the one or more customer op-codes; storing means for storing one or more data related to the processing of the plurality of local op-codes and the customer op-codes; and second generating means for generating an output for a customer corresponding to that customer op-code while gainfully employing an output generated by local op-codes for system health monitoring purpose.
摘要翻译：一种用于减少半导体器件的热点脉冲的影响的系统，包括：第一产生装置，用于产生多个本地操作码; 用于使用所述多个本地操作码增强客户操作码的定序器; 选择装置，用于选择等待执行的随机到达的客户操作码中的一个或多个; 用于跟踪所选择的一个或多个随机到达的客户操作代码中的哪一个的监视装置; 分离装置，用于从所述一个或多个客户操作码中分离所述多个本地操作码; 存储装置，用于存储与多个本地操作码和客户操作码的处理相关的一个或多个数据; 以及第二生成装置，用于在增益地采用由本地操作码产生的输出用于系统健康监视目的的同时，生成与该客户操作码对应的客户的输出。

8. 发明授权

US07791168B2 Techniques for providing decoupling capacitance 有权
标题翻译：提供去耦电容的技术
公开(公告)号：US07791168B2
公开(公告)日：2010-09-07
申请号：US11930698
申请日：2007-10-31
申请人： Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
发明人： Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
IPC分类号： H01L29/00 , H01L23/52 , H01L23/04 , H01L23/053
CPC分类号： H01L23/49827 , H01L23/49822 , H01L23/50 , H01L23/5382 , H01L2224/16225 , H01L2224/16235 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01078 , H01L2924/15311
摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device includes at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device including at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein includes the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
摘要翻译：提供电子器件制造技术。一方面，提供一种电子设备。电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。在另一方面，一种制造电子器件的方法包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其中包括以下步骤。选择性地去激活多个去耦电容器中的一个或多个。

9. 发明授权

US07784673B2 Rotational fill techniques for injection molding of solder 失效
标题翻译：用于注射成型焊料的旋转填充技术
公开(公告)号：US07784673B2
公开(公告)日：2010-08-31
申请号：US12189388
申请日：2008-08-11
申请人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。该方法包括将填充头与非矩形模具对准。非矩形模具包括多个空腔。填充头被放置成与非矩形模具基本接触。旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。将导电接合材料从填充头推向非矩形模具。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

10. 发明授权

US07691669B2 Techniques for providing decoupling capacitance 失效
标题翻译：提供去耦电容的技术
公开(公告)号：US07691669B2
公开(公告)日：2010-04-06
申请号：US12056852
申请日：2008-03-27
申请人： Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
发明人： Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/8242
CPC分类号： H01L23/49827 , H01L23/49822 , H01L23/50 , H01L23/5382 , H01L2224/16225 , H01L2224/16235 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01078 , H01L2924/15311
摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
摘要翻译：提供电子器件制造技术。一方面，提供一种电子设备。电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。选择性地去激活多个去耦电容器中的一个或多个。

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