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    • 1. 发明授权
    • Systems and methods for measuring the specific modulus of cellular ceramic bodies
    • 用于测量细胞陶瓷体的比模量的系统和方法
    • US08074518B2
    • 2011-12-13
    • US12197429
    • 2008-08-25
    • John David HelfinstineRobert A McIntoshLisa M NoniZhiqiang ShiSujanto WidjajaDavid John Worthey
    • John David HelfinstineRobert A McIntoshLisa M NoniZhiqiang ShiSujanto WidjajaDavid John Worthey
    • G01N29/07
    • G01H5/00
    • Systems (50) and methods for measuring and displaying a visual and/or graphical representation of the specific modulus (E/ρ) of a cellular ceramic body (10), such as those used to form particulate filters, are disclosed. The ultrasonic measurement system employs an ultrasonic transmitter (52T) and an ultrasonic receiver (52R) adjacent to, but spaced apart from respective ends (16, 18) of the ceramic body. Multiple ultrasonic waves (80) are sent through corresponding multiple longitudinal portions (12P) of the honeycomb structure (12), where adjacent longitudinal portions overlap. Time of flight (TOF) measurements (TOF1, TOF2), along with other parameters describing the ceramic body, allow for the measurement of the sonic speed (cmat) of the ultrasonic waves that pass through the ceramic body as well as the attenuation (IR). The specific modulus is then calculated from the square of the sonic speed (C2mat). The high resolution of the ultrasonic measurements allows for improved evaluation of the manufacturing process.
    • 公开了用于测量和显示细胞陶瓷体(10)的比模量(E /&rgr)的视觉和/或图形表示的系统(50)和方法,例如用于形成微粒过滤器的那些。 超声波测量系统采用与陶瓷体的相应端部(16,18)相邻但间隔开的超声波发射器(52T)和超声波接收器(52R)。 多个超声波(80)通过蜂窝结构(12)的相应的多个纵向部分(12P)发送,其中相邻的纵向部分重叠。 飞行时间(TOF1,TOF2)以及描述陶瓷体的其他参数允许测量通过陶瓷体的超声波的声速(cmat)以及衰减(IR )。 然后根据声速(C2mat)的平方来计算比模量。 超声波测量的高分辨率允许改进制造过程的评估。
    • 2. 发明申请
    • SYSTEMS AND METHODS FOR MEASURING THE SPECIFIC MODULUS OF CELLULAR CERAMIC BODIES
    • 用于测量细胞陶瓷体的特定模量的系统和方法
    • US20100043556A1
    • 2010-02-25
    • US12197429
    • 2008-08-25
    • John David HelfinstineRobert A. McIntoshLisa M. NoniZhiqiang ShiSujanto WidjajaDavid John Worthey
    • John David HelfinstineRobert A. McIntoshLisa M. NoniZhiqiang ShiSujanto WidjajaDavid John Worthey
    • G01H5/00
    • G01H5/00
    • Systems (50) and methods for measuring and displaying a visual and/or graphical representation of the specific modulus (E/ρ) of a cellular ceramic body (10), such as those used to form particulate filters, are disclosed. The ultrasonic measurement system employs an ultrasonic transmitter (52T) and an ultrasonic receiver (52R) adjacent to, but spaced apart from respective ends (16, 18) of the ceramic body. Multiple ultrasonic waves (80) are sent through corresponding multiple longitudinal portions (12P) of the honeycomb structure (12), where adjacent longitudinal portions overlap. Time of flight (TOF) measurements (TOF1, TOF2), along with other parameters describing the ceramic body, allow for the measurement of the sonic speed (cmat) of the ultrasonic waves that pass through the ceramic body as well as the attenuation (IR). The specific modulus is then calculated from the square of the sonic speed (C2mat). The high resolution of the ultrasonic measurements allows for improved evaluation of the manufacturing process.
    • 公开了用于测量和显示细胞陶瓷体(10)的比模量(E /&rgr)的视觉和/或图形表示的系统(50)和方法,例如用于形成微粒过滤器的那些。 超声波测量系统采用与陶瓷体的相应端部(16,18)相邻但间隔开的超声波发射器(52T)和超声波接收器(52R)。 多个超声波(80)通过蜂窝结构(12)的相应的多个纵向部分(12P)发送,其中相邻的纵向部分重叠。 飞行时间(TOF1,TOF2)以及描述陶瓷体的其他参数允许测量通过陶瓷体的超声波的声速(cmat)以及衰减(IR )。 然后根据声速(C2mat)的平方来计算比模量。 超声波测量的高分辨率允许改进制造过程的评估。
    • 5. 发明申请
    • BEZEL PACKAGING FOR SEALED GLASS ASSEMBLIES AND A GLASS ASSEMBLY THEREFOR
    • 密封玻璃组件的贝类包装及其玻璃组件
    • US20110019351A1
    • 2011-01-27
    • US12922987
    • 2009-03-30
    • John Frederick BayneYabei GuGlenn Vertner MorganButchi Reddy VaddiJamie Todd WestbrookSujanto Widjaja
    • John Frederick BayneYabei GuGlenn Vertner MorganButchi Reddy VaddiJamie Todd WestbrookSujanto Widjaja
    • H05K7/00H01J5/02
    • G02F1/133308F21Y2105/00F21Y2115/15H01L51/5237
    • Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.
    • 与密封玻璃组件的框架或边框包装相关的方法和组件,例如适合密封的OLED装置,例如OLED显示面板。 框架或边框包装可以具有(a)圆形或倒角的一个或多个,(a)盖,(b)加强的引线边缘,(c)后面板中的开口或切口以节省材料并减轻边框 ,和(d)在密封的玻璃组件和框架或表圈的背面和/或侧面之间施加低弹性材料材料的吸震中间层。 框架或边框设计可以包括密封的玻璃组件和边框的后面板之间的间隙。 间隙可以至少部分地用低弹性背衬材料填充。 玻璃包装可以具有一个或多个(a)圆形或倒角,(b)圆形或倒角边缘,(c)围绕其周边或其周边部分施加的低弹性材料,例如仅在拐角上 ,(d)缩短的引线端,(e)增厚的引线端。
    • 6. 发明授权
    • Bezel packaging of frit-sealed OLED devices
    • 玻璃料密封OLED器件的边框包装
    • US07786559B2
    • 2010-08-31
    • US11594487
    • 2006-11-08
    • John F BayneJamie T WestbrookSujanto Widjaja
    • John F BayneJamie T WestbrookSujanto Widjaja
    • H01L21/00
    • B65D81/05C03C27/048H01L51/5237
    • Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.
    • 方法和组件涉及密封玻璃组件的边框包装,例如玻璃料密封的OLED装置。 表圈包装包括施加在密封玻璃组件和表圈之间的低弹性材料材料的减震中间层。 可以包括低弹性模量材料和/或单独的粘合材料的粘合剂将密封的玻璃组件固定在边框上。 可以进行挡板修改以使挡板稳定。 示例性的边框修改包括加强的边框侧壁和附接在边框壁之间的支撑带。 边框设计可以包括密封玻璃组件的边缘与边框壁之间的间隙,以避免与其直接接触。 间隙可以至少部分地由低弹性有机粘合剂填充以提供额外的冲击吸收性。 低弹性材料材料可以包括泡沫,陶瓷纤维布和/或低弹性聚合物有机涂层。