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1. 发明申请

US20030042910A1 Method and circuit for electrical testing of isolation resistance of large capacitance network 有权
标题翻译：大电容网络隔离电阻电气测试方法及电路
公开(公告)号：US20030042910A1
公开(公告)日：2003-03-06
申请号：US09942292
申请日：2001-08-29
申请人： International Business Machines, Corporation
发明人： Harsaran S. Bhatia , David C. Long , Kathleen M. Wiley
IPC分类号： H01H031/02
CPC分类号： G01R31/1227 , G01R31/028
摘要： An apparatus (and method) for testing a DC isolation resistance of a large capacitance network experiencing voltage stress, adds capacitance and resistance to a large resistance network under test, such that the direct current (DC) isolation resistance may be determined without distortion from the alternating current (AC) components of the circuit. The capacitance that is added is determined based on the capacitance of the object, the resistance of the object, and the resistance of the testing apparatus. In one embodiment, because the precise capacitance of the network under test may be unknown, the testing apparatus and method may utilize an additional large capacitor designed to obviate small fluctuations in the capacitance of the network.
摘要翻译：用于测试经历电压应力的大电容网络的直流隔离电阻的装置（和方法）为测试中的大电阻网络增加了电容和电阻，使得可以确定直流（DC）隔离电阻而不会从电路的交流（AC）元件。基于对象的电容，物体的电阻和测试装置的电阻确定所添加的电容。在一个实施例中，由于被测网络的精确电容可能是未知的，所以测试装置和方法可以利用设计成消除网络电容的小波动的附加大电容器。

2. 发明申请

US20030047352A1 SUBSTRATE DESIGN OF A CHIP USING A GENERIC SUBSTRATE DESIGN 失效
标题翻译：使用一般基板设计的芯片的基板设计
公开(公告)号：US20030047352A1
公开(公告)日：2003-03-13
申请号：US09948432
申请日：2001-09-07
申请人： International Business Machines Corporation
发明人： Harsaran S. Bhatia , Raymond M. Bryant , Suresh Kadakia , David C. Long , Paul R. Walling
IPC分类号： H05K001/16
CPC分类号： H01L23/5382 , H01L2224/16 , H01L2224/16235 , H01L2924/15174 , H01L2924/15312 , H05K1/0287 , H05K1/0298 , H05K1/0306 , H05K2203/061
摘要： A method of substrate design of an multilayer ceramic module that uses menu die of the same size is provided. One of these menu die provides a nullgenericnull substrate design having internal wiring with greatest number of input/output (I/O) signal leads of all the dice available. Middle (redistribution) layers include electrical interconnections for both power and the I/O signal lead wires between the dice interface terminals and a bottom surface metallurgy (BSM) layer that has electrical connector pads by use of a customization layer.
摘要翻译：提供了使用相同尺寸的菜单模具的多层陶瓷模块的基板设计方法。这些菜单芯片中的一个提供了具有内部布线的“通用”基板设计，其具有可用的所有骰子的最大数量的输入/输出（I / O）信号引线。中间（再分布）层包括电源和电子接口端子之间的I / O信号引线的电互连以及通过使用定制层具有电连接器焊盘的底表面冶金（BSM）层。

3. 发明申请

US20020043556A1 Low-cost high-density gang-punch 审中-公开
标题翻译：低成本高密度组合冲孔
公开(公告)号：US20020043556A1
公开(公告)日：2002-04-18
申请号：US09837643
申请日：2001-04-18
申请人： International Business Machines Corporation
发明人： Mark J. LaPlante , James G. Balz , Ferdinand D. DiMaria , John U. Knickerbocker , David C. Long , Thomas Weiss , Robert P. Westerfield JR.
IPC分类号： B26F001/14
CPC分类号： B26F1/04 , B26F2210/08 , H05K1/0306 , H05K3/005 , Y10T83/04 , Y10T83/8727 , Y10T83/883 , Y10T83/943
摘要： A gang-punch pin apparatus for punching selected hole patterns in thin sheet materials such as greensheets is provided. The gang-punch pin apparatus uses program plates in the punch apparatus which plates are positioned intermediate the non-punching end of the punch pins and a clearance plate wherein punch pins not used for punching a particular layer of the MLC are retracted into during punching. At the other punch pin locations, the punch pins, upon activation of the punch apparatus by compressing an expandable chamber, usually by application of a force on the punch apparatus, are extended through the lower portion of the punch apparatus to form vias in a greensheet. A die apparatus is also provided for use with the punch assembly to form the vias and to remove the punched material (slugs) from the die apparatus. The gang punch-pin may be shorter than conventional pins and be made at a low cost because of the thin sheet metal plates preferably used to make the component parts of the punch and die apparatus.
摘要翻译：提供了一种用于冲压薄片材料如绿叶片中的选定孔图案的组合打孔针装置。组合打孔针装置使用打孔装置中的程序板，其中板位于冲头销的非冲孔端之间，间隙板，其中不用于冲压MLC的特定层的冲头不会在冲压期间缩回。在另一冲头销位置，通常通过在冲压装置上施加力来压缩可膨胀室而使冲压装置激活时，冲头穿过冲头装置的下部，以形成毛坯中的通孔。还提供了一种模具设备，用于与冲头组件一起使用以形成通孔并且将冲压材料（芯棒）从模具设备移除。由于薄板金属板优选用于制造冲头和模具装置的组成部件，所以组合打孔销可能比传统的销子更短，并且制造成本低。

4. 发明申请

US20040002233A1 Method of assembling an interconnect device assembly and apparatus therefor 失效
标题翻译：组装互连器件组件的方法及其装置
公开(公告)号：US20040002233A1
公开(公告)日：2004-01-01
申请号：US10187081
申请日：2002-06-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Gerald G. Advocate JR. , Norman D. Curry , Francis Krug , David C. Long , Daniel O'Connor , Charles Hampton Perry , Robert Weiss
IPC分类号： H01R012/00
CPC分类号： H01R12/714 , Y10T29/49117 , Y10T29/49204 , Y10T29/49222
摘要： A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.
摘要翻译：一种组装互连器件组件的方法，该器件组件由在载体内捕获的圆柱形弹性线束组成。在该方法的一个步骤中，互连装置组件被放置在固定装置中，并且弹性线束的端部通过在夹具中成形模具而变形，使得弹性线束现在具有狗骨形状。弹性线束的狗骨形状防止弹性线束在处理和运输过程中部分或完全脱落。

5. 发明申请

US20020029670A1 GANG PUNCH TOOL ASSEMBLY 失效
标题翻译： GANG PUNCH工具组装
公开(公告)号：US20020029670A1
公开(公告)日：2002-03-14
申请号：US09906199
申请日：2001-07-16
申请人： International Business Machines Corporation
发明人： David C. Long , John U. Knickerbocker , Mark J. LaPlante , Thomas Weiss , Robert P. Westerfield JR.
IPC分类号： B26F001/02
CPC分类号： B26D7/26 , B26F1/02 , B26F2210/08 , H05K1/0306 , H05K3/005 , Y10T83/04 , Y10T83/0448 , Y10T83/0481 , Y10T83/857 , Y10T83/8699 , Y10T83/8828 , Y10T83/8835 , Y10T83/8845 , Y10T83/8855
摘要： A gang punch tool assembly and method is provided for punching holes in a plurality of greensheets which are processed sequentially through the assembly. The punch mechanism is a gang punch cooperating with a corresponding die and the greensheet is automatically fed to the gang punch and die, the greensheet punched and then the punched greensheet removed from the punch area and another greensheet positioned for punching. Operation of the gang punch apparatus is efficient and effective and has a high greensheet throughput. A preferred gang punch uses a pressurizable air chamber for controlling punching of the greensheet without damage to the greensheets or gang punch mechanism.
摘要翻译：提供了一种组合冲孔工具组合件和方法，用于对多个通过组件顺序处理的多个刮板中的孔进行冲孔。冲头机构是与相应的模具配合的组合冲头，并且毛坯自动进给组合冲头和模具，冲切毛坯，然后将冲孔毛坯从冲头区域移除，另一个毛坯定位用于冲压。组合打孔装置的操作是高效和有效的并且具有高的毛坯生产量。优选的组合冲头使用可加压空气室来控制毛坯的冲压而不损坏刮板或组合冲头机构。

6. 发明申请

US20040187303A1 Selective plating using dual lift-off mask 失效
标题翻译：使用双重剥离面罩进行选择性电镀
公开(公告)号：US20040187303A1
公开(公告)日：2004-09-30
申请号：US10249305
申请日：2003-03-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Mark J. LaPlante , Jon A. Casey , Thomas A. Wassick , David C. Long , Krystyna W. Semkow , Patrick E. Spencer , Robert A. Rita , Richard F. Indyk , Kathleen M. Wiley , Brian R. Sundlof , James Balz , Lori A. Maiorino , Donald R. Wall , Glenn A. Pomerantz
IPC分类号： H01R043/00 , H05K003/36
CPC分类号： H05K3/242 , H05K1/0306 , H05K3/0035 , H05K3/048 , H05K3/184 , H05K3/225 , H05K2203/0191 , H05K2203/0264 , H05K2203/0574 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49163 , Y10T29/49165 , Y10T29/49171 , Y10T29/49172 , Y10T29/49721 , Y10T29/49732 , Y10T29/49737 , Y10T29/49746
摘要： A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.
摘要翻译：在基板上形成表面电镀金属化的方法和结构。将两层胶带施加到基材的表面。通过暴露衬底表面的两层带切割第一路径。第一路径在衬底的顶表面上连接至少一个导电通孔。通过暴露第一层胶带的第二层胶带切割第二条路径。第二路径从第一路径路由到衬底的边缘。种子层沉积在第二层带的表面上，从而在第一路径中形成种子电镀路径，并在第二路径中形成牺牲种子传导路径。将牺牲种子传导路径连接到衬底边缘处的电镀电位在衬底的表面上产生电镀路径。去除胶带时，去除牺牲路径。

7. 发明申请

US20040113721A1 MLC frequency selective circuit structures 失效
公开(公告)号：US20040113721A1
公开(公告)日：2004-06-17
申请号：US10318933
申请日：2002-12-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Harsaran S. Bhatia , Harvey C. Hamel , David C. Long , Edward R. Pillai , Christopher D. Setzer , Benjamin P. Tongue
IPC分类号： H03H007/01
CPC分类号： H01L23/66 , H01L23/15 , H01L23/49822 , H01L23/5227 , H01L2224/16 , H01L2924/00014 , H01L2924/1423 , H01L2924/3011 , H03H7/0115 , H03H2210/012 , H01L2224/0401
摘要： MLC (multilayer ceramic) frequency selective circuit structures are disclosed. The MLC frequency selective circuit structures have a solenoid and toroid coil geometry in a multilayer electronic package which functions as a frequency selective tuned circuit in which both the number of turns and the aspect ratio of the solenoid coil are selected to adjust the tuned frequency. In some embodiments, a plurality of such coils can be connected together to provide a selected bandwidth about a tuned center frequency.

8. 发明申请

US20040148765A1 Electronic package repair process 失效
标题翻译：电子封装修复过程
公开(公告)号：US20040148765A1
公开(公告)日：2004-08-05
申请号：US10358431
申请日：2003-02-04
申请人： International Business Machines Corporation
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
IPC分类号： H01L021/00
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译：一种多层陶瓷修复工艺，提供了一种新的电气修复路径，以连接顶部表面通孔。修复路径是建立在有缺陷的网和包含在多层陶瓷基板内的冗余修复网之间。有缺陷的网和修复网各自终止在基板的表面通孔处。使用激光器在基板上和基板上形成点火电路。之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。

9. 发明申请

US20030131700A1 Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool 失效
标题翻译：模具用一次性钼模板和改进的窗板用于通用组合冲压工具
公开(公告)号：US20030131700A1
公开(公告)日：2003-07-17
申请号：US10045832
申请日：2002-01-11
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： James G. Balz , Mark J. LaPlante , David C. Long , Thomas Weiss
IPC分类号： B26D001/00
CPC分类号： H05K3/005 , B26D7/1863 , B26F1/14 , B26F2210/08 , Y10T83/04 , Y10T83/883 , Y10T83/943 , Y10T83/9476
摘要： A die and method of gang punching selective holes in thin sheet materials such as greensheets are provided in which slugs of greensheet material formed during the punching operation easily fall through the die and are removed. The die uses a number of plates one of which is a window plate having openings correspond to openings in a die plate disposed thereon. The window plate openings have a larger diameter than the die plate openings and also a plurality have an oval shape which oval shape openings provide less resistance to the falling slugs and facilitate removal of the slugs from the die. The window plate also preferably has a central grid open area with the remainder of the plate having vertical through-holes corresponding to the through-holes of the die plate. The die also preferably employs a die plate made from at least two sheets of material, i.e., an upper disposable sheet (die plate) and a lower sheet (sub-die plate) wherein the upper die plate is made from a wear-resistant material such as molybdenum. The upper die plate is preferably made by photolithography techniques.
摘要翻译：提供了一种在薄片材料如毛坯中冲孔选择性孔的模具和方法，其中在冲压操作期间形成的毛坯材料块在模具中容易地落下并被去除。模具使用多个板，其中一个板是具有对应于其上设置的模板中的开口的开口的窗板。窗板开口具有比模板开口更大的直径，并且多个具有椭圆形形状，椭圆形形状的开口对落下的块塞提供较小的阻力，并且有助于从模头移除块塞。窗板还优选地具有中央格栅开口区域，其余板的垂直通孔对应于模板的通孔。模具还优选采用由至少两片材料制成的模具板，即上部一次性片材（模具板）和下部片材（次模具板），其中上模板由耐磨材料制成如钼。上模板优选通过光刻技术制成。

10. 发明申请

US20020195228A1 Thermal enhanced extended surface tape for integrated circuit heat dissipation 审中-公开
标题翻译：热增强扩展表面胶带，用于集成电路散热
公开(公告)号：US20020195228A1
公开(公告)日：2002-12-26
申请号：US09876508
申请日：2001-06-07
申请人： International Business Machines Corporation
发明人： William D. Corti , David C. Long , Joseph O. Marsh , Franics X. Scanzano , Michael Won , Tsorng-Dih Yuan
IPC分类号： F28F007/00
CPC分类号： H01L23/3672 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： A thermal conductive tape article is provided which is adhered to the surface of an integrated circuit device to dissipate heat from the device. The thermal conductive tape article is preferably corrugated and may have a number of configurations providing an expanded surface area. The corrugated tape article may also have a metal strip bonded to one or both sides of the tape article to form a single-faced or double-faced corrugated tape article. The tape article is preferably made of copper or aluminum.
摘要翻译：提供了一种粘合到集成电路器件表面以散发来自器件的热量的导热带制品。导热带制品优选是波纹状的，并且可以具有提供扩展表面积的许多构造。波纹带制品还可以具有粘合到带制品的一侧或两侧的金属条，以形成单面或双面波纹带制品。带状物优选由铜或铝制成。

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