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    • 2. 发明申请
    • Method of isolating semiconductor laser diodes
    • 隔离半导体激光二极管的方法
    • US20090155939A1
    • 2009-06-18
    • US12149313
    • 2008-04-30
    • Youn Joon SUNGSu Hee CHAE
    • Youn Joon SUNGSu Hee CHAE
    • H01L21/304
    • H01S5/0201H01S5/0203
    • Provided is a method of isolating semiconductor laser diodes (LDs), the method including the steps of: preparing a substrate; forming a plurality of semiconductor LDs on the substrate, each semiconductor LD including an n-type semiconductor layer, an active layer, a p-type semiconductor layer, an n-electrode, a ridge portion, and a p-electrode, the ridge portion being formed by etching the p-type semiconductor layer such that a portion of the p-type semiconductor layer protrudes, the p-electrode being formed on the ridge portion; partially forming base cut lines on the surface of the substrate excluding the ridge portions; and isolating the semiconductor LDs into a bar shape along the base cut lines.
    • 提供一种隔离半导体激光二极管(LD)的方法,该方法包括以下步骤:制备衬底; 在基板上形成多个半导体LD,每个半导体LD包括n型半导体层,有源层,p型半导体层,n电极,脊部分和p电极,脊部分 通过蚀刻p型半导体层而形成,使得p型半导体层的一部分突出,p电极形成在脊部上; 在除了脊部之外的基板的表面上部分地形成基切割线; 并且将半导体LD沿基底切割线隔离成棒状。