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    • 3. 发明申请
    • MASKING METHOD USED IN SURFACE TREATING PROCESS
    • 在表面处理工艺中使用的掩模方法
    • US20140186534A1
    • 2014-07-03
    • US14018821
    • 2013-09-05
    • HON HAI PRECISION INDUSTRY CO., LTD.
    • CHANG-CHIN WUPEI-RONG SHIEH
    • B05C21/00
    • C25D11/022B05B12/26C23C18/1605C25D5/022
    • A masking method for a surface treating process provides an injector filled with infilling material and injecting the infilling material in holes having any shape or size or irregularity in a workpiece. The infilling material is cured to form a protective plug in the hole. The infilling material includes resin resistant to the surface treating process. The infilling material overfills the hole and partly protrudes out from the hole. The protective plug adheres to every inner surface of the hole to protect the inner surfaces of the hole from the surface treating process. Gripping and pulling on the partial protrusion of the protective plugs, that are formed from the cured resin, from the hole elastically reduces the original girth or diameter of the infilling material in the hole to allow easier physical removal.
    • 用于表面处理工艺的掩模方法提供了填充有填充材料的注射器,并将填充材料注入到工件中具有任何形状或尺寸或不规则性的孔中。 填充材料被固化以在孔中形成保护塞。 填充材料包括耐表面处理工艺的树脂。 填充材料过度填充孔,并从孔中部分地突出。 保护塞粘附到孔的每个内表面,以保护孔的内表面免受表面处理过程。 从孔中夹持和拉动由固化树脂形成的保护塞的部分突起弹性地减小孔中的填充材料的原始环形或直径,以允许更容易的物理去除。
    • 4. 发明申请
    • ADHESIVE TAPE
    • 胶粘带
    • US20140308515A1
    • 2014-10-16
    • US13942702
    • 2013-07-16
    • HON HAI PRECISION INDUSTRY CO., LTD.
    • MING-JEN CHANGCHANG-CHIN WU
    • H01L21/683
    • C09J7/20C09J2201/128C09J2205/31Y10T428/2848
    • An adhesive tape is disclosed. The adhesive tape includes a base layer made of light guide materials, a first adhesive layer, and a second adhesive layer. The base layer is positioned and bonded between the first adhesive layer and the second adhesive layer. In use, a first workpiece is adhered to the first adhesive layer, and a second workpiece is adhered to the second adhesive layer. When the first workpiece is required to delaminate, depart or removed from the second workpiece, even if the first workpiece and the second workpiece are made of non-transparent or opaque materials, light can enter the base layer from and through the incident surface, and then emits out from the two emitting surfaces. Thus, the first workpiece can be easily removed from the second workpiece due to the UV deactivation of adhesiveness of the adhesive layer through the incident surface of the base layer.
    • 公开了一种胶带。 胶带包括由导光材料制成的基层,第一粘合剂层和第二粘合剂层。 基层定位并结合在第一粘合剂层和第二粘合剂层之间。 在使用中,第一工件粘附到第一粘合剂层,并且第二工件粘附到第二粘合剂层。 当第一工件需要从第二工件分层,分离或移除时,即使第一工件和第二工件由不透明或不透明的材料制成,光可以从入射表面进入基底层,并且通过入射表面, 然后从两个发射表面发出。 因此,由于粘合剂层通过基层的入射表面的粘附性UV而使第一工件能够容易地从第二工件移除。
    • 8. 发明申请
    • TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING SAME
    • 触摸屏面板及其制造方法
    • US20150077946A1
    • 2015-03-19
    • US14482138
    • 2014-09-10
    • HON HAI PRECISION INDUSTRY CO., LTD.
    • CHANG-CHIN WUTEN-HSING JAWCHIN-YANG WU
    • H05K7/02H05K3/12G06F3/0354G06F3/044
    • G06F3/03547G06F3/044G06F2203/04103H05K1/189H05K2201/10128Y10T29/49147
    • A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.
    • 一玻璃溶液触摸屏面板包括基板,屏蔽层,氧化铟锡膜层,软电路板,渗透层和多个导电连接器。 屏蔽层形成在基板的第一部分上。 氧化铟锡膜层形成在基板的第二部分上并具有多个氧化铟锡膜连接部分。 软电路板形成在屏蔽层上。 渗透层形成在连接部分上,并且在渗透层内限定多个渗透间隙。 导电连接器形成在渗透层上。 导电连接器电连接到软电路板。 导电连接器延伸到渗透层中,基本上填充多个渗透间隙的大部分并且电连接到连接部分。