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1. 发明授权

US4934044A Wiring method and apparatus for electronic circuit boards or the like 失效
标题翻译：电子电路板等的接线方法和装置
公开(公告)号：US4934044A
公开(公告)日：1990-06-19
申请号：US283376
申请日：1988-12-12
申请人： Hiroshi Hasegawa , Toshiyuki Amimoto , Mitsukiyo Tani
发明人： Hiroshi Hasegawa , Toshiyuki Amimoto , Mitsukiyo Tani
IPC分类号： H01R43/00 , H01B13/012 , H05K3/22 , H05K7/06 , H05K13/06
CPC分类号： H05K3/222 , H05K13/06 , H05K7/06 , Y10T156/1002 , Y10T156/1007 , Y10T29/49162 , Y10T29/49167 , Y10T29/49169
摘要： A method for wiring an electronic device including a plurality of electronic components and a plurality of connector elements for interconnecting the plurality of electronic components, the connector elements being arranged on the same plane in spaced relation to each other so as to define passages includes a number of steps. A first discrete line is connected to a surface of a first connector element such that the first discrete line extends on a first passage extending along the first connector element. Two pins are positioned along the first passage, substantially perpendicular thereto. The first discrete line is bent along the two pins, a distance between the at least two pins is then reduced, and the at least two pins are then moved away from the first passage. Similar, steps can be used to provide multiple discrete line between two connector elements or along the same passage between different connector elements.

2. 发明授权

US4875618A Wire stacked bonding method 失效
标题翻译：线堆叠焊接法
公开(公告)号：US4875618A
公开(公告)日：1989-10-24
申请号：US112943
申请日：1987-10-27
申请人： Hiroshi Hasegawa , Koichi Sugimoto , Takeshi Yano , Tositada Netsu , Mitsukiyo Tani , Tosaku Kojima
发明人： Hiroshi Hasegawa , Koichi Sugimoto , Takeshi Yano , Tositada Netsu , Mitsukiyo Tani , Tosaku Kojima
IPC分类号： H01L21/60 , B23K20/00 , H01L21/607 , H01L23/538 , H01R4/02
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/49 , H01L24/78 , H01R4/02 , H01L2224/05553 , H01L2224/48095 , H01L2224/48463 , H01L2224/4847 , H01L2224/48477 , H01L2224/49111 , H01L2224/4942 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/01033 , H01L2924/01082 , H01L2924/014
摘要： The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad area is very small.
摘要翻译：本发明涉及细线的接合，更具体地说，涉及一种适用于连接狭窄区域内的多根电线的引线接合方法。第一线被焊接在焊盘上，并且第二线接合在已经接合第一线的位置。通过以上述类似的方式将导线堆叠和接合，进行后续导线的接合。因此，即使焊盘区域非常小，也可以在一个焊盘内结合多个修复线。

3. 发明授权

US5251805A Wire bonding method and apparatus 失效
标题翻译：引线接合方法和装置
公开(公告)号：US5251805A
公开(公告)日：1993-10-12
申请号：US751143
申请日：1991-08-28
申请人： Mitsukiyo Tani , Akira Gotoh , Hideaki Sasaki , Hideo Shiraishi , Tamotu Kirino , Hiroshi Hasegawa
发明人： Mitsukiyo Tani , Akira Gotoh , Hideaki Sasaki , Hideo Shiraishi , Tamotu Kirino , Hiroshi Hasegawa
IPC分类号： H01L21/603 , B23K20/10 , H01L21/00 , H01L21/60 , H01R43/02 , B23K31/02 , H01L21/607
CPC分类号： H01L24/85 , B23K20/10 , H01L24/48 , H01L24/78 , H01R43/0207 , H01L2224/45015 , H01L2224/48095 , H01L2224/48464 , H01L2224/78313 , H01L2224/85009 , H01L2224/85148 , H01L2224/85191 , H01L2224/85205 , H01L2924/00014 , H01L2924/0102 , H01L2924/01033 , H01L2924/01039 , H01L2924/01068 , H01L2924/01072 , H01L2924/01075 , H01L2924/01082 , H01L2924/12042 , H01L2924/14
摘要： A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.
摘要翻译：一种用于焊接电线的引线接合方法和装置，其中至少一端形成有印刷电路板的球和焊盘。接合头向下慢慢向下移动以压碎球形成平坦的表面，并且将向上移动一次以调节垫和球的相对位置。接合头再次向下移动，并施加超声波以加热球和接合头，使得焊接球和焊盘。如果需要，通过支撑装置将待弯曲的线的一部分移动到布线板的期望位置。未焊接的线的自由端通过夹具移动以弯曲导线的部分以进行布线。

4. 发明授权

US4437603A Automatic wiring machine for printed circuit boards 失效
标题翻译：印刷电路板自动接线机
公开(公告)号：US4437603A
公开(公告)日：1984-03-20
申请号：US221458
申请日：1980-12-30
申请人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
发明人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
IPC分类号： G05B19/40 , G05B19/414 , H05K3/10 , H05K13/06
CPC分类号： H05K13/06 , G05B19/40 , G05B19/4142 , G05B2219/34239 , Y10T29/49162
摘要： A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.
摘要翻译：在布线图案的印刷电路板上自动布线作为布线图案的印刷电路板上的毛发的绝缘细线的机器被设置在相邻的要布线的导体印刷电路板之间，该XY台可在X和Y方向上移动，并且XY台根据配线位置移动。安装在XY工作台上方的线引导单元，接合单元和线切割器单元围绕垂直于XY工作台表面的轴可旋转地支撑的头部被旋转，以便在各个方向上被定向成光学支撑装置用于沿着键合头的旋转轴从上方对操作进行光学监视。导线单元顺序地将绝缘细线支撑到由XY工作台承载的印刷电路板上，接合单元暴露所付出的绝缘电线的芯并将导线熔接到印刷电路板的导体焊盘上通过加热和压下付出的电线，线切割器单元在接线完成之后切断电线。

5. 发明授权

US06350094B1 Bolt and a nut locking mechanism 失效
标题翻译：螺栓和螺母锁定机构
公开(公告)号：US06350094B1
公开(公告)日：2002-02-26
申请号：US09455376
申请日：1999-12-06
申请人： Takeji Shiokawa , Toshimitsu Nakagawa , Mitsukiyo Tani
发明人： Takeji Shiokawa , Toshimitsu Nakagawa , Mitsukiyo Tani
IPC分类号： F16B3932
CPC分类号： F16B39/32 , F16B39/04 , F16B39/24 , Y10S411/953
摘要： A present invention provides a locking mechanism capable of preventing a bolt from loosening. A bolt 5 has a head provided with a first part which comprises openings 511. A locking washer 4 is provided with a second part which includes outer projections 411 and a third part which includes insertion projections 401 on an outer edge. A taper piece 1 has a portion provided with a fourth part which comprises openings 105. The first part and the second part can engage with each other and the third part and the fourth part can engage with each other when said bolt 5 fastens at least two members 7 and 8 trough said washer 4 and said taper piece 1. Accordingly, the bolt 5 is prevented from rotating in an loosening direction.
摘要翻译：本发明提供一种能够防止螺栓松动的锁定机构。螺栓5具有设置有包括开口511的第一部分的头部。锁定垫圈4设置有包括外突出部411的第二部分和在外边缘上包括插入突起401的第三部分。锥形件1具有设置有包括开口105的第四部分的部分。第一部分和第二部分可以彼此接合，并且当所述螺栓5紧固至少两个时，第三部分和第四部分可以彼此接合构件7和8通过所述垫圈4和所述锥形件1。因此，防止螺栓5沿松动方向旋转。

6. 发明授权

US4460817A Resistance reflow soldering apparatus 失效
标题翻译：电阻回流焊接装置
公开(公告)号：US4460817A
公开(公告)日：1984-07-17
申请号：US387665
申请日：1982-06-11
申请人： Mitsukiyo Tani , Seiichi Kawashima
发明人： Mitsukiyo Tani , Seiichi Kawashima
IPC分类号： H05K3/34 , B23K1/00 , B23K3/00 , B23K3/04 , B23K1/12
CPC分类号： B23K3/00 , B23K1/0004
摘要： A small-sized light-weight resistance reflow soldering apparatus for modifying the wiring pattern on a printed circuit board, with the soldering apparatus including a heating device with an adjustable weight, a supporting mechanism for a vertically movably supporting the heating device, a welding power supply for making the heating device produce heat enough to melt the solder for a predetermined time length, and a case accomodating these constituents. The soldering is effected by the heating device which produces the heat while being pressed against the jointing surface.
摘要翻译：一种用于修改印刷电路板上的布线图案的小型轻量电阻回流焊接装置，该焊接装置包括具有可调节重量的加热装置，用于垂直运动地支撑加热装置的支撑机构，焊接功率用于使加热装置产生足够的热量以使焊料熔化预定时间长度的供应，以及适应这些成分的壳体。焊接由加热装置实现，该加热装置在被压靠在接合表面上时产生热量。

7. 发明授权

US5002217A Bonding method and bonding apparatus 失效
标题翻译：接合方法和接合装置
公开(公告)号：US5002217A
公开(公告)日：1991-03-26
申请号：US413822
申请日：1989-09-28
申请人： Mitsukiyo Tani , Hideo Shiraishi
发明人： Mitsukiyo Tani , Hideo Shiraishi
IPC分类号： B23K20/10 , H01L21/60 , H01L21/607 , H01R43/02
CPC分类号： H01L24/85 , B23K20/10 , H01L24/78 , H01R43/0207 , H01L2224/451 , H01L2224/48225 , H01L2224/48227 , H01L2224/48477 , H01L2224/4942 , H01L2224/78 , H01L2224/78313 , H01L2224/8503 , H01L2224/85051 , H01L2224/85205 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304
摘要： A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.
摘要翻译：公开了一种用于在焊盘上粘合具有球状端的线材的接合方法和装置。当接合焊盘上的焊丝材料的球被接合尖端挤压时，将超声波和高频电流组合施加到接合端，以提高接合部分的强度。

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