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1. 发明申请

US20160324012A1 RIGID-FLEXIBLE CIRCUIT BOARD HAVING FLYING-TAIL STRUCTURE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：具有飞尾结构的刚性柔性电路板及其制造方法
公开(公告)号：US20160324012A1
公开(公告)日：2016-11-03
申请号：US15102803
申请日：2014-12-11
申请人： GUANGZHOU FASTPRINT CIRCUT TECH CO., LTD. , SHENZHEN FASTPRINT CIRCUT TECH CO., LTD. , YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO., LTD.
发明人： Xingya QIU , Chutao LIN , Bei CHEN
IPC分类号： H05K3/46 , H05K1/09 , H05K1/11 , H05K3/00 , H05K1/02 , H05K3/42
CPC分类号： H05K3/4691 , H05K1/028 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K2203/061 , H05K2203/068 , H05K2203/308
摘要： Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (500), the cord boards needed by each daughter board comprising at least one flexible core substrate (510) and at least one rigid core substrate (520), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (300), and each daughter board comprising a partial first rigid area (110), a flexible area (200), and a second rigid area (300); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films (400) on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets (600) between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the partial first rigid areas of the daughter plates together to form a first rigid area (100). Also provided is a rigid-flexible circuit board having a flying-tail structure. The method for manufacturing a rigid-flexible circuit board having a flying-tail structure can effectively prevent the solder-resist layer from being damaged.
摘要翻译：本发明提供一种具有飞尾结构的刚挠柔电路板的制造方法，其特征在于，包括以下步骤：步骤1：制造子板（500）所需的芯基板，每个子板所需的电路板包括至少一个柔性芯基板（510）和至少一个刚性芯基板（520），堆叠和层叠芯基板以制造子板，所制造的子板的数量等于第二刚性区域（300）的数量，并且每个子板包括部分第一刚性区域（110），柔性区域（200）和第二刚性区域（300）; 步骤2，堆叠步骤1中获得的子板，并将聚醚酰亚胺覆盖膜（400）粘贴在第二刚性区域的相邻端表面的阻焊区域上; 和步骤3，在相邻的柔性区域和相邻的第二刚性区域之间提供PTFE衬垫（600），层压已经在步骤2中处理的子板，并将子板的部分第一刚性区域层叠在一起以形成第一刚性区域（100）。还提供了具有飞尾结构的刚性柔性电路板。制造具有飞尾结构的刚性 - 柔性电路板的方法可以有效地防止阻焊层受损。

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