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1. 发明授权

US08515113B2 Composite microphone boot to optimize sealing and mechanical properties 有权
标题翻译：复合麦克风引擎优化密封和机械性能
公开(公告)号：US08515113B2
公开(公告)日：2013-08-20
申请号：US12859711
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H04R9/08
CPC分类号： H04R1/02 , H04R31/00 , H04R2499/11 , Y10T29/49005
摘要： A microphone assembly for an electronic device is described. The microphone assembly can include a microphone, a microphone boot and a printed circuit board. The microphone boot can be a composite microphone boot that is formed from multiple materials. A hardness of the each of the materials used in the microphone boot can be selected to improve sealing integrity and reduce shock transmission. In one embodiment, the composite microphone boot can be formed using a double-shot injection molding process.
摘要翻译：描述了一种用于电子设备的麦克风组件。麦克风组件可以包括麦克风，麦克风套管和印刷电路板。麦克风引导可以是由多种材料形成的复合麦克风引导。可以选择麦克风罩中使用的每种材料的硬度，以改善密封完整性并减少冲击传播。在一个实施例中，可以使用双注射成型工艺来形成复合麦克风罩。

2. 发明授权

US08477492B2 Formed PCB 有权
标题翻译：形成PCB
公开(公告)号：US08477492B2
公开(公告)日：2013-07-02
申请号：US12859712
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H05K7/00 , G06F1/16
CPC分类号： H05K7/1427 , G06F1/1626 , G06F1/1658 , G06F1/181 , H05K1/0281 , H05K1/189 , H05K2201/056 , Y10T29/49155
摘要： Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
摘要翻译：描述了可用于便携式计算设备中的用于形成PCB的方法。 PCB可以以弯曲的配置安装在便携式计算设备中。在特定实施例中，连续形成的PCB可以被成形为具有连接薄连接器部分的两个大区域。薄连接器部分可以连接两个大区域中的每一个的组件，并且可以用来代替柔性连接器。在一个实施例中，PCB可以由包括迹线和衬底层的多个层形成。可以调整迹线和基底层以影响各个区域中PCB的刚度，例如在施加弯矩之后允许PCB保持弯曲构型。

3. 发明授权

US08634204B2 Compact folded configuration for integrated circuit packaging 失效
标题翻译：紧凑的折叠配置，用于集成电路封装
公开(公告)号：US08634204B2
公开(公告)日：2014-01-21
申请号：US12859694
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H01R12/16
CPC分类号： H01L23/552 , G06F1/1626 , G06F1/1684 , H01L23/5387 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/81801 , H01L2225/06558 , H01L2225/06572 , H01L2225/06593 , H01L2924/14 , H01L2924/1434 , H01L2924/1438 , H01Q1/243 , H01Q1/526 , H04R3/00 , H04R2499/11 , H05K1/0215 , H05K1/189 , H05K2201/042 , H05K2201/10159 , H05K2201/10371 , Y10T29/49117 , H01L2924/00
摘要： A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.
摘要翻译：描述了用于计算设备的存储器单元。存储器件可以包括通过柔性电路连接器连接在一起的多个存储器芯片，例如闪存芯片。在安装存储器件期间，柔性电路连接器的部分可以在不同的位置被弯曲或折叠，以允许存储器芯片的取向相对于彼此改变。在一个实施例中，具有多个芯片的存储器件可以以平坦配置提供，然后可以被折叠以允许将芯片安装在堆叠配置中。在另一个实施例中，柔性电路连接器可以接地到其它导电部件，以允许柔性电路连接器用作围绕存储器芯片的法拉第笼的一部分。

4. 发明申请

US20120044637A1 FORMED PCB 有权
标题翻译：形成PCB
公开(公告)号：US20120044637A1
公开(公告)日：2012-02-23
申请号：US12859712
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： G06F1/16 , H05K7/00 , H05K3/10
CPC分类号： H05K7/1427 , G06F1/1626 , G06F1/1658 , G06F1/181 , H05K1/0281 , H05K1/189 , H05K2201/056 , Y10T29/49155
摘要： Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
摘要翻译：描述了可用于便携式计算设备中的用于形成PCB的方法。 PCB可以以弯曲的配置安装在便携式计算设备中。在特定实施例中，连续形成的PCB可以被成形为具有连接薄连接器部分的两个大区域。薄连接器部分可以连接两个大区域中的每一个的组件，并且可以用来代替柔性连接器。在一个实施例中，PCB可以由包括迹线和衬底层的多个层形成。可以调整迹线和基底层以影响各个区域中PCB的刚度，例如在施加弯矩之后允许PCB保持弯曲构型。

5. 发明授权

US08427379B2 Modular material antenna assembly 失效
标题翻译：模块化材料天线组件
公开(公告)号：US08427379B2
公开(公告)日：2013-04-23
申请号：US12859701
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , Y10T29/49016
摘要： A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.
摘要翻译：提供了一种模块化材料天线组件，其包括天线块，天线块具有与非导电性框架的相应部分互锁的形状的部分，并将天线块固定到非导电框架。电非导电框架附接到导电外壳的内部，使得非导电框架和导电壳体形成一体的结构。然后将天线弯曲机构地固定到天线块。天线弯曲部也可以电连接到电路板。框架被设计成支撑用于便携式电子设备的盖玻片并且可以固定到壳体。天线块的介电常数基本上小于框架的介电常数。

6. 发明申请

US20120046780A1 COMPOSITE MICROPHONE BOOT TO OPTIMIZE SEALING AND MECHANICAL PROPERTIES 有权
标题翻译：复合麦克风引擎优化密封和机械性能
公开(公告)号：US20120046780A1
公开(公告)日：2012-02-23
申请号：US12859711
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： G06F19/00 , H04R31/00 , H04R21/02
CPC分类号： H04R1/02 , H04R31/00 , H04R2499/11 , Y10T29/49005
摘要： A microphone assembly for an electronic device is described. The microphone assembly can include a microphone, a microphone boot and a printed circuit board. The microphone boot can be a composite microphone boot that is formed from multiple materials. A hardness of the each of the materials used in the microphone boot can be selected to improve sealing integrity and reduce shock transmission. In one embodiment, the composite microphone boot can be formed using a double-shot injection molding process.
摘要翻译：描述了一种用于电子设备的麦克风组件。麦克风组件可以包括麦克风，麦克风套管和印刷电路板。麦克风引导可以是由多种材料形成的复合麦克风引导。可以选择麦克风罩中使用的每种材料的硬度，以改善密封完整性并减少冲击传播。在一个实施例中，复合麦克风罩可以使用双注射成型工艺形成。

7. 发明授权

US08391010B2 Internal frame optimized for stiffness and heat transfer 有权
公开(公告)号：US08391010B2
公开(公告)日：2013-03-05
申请号：US12859702
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , G06F1/1626 , G06F1/1658 , G06F1/203 , H04M1/026 , H04M1/0266 , H04M1/0274 , H04M1/185 , H05K7/20445 , Y10T29/49002
摘要： A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

8. 发明申请

US20120044636A1 COMPACT FOLDED CONFIGURATION FOR INTEGRATED CIRCUIT PACKAGING 失效
标题翻译：用于集成电路封装的紧凑折叠配置
公开(公告)号：US20120044636A1
公开(公告)日：2012-02-23
申请号：US12859694
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： H05K7/02 , H01R43/00
CPC分类号： H01L23/552 , G06F1/1626 , G06F1/1684 , H01L23/5387 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/81801 , H01L2225/06558 , H01L2225/06572 , H01L2225/06593 , H01L2924/14 , H01L2924/1434 , H01L2924/1438 , H01Q1/243 , H01Q1/526 , H04R3/00 , H04R2499/11 , H05K1/0215 , H05K1/189 , H05K2201/042 , H05K2201/10159 , H05K2201/10371 , Y10T29/49117 , H01L2924/00
摘要： A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.
摘要翻译：描述了用于计算设备的存储器单元。存储器件可以包括通过柔性电路连接器连接在一起的多个存储器芯片，例如闪存芯片。在安装存储器件期间，柔性电路连接器的部分可以在不同的位置被弯曲或折叠，以允许存储器芯片的取向相对于彼此改变。在一个实施例中，具有多个芯片的存储器件可以以平坦配置提供，然后可以被折叠以允许将芯片安装在堆叠配置中。在另一个实施例中，柔性电路连接器可以接地到其它导电部件，以允许柔性电路连接器用作围绕存储器芯片的法拉第笼的一部分。

9. 发明申请

US20120044635A1 INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER 有权
标题翻译：内部框架优化的强度和热传递
公开(公告)号：US20120044635A1
公开(公告)日：2012-02-23
申请号：US12859702
申请日：2010-08-19
申请人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
发明人： Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
IPC分类号： G06F1/20 , H05K13/00 , G06F19/00 , H05K7/20
CPC分类号： H05K7/20509 , G06F1/1626 , G06F1/1658 , G06F1/203 , H04M1/026 , H04M1/0266 , H04M1/0274 , H04M1/185 , H05K7/20445 , Y10T29/49002
摘要： A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
摘要翻译：描述了具有显示器的薄型便携式电子设备。电子设备的部件可以布置在外部壳体内的堆叠层中，其中每个堆叠层相对于设备的厚度位于不同的高度。堆叠层之一可以是内部金属框架。内部金属框架可以构造成用作用于发热部件的散热器，所述部件位于与内部框架相邻的层中。此外，内部金属框架可以被配置为增加装置的整体结构刚度。此外，内部金属框架可以被配置为为诸如显示器的装置部件提供附接点，使得装置部件可以经由内部金属框架联接到外部壳体。

10. 发明申请

US20120053711A1 PORTING AUDIO USING A CONNECTOR IN A SMALL FORM FACTOR ELECTRONIC DEVICE 有权
标题翻译：在小型电子设备中使用连接器的音频
公开(公告)号：US20120053711A1
公开(公告)日：2012-03-01
申请号：US12950793
申请日：2010-11-19
申请人： Anna-Katrina Shedletsky , Adam D. Mittleman , Fletcher R. Rothkopf , Phillip M. Hobson , Eric S. Jol , Stephen Brian Lynch
发明人： Anna-Katrina Shedletsky , Adam D. Mittleman , Fletcher R. Rothkopf , Phillip M. Hobson , Eric S. Jol , Stephen Brian Lynch
IPC分类号： G06F17/00
CPC分类号： H04R1/2834 , H04N5/642 , H04R1/245 , H04R1/403 , H04R1/42 , H04R5/02 , H04R11/00 , H04R11/02 , H04R17/00 , H04R23/00 , H04R23/004 , H04R2499/11 , H04R2499/15
摘要： An integrated audible sound output system incorporated in a personal media device is described. The integrated audible sound output system includes a first audio output port, the first audio output port acoustically coupled with the audible sound generator unit by way of a first air path and a second audio output port. In the described embodiments, the second audio output port is acoustically coupled with the audible sound generator unit by way of a second air path. The first and the second air paths cooperate to pass the audible sound generated by the audible sound generator unit to the external environment by way of the first audio port and the second audio port.
摘要翻译：描述结合在个人媒体设备中的集成可听音输出系统。集成的声音输出系统包括第一音频输出端口，第一音频输出端口通过第一空气路径和第二音频输出端口与声音发声器单元声学耦合。在所描述的实施例中，第二音频输出端口通过第二空气路径与声音发生器单元声学耦合。第一和第二空气路径协作，通过第一音频端口和第二音频端口将由声音发生器单元产生的可听到的声音传递到外部环境。

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