专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120058336A1 TEMPORARY FIXING SHEET FOR MANUFACTURING PROCESS OF ELECTRONIC PARTS 审中-公开
标题翻译：电子部件制造工艺的临时固定表
公开(公告)号：US20120058336A1
公开(公告)日：2012-03-08
申请号：US13223777
申请日：2011-09-01
申请人： Daisuke SHIMOKAWA , Yuta SHIMAZAKI , Kunio NAGASAKI , Eiichi IMOTO
发明人： Daisuke SHIMOKAWA , Yuta SHIMAZAKI , Kunio NAGASAKI , Eiichi IMOTO
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C08F290/067 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/114 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , Y10T428/2878 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.
摘要翻译：本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后通过冷却到预定温度可以有效且容易地将其自身剥离或更低，设计自由度高，操作性好。临时固定片包括支撑基板和设置在其至少一个面上的临时固定层，其中临时固定层包含聚氨酯聚合物和乙烯基聚合物。

2. 发明申请

US20120059124A1 TEMPORARY FIXING SHEET 审中-公开
标题翻译：临时固定片
公开(公告)号：US20120059124A1
公开(公告)日：2012-03-08
申请号：US13223841
申请日：2011-09-01
申请人： Yuta SHIMAZAKI , Eiichi IMOTO , Daisuke SHIMOKAWA , Kunio NAGASAKI
发明人： Yuta SHIMAZAKI , Eiichi IMOTO , Daisuke SHIMOKAWA , Kunio NAGASAKI
IPC分类号： C09J175/16 , C09J133/08
CPC分类号： H01L21/6836 , C08F283/008 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40° C., and loses the tack strength at the particular temperature or lower.
摘要翻译：本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后可以通过冷却到预定温度来有效且容易地将其自身剥离，或更低，给予设计的高度自由度并具有足够的可操作性。临时固定片具有包含氨基甲酸酯聚合物组分和乙烯基聚合物的树脂层，在特定温度等于或高于40℃的情况下产生粘着强度，并且在特定温度或更低温度下失去粘着强度。

3. 发明申请

US20120056338A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER 失效
标题翻译：用于保护半导体波形的压敏粘合片
公开(公告)号：US20120056338A1
公开(公告)日：2012-03-08
申请号：US13223629
申请日：2011-09-01
申请人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： H01L23/29
CPC分类号： H01L21/67132 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/10 , C09J175/16 , C09J2203/326 , C09J2475/00 , C08G18/48
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译：本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。保护片具有一个具有粘性的面，在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。

4. 发明申请

US20120065350A1 VISCOELASTIC BODY AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：粘弹体及其制造方法
公开(公告)号：US20120065350A1
公开(公告)日：2012-03-15
申请号：US13223523
申请日：2011-09-01
申请人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： C08F283/00
CPC分类号： C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48
摘要： The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.
摘要翻译：本发明提供一种可用于保护半导体晶片等的压敏粘合片的树脂材料，当半导体晶片被研磨时，不会导致半导体晶片中的弯曲（翘曲），因此具有优异的随机性图案在研磨操作中具有足够的应力分散性，抑制晶片中的裂纹和晶片边缘的碎裂，并且在剥离操作中不会在晶片的表面上留下粘合剂残留物。树脂材料应为包含聚氨酯聚合物和丙烯酸类聚合物的共聚物的粘弹性体，该共聚物通过具有可与氨基甲酸酯聚合物形成氨基甲酸酯键并具有可共聚的活性炭双键的官能团的单体形成与（甲基）丙烯酰基在一个分子中。

5. 发明申请

US20120058319A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER 审中-公开
标题翻译：用于保护半导体波形的压敏粘合片
公开(公告)号：US20120058319A1
公开(公告)日：2012-03-08
申请号：US13223966
申请日：2011-09-01
申请人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： B32B7/12 , B32B7/02 , C09J7/02
CPC分类号： H01L21/67132 , C09J7/10 , C09J2201/622 , C09J2203/326 , Y10T428/24942 , Y10T428/26 , Y10T428/28
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译：本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。保护片在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。

6. 发明申请

US20130085202A1 PRODUCTION METHOD FOR PRESSURE-SENSITIVE ADHESIVE COMPOSITION 失效
标题翻译：压敏粘合剂组合物的生产方法
公开(公告)号：US20130085202A1
公开(公告)日：2013-04-04
申请号：US13633624
申请日：2012-10-02
申请人： Tadatoshi NAKANISHI , Eiichi IMOTO
发明人： Tadatoshi NAKANISHI , Eiichi IMOTO
IPC分类号： C09J175/16
CPC分类号： C08G18/672 , C08G18/44 , C08G18/757 , C08G2170/40 , C08L33/26 , C08L2312/06 , C09J7/10 , C09J7/38 , C09J133/14 , C09J175/16 , C09J2205/31 , C09J2433/00 , C09J2475/00
摘要： Provided is a production method for a pressure-sensitive adhesive composition capable of sufficiently expressing each of “attachment position correction workability” that enables a pressure-sensitive adhesive tape containing the composition to be easily aligned by the expression of good temporary attachment property, “reworkability” that enables the tape to be easily reattached, and “temperature-sensitive strong pressure-sensitive adhesiveness” that enables the tape to express strong temperature-sensitive pressure-sensitive adhesiveness. The production method for a pressure-sensitive adhesive composition is a production method for a pressure-sensitive adhesive composition containing a cross-linked polymer in which an acrylic copolymer (A) is cross-linked by a polyurethane (meth)acrylate (B), the method including irradiating a monomer mixed liquid essentially containing a (meth)acrylate and a (meth)acrylamide with an active energy ray in the presence of the polyurethane (meth)acrylate (B).
摘要翻译：提供一种压敏粘合剂组合物的制造方法，其能够充分地表现出各自的附着位置校正加工性，其中通过表现出良好的临时附着性，能够使包含该组合物的压敏粘合带容易地排列，能够使胶带易于重新连接，以及温度敏感的强压敏粘合性，使得带能够表现出强烈的温度敏感性的压敏粘合性。粘合剂组合物的制造方法是含有交联聚合物的压敏粘合剂组合物的制造方法，其中丙烯酸共聚物（A）通过聚氨酯（甲基）丙烯酸酯（B）交联，该方法包括在聚氨酯（甲基）丙烯酸酯（B）的存在下，用活性能量射线照射基本上含有（甲基）丙烯酸酯和（甲基）丙烯酰胺的单体混合液体。

7. 发明申请

US20130084416A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE TAPE 审中-公开
标题翻译：压敏粘合剂组合物和压敏敏感胶带
公开(公告)号：US20130084416A1
公开(公告)日：2013-04-04
申请号：US13633606
申请日：2012-10-02
申请人： Tadatoshi NAKANISHI , Eiichi IMOTO
发明人： Tadatoshi NAKANISHI , Eiichi IMOTO
IPC分类号： C08F299/06 , B32B27/30 , C09J7/02 , B32B27/34
CPC分类号： C09D151/08 , C08F290/067 , C09J7/385 , Y10T428/14 , Y10T428/2887 , C08F220/18 , C08F220/56
摘要： Provided is a pressure-sensitive adhesive composition capable of sufficiently expressing each of “attachment position correction workability” that enables a pressure-sensitive adhesive tape containing the composition to be easily aligned by the expression of good temporary attachment property, “reworkability” that enables the tape to be easily reattached, and “temperature-sensitive strong pressure-sensitive adhesiveness” that enables the tape to express strong temperature-sensitive pressure-sensitive adhesiveness. Also provided is a pressure-sensitive adhesive tape containing such pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a cross-linked polymer in which an acrylic copolymer (A) is cross-linked by a polyurethane (meth)acrylate (B), in which the acrylic copolymer (A) includes a copolymer of monomers essentially containing a (meth)acrylate and a (meth)acrylamide.
摘要翻译：提供一种压敏粘合剂组合物，其能够充分地表现出通过表现出良好的临时附着性的表现，使得能够容易地使带能够使包含该组合物的压敏粘合带容易对准的每个粘合位置校正可加工性重新附着和温度敏感的强压敏粘合性，使得带能够表现出强烈的温度敏感的压敏粘合性。还提供了含有这种压敏粘合剂组合物的压敏粘合带。压敏粘合剂组合物包括其中丙烯酸共聚物（A）通过聚氨酯（甲基）丙烯酸酯（B）交联的交联聚合物，其中丙烯酸共聚物（A）包含基本上含有（甲基）丙烯酸酯和（甲基）丙烯酰胺。

8. 发明申请

US20130085250A1 HEAT-ADHERENT FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE 审中-公开
标题翻译：高压胶带和压敏粘合胶带
公开(公告)号：US20130085250A1
公开(公告)日：2013-04-04
申请号：US13633534
申请日：2012-10-02
申请人： Tadatoshi NAKANISHI , Eiichi IMOTO
发明人： Tadatoshi NAKANISHI , Eiichi IMOTO
IPC分类号： C08G18/76
CPC分类号： C09J175/04 , C08G18/672 , C08G2170/40 , C08L33/26 , C09J7/10 , C09J133/26 , C09J2201/622 , C09J2475/00 , C08G18/44
摘要： Provided is a heat-adherent film capable of sufficiently expressing each of “attachment position correction workability” that enables the film to be easily aligned by the expression of good temporary attachment property, “reworkability” that enables the film to be easily reattached, and “temperature-sensitive strong pressure-sensitive adhesiveness” that enables the film to express strong temperature-sensitive pressure-sensitive adhesiveness, and capable of maintaining its film shape in a state where the film is free of a base material at least at around room temperature. Also provided is a pressure-sensitive adhesive tape containing such heat-adherent film. The heat-adherent film includes a polymer having a urethane group, an amide group, and an acrylic group, in which: the film maintains a film shape in a state where the film is free of a base material at least at 25° C.; and the film has a tensile storage modulus of elasticity at −50° C. of 1.00×108 Pa or more and a tensile storage modulus of elasticity at 60° C. of less than 1.00×108 Pa.
摘要翻译：提供了一种能够充分地表现出每个附着位置校正可加工性的热粘合膜，其能够通过表现出良好的临时附着性，使得能够容易地重新附着的膜的再加工性以及温度敏感的强压力来容易地排列使得该膜能够表现出强烈的温度敏感的压敏粘合性，并且能够至少在室温附近将膜保持在不含基材的状态下。还提供了含有这种热粘贴膜的压敏粘合带。热粘贴膜包括具有氨基甲酸酯基，酰胺基和丙烯酸基的聚合物，其中：该膜在至少25℃下不含基材的状态下保持膜形状。 ; 该膜在-50℃下的拉伸储能弹性模量为1.00×10 8 Pa以上，在60℃下的拉伸储能弹性模量小于1.00×10 8 Pa。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式