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1. 发明授权

US10502441B2 Modular data center 有权
公开(公告)号：US10502441B2
公开(公告)日：2019-12-10
申请号：US15857316
申请日：2017-12-28
申请人： BASELAYER TECHNOLOGY, LLC
发明人： William Slessman , Steve Durand , Rose Gilbert , Andreas Zoll
IPC分类号： F24F11/00 , H05K7/20 , F24F5/00 , F25B25/00 , F24F11/62 , F24F11/30 , F24F11/76 , F24F11/63 , F24F110/22 , F24F110/10 , F24F11/87
CPC分类号： F24F11/0001 , F24F5/001 , F24F5/0035 , F24F11/30 , F24F11/62 , F24F11/76 , F25B25/00 , H05K7/20745 , H05K7/20827 , H05K7/20836 , F24F11/63 , F24F11/87 , F24F2011/0006 , F24F2110/10 , F24F2110/22
摘要： Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, an evaporative cooling module in fluid communication with the air intake module, and a mechanical cooling module in fluid communication with the evaporative cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the evaporative cooling module to selectively cool the intake air, and causing the mechanical cooling module to selectively cool the intake.

2. 发明授权

US10477723B2 Side-cooled modular data center 有权
公开(公告)号：US10477723B2
公开(公告)日：2019-11-12
申请号：US15711533
申请日：2017-09-21
申请人： Baselayer Technology, LLC
发明人： William Slessman , Andreas Zoll
IPC分类号： H05K7/20 , H05K7/14
摘要： A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

3. 发明授权

US09814160B2 Side-cooled modular data center 有权
公开(公告)号：US09814160B2
公开(公告)日：2017-11-07
申请号：US15139590
申请日：2016-04-27
申请人： Baselayer Technology, LLC
发明人： William Slessman , Andreas Zoll
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/20145 , H05K7/1497 , H05K7/202 , H05K7/2059 , H05K7/2079
摘要： A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

4. 发明授权

US10426064B2 Modular data center 有权
公开(公告)号：US10426064B2
公开(公告)日：2019-09-24
申请号：US15490505
申请日：2017-04-18
申请人： BASELAYER TECHNOLOGY, LLC
发明人： William Slessman , Steve Durand , Rose Gilbert , Andreas Zoll
IPC分类号： H05K7/20
摘要： Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, a first cooling module in fluid communication with the air intake module, and a second cooling module in fluid communication with the first cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the first cooling module to selectively cool the intake air, and causing the second cooling module to selectively cool the intake.

5. 发明申请

US20180014428A1 SIDE-COOLED MODULAR DATA CENTER 审中-公开
公开(公告)号：US20180014428A1
公开(公告)日：2018-01-11
申请号：US15711533
申请日：2017-09-21
申请人： Baselayer Technology, LLC
发明人： William Slessman , Andreas Zoll
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/20145 , H05K7/1497 , H05K7/202 , H05K7/2059 , H05K7/20609 , H05K7/20745 , H05K7/2079 , H05K7/20836
摘要： A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

6. 发明授权

US09857089B2 Modular data center 有权
公开(公告)号：US09857089B2
公开(公告)日：2018-01-02
申请号：US14959899
申请日：2015-12-04
申请人： BASELAYER TECHNOLOGY, LLC
发明人： William Slessman , Steve Durand , Rose Gilbert , Andreas Zoll
IPC分类号： F24F11/00 , F24F5/00 , F25B25/00 , H05K7/20
CPC分类号： F24F11/0001 , F24F5/001 , F24F5/0035 , F24F11/30 , F24F11/62 , F24F11/63 , F24F11/76 , F24F11/87 , F24F2011/0006 , F24F2110/10 , F24F2110/22 , F25B25/00 , H05K7/20745 , H05K7/20827 , H05K7/20836
摘要： Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, an evaporative cooling module in fluid communication with the air intake module, and a mechanical cooling module in fluid communication with the evaporative cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the evaporative cooling module to selectively cool the intake air, and causing the mechanical cooling module to selectively cool the intake.

7. 发明申请

US20180119971A1 MODULAR DATA CENTER 审中-公开
公开(公告)号：US20180119971A1
公开(公告)日：2018-05-03
申请号：US15857316
申请日：2017-12-28
申请人： BASELAYER TECHNOLOGY, LLC
发明人： William Slessman , Steve Durand , Rose Gilbert , Andreas Zoll
IPC分类号： F24F11/00 , H05K7/20 , F24F5/00 , F25B25/00
CPC分类号： F24F11/0001 , F24F5/001 , F24F5/0035 , F24F11/30 , F24F11/62 , F24F11/63 , F24F11/76 , F24F11/87 , F24F2011/0006 , F24F2110/10 , F24F2110/22 , F25B25/00 , H05K7/20745 , H05K7/20827 , H05K7/20836
摘要： Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, an evaporative cooling module in fluid communication with the air intake module, and a mechanical cooling module in fluid communication with the evaporative cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the evaporative cooling module to selectively cool the intake air, and causing the mechanical cooling module to selectively cool the intake.

8. 发明授权

US09661788B2 Modular data center 有权
公开(公告)号：US09661788B2
公开(公告)日：2017-05-23
申请号：US14042087
申请日：2013-09-30
申请人： BASELAYER TECHNOLOGY, LLC
发明人： William Slessman , Steve Durand , Rose Gilbert , Andreas Zoll
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20145 , H05K7/20309 , H05K7/20736 , H05K7/20818
摘要： Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, an evaporative cooling module in fluid communication with the air intake module, and a mechanical cooling module in fluid communication with the evaporative cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the evaporative cooling module to selectively cool the intake air, and causing the mechanical cooling module to selectively cool the intake.

9. 发明申请

US20160324036A1 SIDE-COOLED MODULAR DATA CENTER 有权
标题翻译：侧冷却模块化数据中心
公开(公告)号：US20160324036A1
公开(公告)日：2016-11-03
申请号：US15139590
申请日：2016-04-27
申请人： Baselayer Technology, LLC
发明人： William Slessman , Andreas Zoll
IPC分类号： H05K7/20 , H05K5/00 , H05K7/14 , H05K5/02
CPC分类号： H05K7/20145 , H05K7/1497 , H05K7/202 , H05K7/2059 , H05K7/2079
摘要： A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.
摘要翻译：模块化数据中心包括具有冷却模块外壳的冷却模块和容纳在冷却模块外壳内的第一冷却单元。冷却模块外壳包括具有第一冷却模块供应开口的第一接口侧壁，其接收来自第一冷却单元的第一部分冷却空气。该中心还包括一个具有数据模块外壳的数据模块，用于容纳数据设备。数据模块外壳包括具有第一数据模块供应开口的第二接口侧壁，其接收来自第一冷却模块供应开口的第一部分冷却空气，使得第一部分冷却空气流入数据模块外壳并从数据设备。

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