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1. 发明公开

US20230178899A1 Electronic Devices Having Tilted Antenna Arrays 审中-公开
公开(公告)号：US20230178899A1
公开(公告)日：2023-06-08
申请号：US17541699
申请日：2021-12-03
申请人： Apple Inc.
发明人： Zhenglian Cai , Harish Rajagopalan , Panagiotis Theofanopoulos , Ioannis Pefkianakis , Prashant H. Vashi , Guillaume Monghal , Jennifer M. Edwards
IPC分类号： H01Q21/00 , H01Q1/22 , H01Q1/24
CPC分类号： H01Q21/0075 , H01Q1/2283 , H01Q1/243
摘要： An electronic device may be provided with first and second sidewalls, a rear wall, and a display. Multiple antenna panels may be used to convey radio-frequency signals at frequencies greater than 10 GHz. A first antenna panel may radiate through the display while second and third panels radiate through the first and second sidewalls. The second and third panels may be tilted at non-zero angles with respect to the sidewalls. The non-zero angles may be of opposite sign. The non-zero angles may have the same magnitude. The magnitude may be equal to 15 degrees, as one example. Tilting the panels in this way may allow the panels to collectively cover as much of a sphere around the device as possible, including out of coverage areas behind the rear wall caused by conductive material in the rear wall, without requiring additional panels to be disposed within the device.

2. 发明授权

US11289802B2 Millimeter wave impedance matching structures 有权
公开(公告)号：US11289802B2
公开(公告)日：2022-03-29
申请号：US16413508
申请日：2019-05-15
申请人： Apple Inc.
发明人： Simone Paulotto , Jennifer M. Edwards , Harish Rajagopalan , Bilgehan Avser
IPC分类号： H01Q1/22 , H01Q1/38 , H05K1/02 , H01P5/08 , H05K1/11 , H01R13/6473
摘要： An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

3. 发明申请

US20210328351A1 Electronic Devices Having Dielectric Resonator Antennas with Parasitic Patches 有权
公开(公告)号：US20210328351A1
公开(公告)日：2021-10-21
申请号：US16851848
申请日：2020-04-17
申请人： Apple Inc.
发明人： Bilgehan Avser , Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto
IPC分类号： H01Q9/04 , H01Q5/35 , H01Q5/385
摘要： An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna that radiates through the cover layer. The antenna may include a dielectric resonating element that is excited by one or two feed probes. One or more floating parasitic elements and/or grounded parasitic elements may be patterned onto the dielectric resonating element. The parasitic elements may create boundary conditions on the dielectric resonating element that serve to isolate the antenna from cross polarization interference.

4. 发明授权

US11121469B2 Millimeter wave antennas having continuously stacked radiating elements 有权
公开(公告)号：US11121469B2
公开(公告)日：2021-09-14
申请号：US16584067
申请日：2019-09-26
申请人： Apple Inc.
发明人： Simone Paulotto , Jennifer M. Edwards , Harish Rajagopalan , Bilgehan Avser
IPC分类号： H01Q21/06 , H01Q9/04 , H01Q21/22 , H01Q1/24 , H01Q1/48
摘要： An electronic device may be provided with a phased antenna array. The array may convey signals greater than 10 GHz and may be formed on a substrate having transmission line layers and antenna layers. An antenna in the array may have a radiating element that includes first, second, and third overlapping patch elements on the antenna layers. The antenna may be fed using a differential transmission line coupled to a differential feed on the first patch element. The differential transmission line may include first and second signal traces. A first via may couple the first signal trace to the first, second, and third patch elements. A second via may couple the second signal trace to the first, second, and third patch elements. The patch elements may introduce capacitances to the radiating element that help to compensate for inductances associated with the distance between the radiating element and the signal traces.

5. 发明授权

US10992057B2 Electronic device having dual-band antennas mounted against a dielectric layer 有权
公开(公告)号：US10992057B2
公开(公告)日：2021-04-27
申请号：US16146649
申请日：2018-09-28
申请人： Apple Inc.
发明人： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew A. Mow , Mattia Pascolini
IPC分类号： H01Q1/38 , H01Q21/06 , H01Q5/357 , H01Q5/28
摘要： An electronic device may be provided with a cover layer and a phased antenna array mounted against the cover layer. Each antenna in the array may include a first patch element that is directly fed using first and second feeds and a second patch element that is directly fed using third and fourth feeds. A slot element may be formed in the first patch element. The first patch element may radiate in a first frequency band through the cover layer. The slot element may radiate in a second frequency band that is higher than the first frequency band through the cover layer. The second patch element may indirectly feed the slot element. Locating the radiating elements for each frequency band in the same plane may allow the antenna to radiate through the cover layer in both frequency bands with satisfactory antenna efficiency.

6. 发明申请

US20210075088A1 Integrated Millimeter Wave Antenna Modules 有权
公开(公告)号：US20210075088A1
公开(公告)日：2021-03-11
申请号：US16990879
申请日：2020-08-11
申请人： Apple Inc.
发明人： Jennifer M. Edwards , Siwen Yong , Jiangfeng Wu , Harish Rajagopalan , Bilgehan Avser , Simone Paulotto , Mattia Pascolini
IPC分类号： H01Q1/22 , H01Q5/335 , H01Q1/24 , H01Q23/00 , H01Q5/392
摘要： An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

7. 发明申请

US20200321690A1 Millimeter Wave Impedance Matching Structures 审中-公开
公开(公告)号：US20200321690A1
公开(公告)日：2020-10-08
申请号：US16413508
申请日：2019-05-15
申请人： Apple Inc.
发明人： Simone Paulotto , Jennifer M. Edwards , Harish Rajagopalan , Bilgehan Avser
IPC分类号： H01Q1/38 , H01Q1/22 , H05K1/02 , H01P5/08 , H05K1/11 , H01R13/6473
摘要： An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

8. 发明申请

US20190267718A1 Antenna Arrays Having Conductive Shielding Buckets 审中-公开
公开(公告)号：US20190267718A1
公开(公告)日：2019-08-29
申请号：US15906979
申请日：2018-02-27
申请人： Apple Inc.
发明人： Harish Rajagopalan , Rodney A. Gomez Angulo , Simone Paulotto , Matthew A. Mow , Bilgehan Avser , Hao Xu , Jennifer M. Edwards , Mattia Pascolini
IPC分类号： H01Q21/06 , H01Q1/24 , H01Q21/22 , H01Q3/38
摘要： An electronic device may be provided with a sidewall, a display module separated from the sidewall by a gap a display cover, a conductive bucket mounted to the display cover within the gap, and a phased antenna array mounted to the bucket for conveying millimeter wave signals through the display cover. The sidewall may form part of an antenna for conveying non-millimeter wave signals. The array may include resonating elements on a substrate. The resonating elements may be fed using feed terminals coupled to alternating sides of the resonating elements. Dielectric layers having a dielectric constant lower than that of the display cover may be provided on a surface of the display cover within the bucket. The array may operate with satisfactory efficiency despite the small amount of available space within the device, electromagnetic interference from the sidewall and the display module, and dielectric loading by the display cover.

9. 发明申请

US20190081615A1 Electronic Device Antennas Having Multiple Operating Modes 审中-公开
公开(公告)号：US20190081615A1
公开(公告)日：2019-03-14
申请号：US15700580
申请日：2017-09-11
申请人： Apple Inc.
发明人： Jennifer M. Edwards , Yijun Zhou , Yiren Wang , Hao Xu , Ming-Ju Tsai , Victor C. Lee , Liang Han , Matthew A. Mow , Mattia Pascolini
IPC分类号： H03J1/00 , H03J7/18
摘要： An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include an antenna with an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. The antenna may include a first adjustable component coupled between the antenna resonating element arm and the antenna ground on a first side of the antenna feed and a second adjustable component coupled between the antenna resonating element arm and the antenna ground on a second side of the antenna feed. Control circuitry in the electronic device may adjust the first and second adjustable components between a first tuning mode, a second tuning mode, and a third tuning mode.

10. 发明授权

US09444130B2 Antenna system with return path tuning and loop element 有权
标题翻译：具有返回路径调谐和回路元件的天线系统
公开(公告)号：US09444130B2
公开(公告)日：2016-09-13
申请号：US13860396
申请日：2013-04-10
申请人： Apple Inc.
发明人： Peter Bevelacqua , Hao Xu , Jayesh Nath , Jennifer M. Edwards , Mattia Pascolini
IPC分类号： H01Q1/24 , H01Q7/00 , H01Q9/04
CPC分类号： H01Q1/243 , H01Q7/00 , H01Q9/0442
摘要： Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dual arm inverted-F antenna resonating element and an antenna ground. An antenna feed may be coupled between the inverted-F antenna resonating element and the antenna ground. An adjustable component such as an adjustable inductor may be coupled between the inverted-F antenna resonating element and the antenna ground in parallel with the antenna feed. The adjustable component may be operable in multiple states such as an open circuit state, a short circuit state, and a state in which the adjustable component exhibits a non-zero inductance. Antenna bandwidth can be broadened by coupling a loop antenna resonating element across the antenna feed. A portion of the antenna ground may overlap the loop antenna resonating element to further enhance antenna bandwidth.
摘要翻译：电子设备可以包括射频收发器电路和天线结构。天线结构可以包括双臂倒F天线谐振元件和天线接地。天线馈送可以耦合在倒F天线谐振元件和天线接地之间。诸如可调节电感器的可调节部件可以与天线馈送并联连接在倒F天线谐振元件和天线接地之间。可调组件可以在诸如开路状态，短路状态和可调部件呈现非零电感的状态的多种状态下工作。通过将环形天线谐振元件耦合到天线馈电上，可以拓宽天线带宽。天线接地的一部分可能与环形天线谐振元件重叠，以进一步增强天线带宽。

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