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1. 发明授权

US5994648A Three-dimensional molded sockets for mechanical and electrical component attachment 失效
标题翻译：用于机械和电气部件连接的三维模制插座
公开(公告)号：US5994648A
公开(公告)日：1999-11-30
申请号：US826461
申请日：1997-03-27
申请人： Andrew Z. Glovatsky , Michael G. Todd , Cuong Van Pham
发明人： Andrew Z. Glovatsky , Michael G. Todd , Cuong Van Pham
IPC分类号： H05K1/00 , H05K1/11 , H05K1/18 , H05K3/28 , H05K3/32
CPC分类号： H05K3/326 , H05K1/119 , H05K1/183 , H05K1/184 , H05K1/0284 , H05K2201/09118 , H05K2201/09181 , H05K2201/09472 , H05K2201/09845 , H05K2201/1059 , H05K2201/10636 , H05K2201/10651 , H05K2201/10689 , H05K3/284 , Y02P70/611
摘要： An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.
摘要翻译：不需要焊接处理的电路组件，包括具有布置在其表面中的至少一个上的终端的电子部件，以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔，其中，空腔基本上符合电子形状零件。近似空腔是与电子部件的各个端子匹配的多个电触点，其中至少一个电触点连接到基板上的至少一个电路迹线。空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合，使得当部件放置在其中时，部件保持在腔内。组件设置在空腔中，使得其端子与其相应的电触点物理和电连接。

2. 发明授权

US5752851A Circuit clip connector 失效
标题翻译：电路夹连接器
公开(公告)号：US5752851A
公开(公告)日：1998-05-19
申请号：US596841
申请日：1996-02-05
申请人： Victor V. Zaderej , Michael G. Todd , Andrew Z. Glovatsky , Peter J. Sinkunas
发明人： Victor V. Zaderej , Michael G. Todd , Andrew Z. Glovatsky , Peter J. Sinkunas
IPC分类号： H01R4/48 , H01R12/62 , H05K1/14 , H05K3/32 , H05K3/36 , H01R9/07
CPC分类号： H01R12/62
摘要： A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.
摘要翻译：夹子连接器包括细长主体，从主体延伸的附接臂和用于施加从主体延伸的压力的突起。主体基本上是细长的，连接臂在每一端处一个。中间连接臂是多个突起，用于产生在其间具有空间并且适于与电导体对准的压力点，使得能够对电导体施加压力并且可以进行电连接。

3. 发明授权

US5738797A Three-dimensional multi-layer circuit structure and method for forming the same 失效
标题翻译：三维多层电路结构及其形成方法
公开(公告)号：US5738797A
公开(公告)日：1998-04-14
申请号：US649377
申请日：1996-05-17
申请人： Robert E. Belke, Jr. , Michael G. Todd , Andrew Z. Glovatsky , Alice D. Zitzmann
发明人： Robert E. Belke, Jr. , Michael G. Todd , Andrew Z. Glovatsky , Alice D. Zitzmann
IPC分类号： C23F1/02 , H05K3/00 , H05K3/06 , H05K3/20 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： H05K3/4685 , C23F1/02 , H05K3/062 , H05K3/205 , H05K2201/0361 , H05K2201/0394 , H05K2201/09018 , H05K2201/09118 , H05K2203/0152 , H05K2203/0369 , H05K2203/0376 , H05K3/0014
摘要： A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut. The molded circuit structure is then removed from the mold and the metallic foil is further etched to complete the forming of the circuit.
摘要翻译：通过部分蚀刻具有涂层的箔形成三维多层电路结构。通过提供金属箔，在金属箔的每一侧上施加可光限定的光致抗蚀剂，选择性地暴露和显影光致抗蚀剂以形成暴露区域和未曝光区域，以及用第二金属镀覆未曝光区域来形成预制电路。将预电路放置在蚀刻溶液中，并且在蚀刻溶液部分蚀刻金属箔以切割第二金属之后移除。然后将部分蚀刻的预循环弯曲成预定的形状。然后将部分蚀刻的预制电路插入模腔中，使得电路结构的至少一个表面与模具相邻。模具填充有聚合物树脂，使得聚合物树脂封装部分蚀刻的预循环的至少一部分并且基本上填充底切。然后将模制电路结构从模具中取出，并且金属箔被进一步蚀刻以完成电路的形成。

4. 发明授权

US5702584A Enhanced plating adhesion through the use of metallized fillers in plastic substrate 失效
标题翻译：通过在塑料基材中使用金属化填料增强镀层附着力
公开(公告)号：US5702584A
公开(公告)日：1997-12-30
申请号：US675308
申请日：1996-07-01
申请人： Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
发明人： Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
IPC分类号： B29C37/00 , B29C70/64 , C23C18/16 , H05K3/38 , C25D5/54 , B05D3/04 , C25D5/56
CPC分类号： C23C18/22 , B29C37/0082 , B29C70/64 , C23C18/1641 , C23C18/1653 , H05K3/381
摘要： A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
摘要翻译：聚合物基板用金属镀覆，使用聚合物中的金属填料颗粒作为通过化学镀操作形成的金属层的固定点。聚合物具有包括非金属填料颗粒和金属填料颗粒的填料; 可以蚀刻与聚合物表面相邻的非金属填料颗粒，以使靠近蚀刻表面的金属填料颗粒暴露。暴露的金属填料颗粒用作无电镀层的固定点。

5. 发明授权

US07582510B2 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices 失效
标题翻译：用于低k电介质的半导体器件的电子封装材料
公开(公告)号：US07582510B2
公开(公告)日：2009-09-01
申请号：US10595736
申请日：2004-11-09
申请人： Michael G. Todd , James T. Huneke , Lawrence N. Crane , Gordon C. Fischer
发明人： Michael G. Todd , James T. Huneke , Lawrence N. Crane , Gordon C. Fischer
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L25/50 , H01L21/563 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/81011 , H01L2224/81801 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06575 , H01L2225/06582 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
摘要翻译：提供了用于含低k电介质的半导体器件的电子封装材料。

6. 发明申请

US20080122088A1 Electronic Packaging Materials for Use with Low-K Dielectric-Containing Semiconductor Devices 失效
标题翻译：用于低K电介质半导体器件的电子封装材料
公开(公告)号：US20080122088A1
公开(公告)日：2008-05-29
申请号：US10595736
申请日：2004-11-09
申请人： Michael G. Todd , James T. Huneke , Lawrence N. Crane , Gordon C. Fischer
发明人： Michael G. Todd , James T. Huneke , Lawrence N. Crane , Gordon C. Fischer
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L25/50 , H01L21/563 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/81011 , H01L2224/81801 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06575 , H01L2225/06582 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
摘要翻译：提供了用于含低k电介质的半导体器件的电子封装材料。

7. 发明授权

US06882058B2 Organic acid containing compositions and methods for use thereof 有权
标题翻译：含有机酸的组合物及其使用方法
公开(公告)号：US06882058B2
公开(公告)日：2005-04-19
申请号：US10289506
申请日：2002-11-05
申请人： Bruce C. B. Chan , Michael G. Todd
发明人： Bruce C. B. Chan , Michael G. Todd
IPC分类号： C09J11/06 , H01L21/56 , H01L23/28
CPC分类号： C09J11/06 , H01L21/563 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.
摘要翻译：根据本发明，已经发现，加入有机酸提供了可固化组合物的改进的性能特性，例如改进的助熔剂相容性，改进的流动性能，改善的排气性能等。因此，提供了具有改进的性能的可固化组合物，其制备方法和使用它们的方法。还提供了使用本发明组合物制备的新型制品。

8. 发明授权

US5654081A Integrated circuit assembly with polymeric underfill body 失效
标题翻译：集成电路组件与聚合物底部填充体
公开(公告)号：US5654081A
公开(公告)日：1997-08-05
申请号：US498207
申请日：1995-07-05
申请人： Michael G. Todd
发明人： Michael G. Todd
IPC分类号： C08G59/24 , C08G59/42 , C08G59/68 , H01B3/40 , H01L21/56 , B32B9/00
CPC分类号： C08G59/24 , C08G59/42 , C08G59/686 , H01B3/40 , H01L21/563 , H01L2224/73203 , H01L2924/01079 , Y10T428/24917 , Y10T428/2804 , Y10T428/287
摘要： In a method of producing an integrated circuit assembly, an IC device is metallurgically bonded to a supporting substrate. The mounting of the IC device to the substrate also includes a polymeric underfill body adhesively bonding the IC device to the substrate. The polymeric underfill body is formed of a curable underfill composition comprising epoxy resin, anhydride curing agent for the epoxy resin, amine catalyst and a minor amount of an additional component selected from alkyl-substituted imidazole and phenyl-substituted imidazole. Such additional component may act as a catalyst, as used with an amine catalyst known catalyst for the polymerization reaction of the epoxy resin with the anhydride curing agent, may act as a co-catalyst. The polymeric underfill body has improved glass transition temperature values and improved coefficient of thermal expansion values to provide good thermal stress cycling life for the integrated circuit assembly. The additional component, such as N-methyl-imidazole, is used in minor amount, such as from 0.05 to 5.0 weight percent.
摘要翻译：在制造集成电路组件的方法中，IC器件冶金地结合到支撑衬底。将IC器件安装到衬底上还包括将IC器件粘合到衬底上的聚合物底部填充体。聚合物底部填充体由包含环氧树脂，用于环氧树脂的酸酐固化剂，胺催化剂和少量选自烷基取代的咪唑和苯基取代的咪唑的附加组分的可固化底部填充组合物形成。这种另外的组分可以用作催化剂，与胺催化剂一起使用的已知的用于环氧树脂与酸酐固化剂的聚合反应的催化剂可用作助催化剂。聚合物底部填充体具有改进的玻璃化转变温度值和改善的热膨胀系数，以为集成电路组件提供良好的热应力循环寿命。另外的组分如N-甲基 - 咪唑以少量使用，例如0.05-5.0重量％。

9. 发明授权

US5639010A Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices 失效
标题翻译：用于表面贴装技术装置的表面贴装固化和焊膏回流的同时工艺
公开(公告)号：US5639010A
公开(公告)日：1997-06-17
申请号：US521765
申请日：1995-08-31
申请人： Michael G. Todd , Mayank R. Parikh , Jorge D. Santana , Mauricio Ciocler
发明人： Michael G. Todd , Mayank R. Parikh , Jorge D. Santana , Mauricio Ciocler
IPC分类号： H05K3/30 , H05K3/34
CPC分类号： H05K3/3442 , H05K3/305 , H05K2201/10636 , H05K3/3484 , H05K3/3494 , Y02P70/611 , Y02P70/613
摘要： A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the adhesive, placing the circuit board into an oven where the circuit board is continuously heated to a first temperature until the adhesive is sufficiently cured so that it withstands reflow of the solder paste then to a second temperature to melt the solder paste.
摘要翻译：一种将表面安装器件安装在电路板上的方法，包括向电路板施加热固性粘合剂，向电路板施加预定熔融温度的焊膏，将表面安装器件放置在粘合剂上，将电路板放入将电路板连续地加热到第一温度直到粘合剂充分固化的烘箱，使得其能够耐受焊膏的回流，然后回到第二温度以熔化焊膏。

10. 发明授权

US5538789A Composite substrates for preparation of printed circuits 失效
公开(公告)号：US5538789A
公开(公告)日：1996-07-23
申请号：US188658
申请日：1994-01-26
申请人： Miguel A. Capote , Michael G. Todd
发明人： Miguel A. Capote , Michael G. Todd
IPC分类号： B23K35/02 , B23K35/36 , H01B1/22 , H01L23/498 , H01L23/538 , H05K1/09 , H05K1/18 , H05K3/32 , H05K3/34 , H05K3/40 , H05K3/46 , H01B1/02
CPC分类号： H01L23/49883 , B23K35/0222 , B23K35/36 , H01B1/22 , H01L23/49827 , H01L23/5384 , H05K1/095 , H05K3/321 , H01L2224/293 , H01L2924/01079 , H01L2924/01087 , H05K1/181 , H05K2201/0272 , H05K2201/10378 , H05K2203/0425 , H05K2203/1105 , H05K3/3489 , H05K3/4069 , H05K3/4623 , Y10S428/901 , Y10T428/2804 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681
摘要： Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180.degree. and about 245.degree. C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

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