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    • 4. 发明申请
    • CMOS IMAGE SENSOR
    • CMOS图像传感器
    • US20110101430A1
    • 2011-05-05
    • US12940410
    • 2010-11-05
    • Yun-Ki LEE
    • Yun-Ki LEE
    • H01L31/113
    • H01L27/14685H01L27/14621H01L27/14623H01L27/14627H01L27/1463H01L27/14636H01L27/1464H01L27/14643
    • A CIS and a method of manufacturing the same, the CIS including a substrate having a first surface and second surface opposite thereto, the substrate including an APS array region including a photoelectric transformation element and a peripheral circuit region; an insulating interlayer on the first surface of the substrate and including metal wirings electrically connected to the photoelectric transformation element; a light blocking layer on the peripheral circuit region of the second surface of the substrate, exposing the APS array region, and including a plurality of metal wiring patterns spaced apart from one another to form at least one drainage path along a boundary region between the APS array region and the peripheral circuit region; a color filter layer on the second surface of the substrate covering the APS array region and the light blocking layer; and a microlens on the color filter layer on the APS array region.
    • 一种CIS及其制造方法,所述CIS包括具有与其相反的第一表面和第二表面的基板,所述基板包括包括光电转换元件和外围电路区域的APS阵列区域; 在所述基板的第一表面上的绝缘中间层,并且包括电连接到所述光电转换元件的金属布线; 在所述基板的第二表面的外围电路区域上的遮光层,暴露所述APS阵列区域,并且包括彼此间隔开的多个金属布线图案,以形成沿着所述APS之间的边界区域的至少一个排水路径 阵列区域和外围电路区域; 在所述基板的覆盖所述APS阵列区域和所述遮光层的所述第二表面上的滤色器层; 以及APS阵列区域上的滤色器层上的微透镜。
    • 5. 发明申请
    • Method of manufacturing an image sensor having improved anti-reflective layer
    • 制造具有改进的抗反射层的图像传感器的方法
    • US20100285630A1
    • 2010-11-11
    • US12662861
    • 2010-05-07
    • Yun-Ki Lee
    • Yun-Ki Lee
    • H01L31/18H01L21/30
    • H01L27/1462H01L27/14632H01L27/14636H01L27/14685H01L27/14687
    • In a method of manufacturing an image sensor, a photodiode may be formed in a light receiving region of a substrate having a first surface. A conductive wiring may be formed on the first surface of the substrate. After removing a portion of the substrate opposite to the first surface, an anti-reflective layer may be formed on a second surface of the substrate. The second surface may be opposite to the first surface. The anti-reflective layer and the light receiving region may be thermally treated to cure defects including dangling bonds in the substrate and to improve a refraction index of the anti-reflective layer. The image sensor may have an enhanced light transmittance and may produce high-definition images.
    • 在制造图像传感器的方法中,可以在具有第一表面的基板的光接收区域中形成光电二极管。 可以在基板的第一表面上形成导电布线。 在去除与第一表面相对的基板的一部分之后,可以在基板的第二表面上形成抗反射层。 第二表面可以与第一表面相对。 可以对抗反射层和光接收区域进行热处理以固化包括衬底中的悬挂键的缺陷并提高抗反射层的折射率。 图像传感器可以具有增强的透光率并且可以产生高清晰度图像。