专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120091495A1 LIGHT REFLECTING SUBSTRATE AND PROCESS FOR MANUFACTURE THEREOF 审中-公开
标题翻译：光反射基板及其制造方法
公开(公告)号：US20120091495A1
公开(公告)日：2012-04-19
申请号：US13380779
申请日：2010-06-23
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
IPC分类号： H01L33/60 , C25D5/44 , C25D7/00 , G02B5/08
CPC分类号： H01L33/60 , H01L2224/16 , H01L2224/48091 , H01L2224/73265 , H01L2924/1301 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A light reflecting substrate comprises at least: an insulating layer and a metal layer disposed in contact with the insulating layer. The total reflectivity of light in the wavelength range of more than 320 nm and not more than 700 nm is not less than 50% and the total reflectivity of light in the wavelength range of 300 nm to 320 nm is not less than 60%. The light reflecting substrate further improves the emission power of the light-emitting device when used as the substrate therefor.
摘要翻译：光反射基板至少包括：绝缘层和设置成与绝缘层接触的金属层。在大于320nm且不大于700nm的波长范围内的光的总反射率不小于50％，并且在300nm至320nm的波长范围内的光的总反射率不小于60％。光反射基板当用作基板时，进一步提高了发光装置的发光功率。

2. 发明申请

US20110043239A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：US20110043239A1
公开(公告)日：2011-02-24
申请号：US12922378
申请日：2009-03-09
申请人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
发明人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
IPC分类号： G01R31/00
CPC分类号： G01R1/0735 , G01R3/00 , G01R31/2863 , H01R12/7076 , H01R12/7082 , H01R13/2414
摘要： An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base.
摘要翻译：本发明的目的是提供一种探针卡，即使在老化试验中暴露于高温之后，测试电极和测试电极之间的连接也具有良好的稳定性，并且不太容易受到在测试电极和导电部分，或者即使在重复使用探针卡之后，在导电部分和探针或测试电极之间。本发明的探针卡是一种探针卡，其包括测试电路板，其具有形成为对应于测试电极的测试电极和将测试电极与测试电极电连接的各向异性导电部件。测试电极形成为使得测试电极的至少一端从测试电路板的表面突出，并且各向异性导电构件是具有由其中具有微孔的阳极氧化铝膜制成的绝缘基底的构件，并且多个由导电材料制成的导电路径彼此绝缘，并且在绝缘基底的厚度方向上延伸穿过绝缘基底。

3. 发明申请

US20100264036A1 MICROSTRUCTURE 审中-公开
标题翻译：微结构
公开(公告)号：US20100264036A1
公开(公告)日：2010-10-21
申请号：US12743154
申请日：2008-08-21
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： H05K3/423 , C25D11/045 , C25D11/12 , C25D11/20 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/002 , H05K2201/0116 , H05K2201/10378 , H05K2203/0315 , H05K2203/1142 , H05K2203/1476 , H01L2924/00
摘要： Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.
摘要翻译：公开了可用作各向异性导电构件的微细结构。还公开了这种微细结构的制造方法。具体公开了一种微细结构，其由具有不小于10,000,000微孔/ mm 2的密度的穿透微孔的基底组成。在这种微细结构中，一些穿透微孔填充有除基底材料之外的物质。

4. 发明申请

US20080284042A1 ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD OF MANUFACTURE 审中-公开
标题翻译：各向异性导电构件及其制造方法
公开(公告)号：US20080284042A1
公开(公告)日：2008-11-20
申请号：US12056336
申请日：2008-03-27
申请人： Yoshinori Hotta , Takashi Touma , Yusuke Hatanaka
发明人： Yoshinori Hotta , Takashi Touma , Yusuke Hatanaka
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/49827 , G01R1/06755 , G01R1/07378 , H01L21/486 , H01L2924/0002 , H01L2924/3025 , H05K3/4038 , H05K2201/0116 , H05K2203/0315 , H01L2924/00
摘要： An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.
摘要翻译：各向异性导电部件具有绝缘性基材，导电性通路由导电性材料构成，该导电性材料通过绝缘性基材在厚度方向上以相互绝缘的状态通过，并且以导电性的方式使第一端路径暴露在绝缘基材的第一侧上，并且每个导电路径的第二端在绝缘基材的第二侧上露出。导电路径具有至少200万路径/ mm 2的密度，绝缘基材是由其中具有微孔的阳极氧化铝膜构成的结构。

5. 发明授权

US6156135A Aluminum substrate for lithographic printing plate and process for producing the same 失效
标题翻译：用于平版印刷版的铝基板及其制造方法
公开(公告)号：US6156135A
公开(公告)日：2000-12-05
申请号：US41300
申请日：1998-03-12
申请人： Yoshinori Hotta , Hirokazu Sawada , Hirokazu Sakaki
发明人： Yoshinori Hotta , Hirokazu Sawada , Hirokazu Sakaki
IPC分类号： B41N1/06 , B22D11/00 , B22D11/06 , B41N1/08 , C22F1/04 , C25F3/04 , B41N3/00
CPC分类号： C25F3/04 , B41N1/083 , C22F1/04
摘要： An aluminum substrate for lithographic printing plates which forms uniform pits on electrolytic etching without undergoing dissolution, the substrate being obtained by electrolytic etching an aluminum plate prepared by continuous casting in a twin roll mold process, rolling, and annealing, in which the annealing is carried out in such a manner that the resulting aluminum plate may have a total electric current density of not more than 1.85.times.10.sup.-2 C/dm.sup.2 when scanned at a potential from -100 mV up to 1500 mV.
摘要翻译：一种用于平版印刷版的铝基板，其在电解蚀刻中形成均匀的凹坑而不经历溶解，所述基板通过电解蚀刻通过连续铸造制备的铝板而获得，所述铝板通过双辊模制工艺，轧制和退火进行，其中进行退火以使得当在-100mV至1500mV的电位下扫描时，所得铝板的总电流密度可以不大于1.85×10 -2 C / dm 2。

6. 发明授权

US08516690B2 Anisotropic conductive joint package 有权
标题翻译：各向异性导电接头包装
公开(公告)号：US08516690B2
公开(公告)日：2013-08-27
申请号：US12747128
申请日：2008-12-01
申请人： Yusuke Hatanaka , Yoshinori Hotta , Tadabumi Tomita
发明人： Yusuke Hatanaka , Yoshinori Hotta , Tadabumi Tomita
IPC分类号： H01R43/00
CPC分类号： H01L23/5389 , H01L23/49827 , H01L2924/0002 , H01R12/714 , Y10T29/49126 , Y10T29/4921 , Y10T428/24074 , Y10T428/24083 , Y10T428/24091 , Y10T428/24174 , Y10T428/24917 , Y10T428/249953 , Y10T428/249956 , H01L2924/00
摘要： An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mm2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.
摘要翻译：一种各向异性导电接头封装，其中各向异性导电膜与至少一种选自金（Au），银（Ag），铜（Cu），铝（Al），镁（Mg），镍（Ni），掺有铟（ITO），钼（Mo），铁（Fe），钯（Pd），铍（Be）和铼（Re）的氧化锡。封装的特征在于：各向异性导电膜具有绝缘基底和由导电构件构成的导电路径，彼此绝缘并且在绝缘基底的厚度方向上延伸穿过绝缘基底，导电的一端路径从绝缘基体的一侧露出，另一端从另一侧露出，导电路径的密度为3,000,000个/ mm 2以上，绝缘基底是由阳极氧化膜铝基板具有微孔，并且每个微孔不具有沿深度的分支结构。该封装可以用作半导体器件等的电子部件的各向异性导电部件或用于检查的连接器，即使通过显着提高导电路径的安装密度而实现的结构具有高得多的集成度。

7. 发明申请

US20120168218A1 ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：非均匀导电构件及其制造方法
公开(公告)号：US20120168218A1
公开(公告)日：2012-07-05
申请号：US13201784
申请日：2010-02-17
申请人： Tadabumi Tomita , Yusuke Hatanaka , Shinya Suzuki , Atsushi Matsuura , Yoshinori Hotta , Akio Uesugi
发明人： Tadabumi Tomita , Yusuke Hatanaka , Shinya Suzuki , Atsushi Matsuura , Yoshinori Hotta , Akio Uesugi
IPC分类号： H05K1/11 , C25D11/24 , C25D5/48 , C25D11/18
CPC分类号： H01R13/2435 , H01B1/023 , H01R12/7082
摘要： Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm2.
摘要翻译：提供具有显着增加的设置导电路径密度的各向异性导电构件，甚至可以用作电连接构件或诸如半导体器件的电子部件的检查连接器，甚至在仍然具有更高的集成度的情况下也具有优异的灵活性。各向异性导电构件包括绝缘基底和由导电材料制成的多个彼此绝缘的导电路径，并且在绝缘基底的厚度方向上延伸穿过绝缘基底，每个导电路径的一端突出在绝缘基座的一侧，每个导电路径的另一端在其另一侧上露出或突出。绝缘基底由树脂材料制成，并且导电路径以至少1,000,000导电通路/ mm2的密度形成。

8. 发明申请

US20120073973A1 ANISOTROPICALLY CONDUCTIVE MEMBER 审中-公开
标题翻译：各向异性会员
公开(公告)号：US20120073973A1
公开(公告)日：2012-03-29
申请号：US13240094
申请日：2011-09-22
申请人： Kosuke YAMASHITA , Yoshinori HOTTA , Akio UESUGI
发明人： Kosuke YAMASHITA , Yoshinori HOTTA , Akio UESUGI
IPC分类号： C25D1/20 , C25D1/00 , B32B3/00 , B32B3/26 , B32B5/00
CPC分类号： H01R43/007 , C25D1/006 , C25D3/12 , C25D3/38 , C25D11/04 , C25D11/045 , C25D11/08 , C25D11/12 , C25D11/20 , C25D11/24 , H01R13/2414
摘要： An anisotropically conductive member includes an insulating base having through micropores and conductive paths formed by filling the through micropores with a conductive material, insulated from one another, and extending through the insulating base in its thickness direction, one end of each of the conductive paths exposed on one side of the insulating base, the other end of each of the conductive paths exposed on the other side thereof. The insulating base is an anodized film obtained from an aluminum substrate and the aluminum substrate contains intermetallic compounds with an average circle equivalent diameter of up to 2 μm at a density of up to 100 pcs/mm2. The anisotropically conductive member dramatically increases the density of disposed conductive paths and suppresses the formation of regions having no conductive paths, and can be used as an electrically connecting member or inspection connector for electronic components.
摘要翻译：各向异性导电构件包括具有通过微孔的绝缘基底和通过用导电材料填充通孔而形成的导电路径，导电材料彼此绝缘并且在其厚度方向上延伸穿过绝缘基底，每个导电路径的一端暴露在绝缘基底的一侧，每个导电路径的另一端在另一侧露出。绝缘基材是由铝基板获得的阳极氧化膜，铝基板以高达100个/ mm 2的密度含有平均当量直径高达2μm的金属间化合物。各向异性导电构件显着地增加了布置的导电路径的密度，并且抑制了没有导电路径的区域的形成，并且可以用作用于电子部件的电连接构件或检查连接器。

9. 发明授权

US07824535B2 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US07824535B2
公开(公告)日：2010-11-02
申请号：US11699447
申请日：2007-01-30
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D11/06 , B32B3/26
CPC分类号： C25D11/045 , B01J23/42 , B01J23/52 , B01J35/0013 , B01J35/006 , B01J37/0211 , B01J37/0226 , B01J37/348 , C25D11/12 , C25D11/18 , Y10T428/249953 , Y10T428/24999
摘要： A microstructure includes an anodized aluminum layer that has on a surface thereof micropores, at least some of which contain a catalyst, in a micropore array with a degree of ordering of at least 40%. A method of manufacturing the microstructure includes anodizing an aluminum member to form on its surface an anodized layer having micropores, removing the aluminum member, and supporting a catalyst on at least part of the anodized layer. The microstructure is excellent in heat resistance.
摘要翻译：微结构包括阳极氧化铝层，其表面上具有至少40％的有序度的微孔阵列中的微孔，其至少一些含有催化剂。制造微结构的方法包括阳极氧化铝构件以在其表面上形成具有微孔的阳极氧化层，去除铝构件，并在至少部分阳极氧化层上支撑催化剂。微结构耐热性优异。

10. 发明授权

US07648760B2 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US07648760B2
公开(公告)日：2010-01-19
申请号：US11702189
申请日：2007-02-05
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D11/06 , B32B3/26
CPC分类号： C25D11/20 , C25D11/12 , C25D11/24 , Y10T428/12042 , Y10T428/12056 , Y10T428/249953 , Y10T428/24997 , Y10T428/249974
摘要： In a method of manufacturing a microstructure, an aluminum member having an aluminum substrate and a micropore-bearing anodized layer present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving 0.001 to 20 wt % of a material constituting the anodized layer and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized layer, thereby obtaining the microstructure having micropores formed on a surface thereof. This method enables a microstructure having an ordered array of pits to be obtained in a short period of time.
摘要翻译：在制造微结构的方法中，具有铝基板和存在于铝基板表面上的微孔阳极氧化层的铝构件至少依次进行孔序处理，其涉及执行一个或多个包括第一膜溶解处理以使构成阳极氧化层的材料为0.001〜20重量％的步骤的循环和在第一膜溶解处理之后的阳极氧化处理; 以及用于溶解阳极氧化层的第二膜溶解处理，从而获得在其表面上形成有微孔的微结构。该方法能够在短时间内获得具有有序排列阵列的微结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式