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    • 10. 发明授权
    • Wafer processing system with dual wafer robots capable of asynchronous motion
    • 具有双晶片机器人的晶圆处理系统能够进行异步运动
    • US08137048B2
    • 2012-03-20
    • US11863166
    • 2007-09-27
    • Mahendran ChidambaramQuoc TruongJerry SchockN. William Parker
    • Mahendran ChidambaramQuoc TruongJerry SchockN. William Parker
    • B25J18/02
    • H01L21/6719B25J9/107B25J18/025H01L21/67184H01L21/67196H01L21/67742Y10T74/20305
    • A robot assembly for transferring substrates includes a central tube assembly oriented along a central axis, perpendicular to a substrate transfer plane, and having an inner surface that forms part of a first enclosure at a first pressure, and an outer surface that forms part of a second enclosure at a second, different pressure. The robot assembly further includes a transfer robot which itself includes multiple rotor assemblies, each configured to rotate parallel to the substrate transfer plane. The various rotor assemblies are organized in pairs, each pair having one rotor fitted with a telescoping support arm/end effector arrangement to support substrates thereon, and the other rotor fitted with inner and outer actuator arms that cooperate to effect radial movement of the corresponding end effector of the paired rotor assembly. Each rotor is controlled to effect the transfer of substrates within a wafer processing system asynchronously and at differing heights.
    • 用于传送基板的机器人组件包括:中心管组件,其沿着中心轴线定向,垂直于基板传送平面,并且具有形成第一外壳的第一压力的一部分的内表面,以及形成 第二个外壳处于第二个不同的压力。 机器人组件还包括传送机器人,其自身包括多个转子组件,每个转子组件被构造成平行于基板传送平面旋转。 各对转子组件成对组合,每对具有一个转子,该转子装配有可伸缩的支撑臂/端部执行器装置,以支撑其上的基板,另一个转子装配有内部和外部致动器臂,其配合以实现相应端部的径向移动 成对的转子组件的效应器。 控制每个转子以在晶片处理系统内以不同的高度实现衬底的转移。