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1. 发明申请

US20120061819A1 Semiconductor Module and Method for Production Thereof 有权
标题翻译：半导体模块及其制造方法
公开(公告)号：US20120061819A1
公开(公告)日：2012-03-15
申请号：US12881003
申请日：2010-09-13
申请人： Ralf Siemieniec , Uwe Kirchner
发明人： Ralf Siemieniec , Uwe Kirchner
IPC分类号： H01L23/492 , H01L21/60
CPC分类号： H01L24/83 , H01L23/3107 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/0603 , H01L2224/06181 , H01L2224/16245 , H01L2224/29099 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32245 , H01L2224/48247 , H01L2224/49111 , H01L2224/73253 , H01L2224/73263 , H01L2224/73265 , H01L2224/8309 , H01L2224/83805 , H01L2224/8381 , H01L2224/83815 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2224/85439 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1203 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/01014 , H01L2924/00 , H01L2924/01028 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention relates to a module including a semiconductor chip, at least two contact elements and an insulating material between the two contact elements. Furthermore, the invention relates to a method for production of such a module.
摘要翻译：本发明涉及包括半导体芯片，至少两个接触元件和两个接触元件之间的绝缘材料的模块。此外，本发明涉及一种用于生产这种模块的方法。

2. 发明授权

US08061604B1 System and method of master data management using RFID technology 有权
标题翻译：使用RFID技术的主数据管理系统和方法
公开(公告)号：US08061604B1
公开(公告)日：2011-11-22
申请号：US10749808
申请日：2003-12-31
申请人： Matthias Wobbe , Christoph Wobbe , Uwe Kirchner , Walter G. Kienle
发明人： Matthias Wobbe , Christoph Wobbe , Uwe Kirchner , Walter G. Kienle
IPC分类号： G06F19/00
CPC分类号： G06Q10/20 , G06Q10/087
摘要： Methods and apparatus, including computer program products, for data management pertaining to master data management, processing, and optimization; to maintenance management; and to asset management. A master data management system may include a dynamic object identification system. The dynamic object identification system may identify objects using a segmented and coded globally unique identifier. The globally unique identifier may be updated while the objects are within the system. The globally unique identifier may comprise coded segments including a personal identification number, an external key, technical data, and administration data. The technical and administration data may be more or less detailed, depending on, among others, the object, its history of use, and its present circumstances. Implementation of the asset management system may include the use of radio-frequency identification (RFID) tags. The RFID tags may store detailed object information, including critical object information and a globally unique identifier.
摘要翻译：用于与主数据管理，处理和优化有关的数据管理的方法和装置，包括计算机程序产品; 维修管理; 和资产管理。主数据管理系统可以包括动态对象识别系统。动态对象识别系统可以使用分段和编码的全局唯一标识符识别对象。当对象在系统内时，可以更新全局唯一标识符。全球唯一标识符可以包括编码段，包括个人识别号码，外部密钥，技术数据和管理数据。技术和管理数据可能或多或少是详细的，取决于物体，其使用历史及其现状。资产管理系统的实施可以包括使用射频识别（RFID）标签。 RFID标签可以存储详细的对象信息，包括关键对象信息和全局唯一标识符。

3. 发明申请

US20050109995A1 Support apparatus 有权
标题翻译：支持装置
公开(公告)号：US20050109995A1
公开(公告)日：2005-05-26
申请号：US10894926
申请日：2004-07-20
申请人： Uwe Kirchner , Wolfgang Bertleff
发明人： Uwe Kirchner , Wolfgang Bertleff
IPC分类号： A62B99/00 , A62B3/00 , B65H3/08
CPC分类号： A62B3/005
摘要： The invention relates to a support apparatus for supporting a tool, especially a rescue tool as, for example, a spreading cylinder or the like, on an object, especially a vehicle part, which support apparatus has a frame and means on the frame for fixing the support apparatus to the object, wherein the tool is attached to the support apparatus and the latter supports itself against the object, wherein the frame 2 displays an upper 3 and a lower support claw 4 that are effective even in an inclined disposition with respect to the object, the frame 2 including the upper and lower support claws 3, 4 forms a C-shape, and the upper as well as lower support claws 3, 4 are designed such that the holding effect during loading of the support apparatus arises through the canting of the two support claws 3, 4 with respect to a portion of the object located between the two support claws 3, 4.
摘要翻译：本发明涉及一种支撑装置，其用于在物体上，特别是车辆部分上支撑工具，特别是诸如扩展气缸等的救援工具，该支撑装置具有框架和用于固定的框架上的装置对该物体的支撑装置，其特征在于，所述工具安装在所述支撑装置上，并且所述支撑装置将其自身抵靠所述物体，其中，所述框架2显示上部3和下部支撑爪4，所述上部3和下部支撑爪4即使在相对于该物体包括上支撑爪3,4和下支撑爪4的框架2形成C形，并且上和下支撑爪3,4被设计成使得在支撑装置的装载期间的保持效果通过相对于位于两个支撑爪3,4之间的物体的一部分，两个支撑爪3,4的转动。

4. 发明申请

US20120319109A1 ELECTRONIC DEVICE AND MANUFACTURING THEREOF 有权
标题翻译：电子设备及其制造
公开(公告)号：US20120319109A1
公开(公告)日：2012-12-20
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/544
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译：电子设备及其制造。一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。第一引线电耦合到控制电极。第二引线电耦合到第一负载电极。第三引线电耦合到第一负载电极，第三引线与第二引线分离。第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。

5. 发明授权

US08097944B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08097944B2
公开(公告)日：2012-01-17
申请号：US12433429
申请日：2009-04-30
申请人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
发明人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/32 , H01L24/40 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H05K3/32 , H05K3/3442 , H05K3/3447 , H05K3/3468 , H05K3/3473 , H05K2201/09472 , H05K2201/10303 , H05K2201/1059 , H05K2201/10727 , H05K2201/10962 , H05K2201/10984 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.
摘要翻译：半导体器件包括具有芯片岛的衬底，附接到芯片岛的芯片以及沉积在芯片岛和芯片岛的一部分上的封装材料。芯片岛包括第一主面，芯片与第二主面相对，芯片岛的第二主面限定至少一个空腔。

6. 发明申请

US20090212284A1 ELECTRONIC DEVICE AND MANUFACTURING THEREOF 有权
标题翻译：电子设备及其制造
公开(公告)号：US20090212284A1
公开(公告)日：2009-08-27
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/48 , H01L23/58
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译：电子设备及其制造。一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。第一引线电耦合到控制电极。第二引线电耦合到第一负载电极。第三引线电耦合到第一负载电极，第三引线与第二引线分离。第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。

7. 发明授权

US08618644B2 Electronic device and manufacturing thereof 有权
标题翻译：电子设备及其制造
公开(公告)号：US08618644B2
公开(公告)日：2013-12-31
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译：电子设备及其制造。一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片，在第二表面上提供第二负载电极。第一引线电耦合到控制电极。第二引线电耦合到第一负载电极。第三引线电耦合到第一负载电极，第三引线与第二引线分离。第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。

8. 发明授权

US08253225B2 Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof 有权
标题翻译：该装置包括耦合到半导体芯片的半导体芯片和引线及其制造
公开(公告)号：US08253225B2
公开(公告)日：2012-08-28
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译：电子设备及其制造。一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。第一引线电耦合到控制电极。第二引线电耦合到第一负载电极。第三引线电耦合到第一负载电极，第三引线与第二引线分离。第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。

9. 发明授权

US07843237B2 Circuit arrangement for actuating a transistor 有权
标题翻译：用于致动晶体管的电路布置
公开(公告)号：US07843237B2
公开(公告)日：2010-11-30
申请号：US12272097
申请日：2008-11-17
申请人： Bernhard Strzalkowski , Marco Seibt , Uwe Kirchner
发明人： Bernhard Strzalkowski , Marco Seibt , Uwe Kirchner
IPC分类号： H03K3/00
CPC分类号： H03K17/6871 , H03K2217/0063 , H03K2217/0081
摘要： One example of the invention relates to a circuit arrangement for actuating a high-side transistor which includes a control terminal and a load terminal. The circuit arrangement includes a driver circuit that is designed to generate, in response to a control signal, a driver signal for the control terminal of the high-side transistor. A supply circuit is capacitively coupled to a radio-frequency signal source and is designed to provide a supply voltage to the driver circuit, the supply voltage being referenced to a floating reference potential.
摘要翻译：本发明的一个实例涉及用于致动包括控制端子和负载端子的高侧晶体管的电路装置。该电路装置包括驱动电路，其被设计成响应于控制信号产生用于高侧晶体管的控制端的驱动信号。电源电路电容耦合到射频信号源，并被设计成向驱动器电路提供电源电压，电源电压参考浮动参考电位。

10. 发明授权

US09691053B1 System and method of master data management 有权
公开(公告)号：US09691053B1
公开(公告)日：2017-06-27
申请号：US10750538
申请日：2003-12-31
申请人： Matthias Wobbe , Christoph Wobbe , Uwe Kirchner , Walter G. Kienle
发明人： Matthias Wobbe , Christoph Wobbe , Uwe Kirchner , Walter G. Kienle
IPC分类号： G06Q10/00
CPC分类号： G06Q10/20 , G06Q10/087
摘要： Methods and apparatus, including computer program products, for data management pertaining to master data management, processing, and optimization; to maintenance management; and to asset management. A master data management system may include a dynamic object identification system. The dynamic object identification system may identify objects using a segmented and coded globally unique identifier. The globally unique identifier may be updated while the objects are within the system. The globally unique identifier may comprise coded segments including a personal identification number, an external key, technical data, and administration data. The technical and administration data may be more or less detailed, depending on, among others, the object, its history of use, and its present circumstances. Implementation of the asset management system may include the use of radio-frequency identification (RFID) tags. The RFID tags may store detailed object information, including critical object information and a globally unique identifier.

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