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1. 发明申请

US20060040589A1 Double sided polishing machine 有权
标题翻译：双面抛光机
公开(公告)号：US20060040589A1
公开(公告)日：2006-02-23
申请号：US11103733
申请日：2005-04-12
申请人： Ulrich Ising
发明人： Ulrich Ising
IPC分类号： B24B49/00
CPC分类号： B24B37/08 , B24B37/015
摘要： Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A temperature control device being at least provided for the upper working disc by which a temperature control fluid can be conveyed through passages in the upper working disc. A spacing measuring device being associated with the working discs which measure the spacing in the polishing gap (gap width μ) at two radial spaced points of the polishing gap.
摘要翻译：具有上下工作盘的双面抛光机，每个抛光机包括抛光盘和载盘。工作盘相对于彼此同轴地布置和可旋转，在抛光盘之间形成抛光间隙。所述工件在抛光间隙中加工。至少设置用于上工作盘的温度控制装置，通过该温度控制装置可以通过上工作盘中的通道输送温度控制流体。一个间距测量装置与工作盘相关联，该工作盘在抛光间隙的两个径向间隔的点处测量抛光间隙中的间距（间隙宽度μ）。

2. 发明授权

US07101258B2 Double sided polishing machine 有权
公开(公告)号：US07101258B2
公开(公告)日：2006-09-05
申请号：US11103733
申请日：2005-04-12
申请人： Ulrich Ising
发明人： Ulrich Ising
IPC分类号： B24B7/22
CPC分类号： B24B37/08 , B24B37/015
摘要： Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A temperature control device being at least provided for the upper working disc by which a temperature control fluid can be conveyed through passages in the upper working disc. A spacing measuring device being associated with the working discs which measure the spacing in the polishing gap (gap width μ) at two radial spaced points of the polishing gap.

3. 发明申请

US20050242063A1 Method and device for the chemical mechanical polishing of workpieces 审中-公开
标题翻译：工件化学机械抛光的方法和装置
公开(公告)号：US20050242063A1
公开(公告)日：2005-11-03
申请号：US10511651
申请日：2003-03-11
申请人： Ulrich Ising , Marc Reichmann , Thomas Keller
发明人： Ulrich Ising , Marc Reichmann , Thomas Keller
IPC分类号： B24B37/34 , H01L21/304 , B44C1/22 , C23F1/00 , H01L21/306
CPC分类号： B24B37/345
摘要： Method for transporting, chemical-mechanical polishing and drying of workpieces, in particular silicon wafers in a sealed clean room with the following steps: the workpieces are removed by at least one transfer device from a loading and unloading station and transferred onto an intermediate station the workpieces are received by at least one polishing head of a polishing device of the intermediate station, transported to a polishing plate of the polishing device and held under rotation of the polishing head against the rotating polishing plate after polishing, the workpieces are transported back by the polishing head to the intermediate station, released from the polishing head and cleaned and/or chemically treated in the intermediate station the cleaned and/or chemically treated workpieces are transported from the intermediate station optionally to a second polishing device or to a washing or drying device and washed and dried therein the washed and dried workpieces are transported back by the transfer device to the loading and unloading station the polishing head is cleaned before each workpiece is received.
摘要翻译：用于在密封的洁净室中运输，化学机械抛光和干燥工件，特别是硅晶片的方法，具有以下步骤：通过至少一个转运装置从装载和卸载站移除工件并将其转移到中间站上工件被中间站的抛光装置的至少一个抛光头接收，被运送到抛光装置的抛光板，并且在抛光之后保持在抛光头旋转的旋转抛光板上，工件由抛光头到中间站，从抛光头释放并在中间站中进行清洁和/或化学处理，清洁和/或化学处理的工件可选地从中间站输送到第二抛光装置或洗涤或干燥装置并在其中洗涤干燥，洗涤和干燥的工件被运输 ck通过转移装置到装卸站，在每个工件被接收之前清洁头。

4. 发明授权

US06780083B2 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers 失效
标题翻译：用于对圆形扁平工件，特别是半导体晶片的表面的化学机械抛光的装置和方法
公开(公告)号：US06780083B2
公开(公告)日：2004-08-24
申请号：US10125862
申请日：2002-04-19
申请人： Ulrich Ising , Marc Reichmann , Thomas Keller
发明人： Ulrich Ising , Marc Reichmann , Thomas Keller
IPC分类号： B24B5100
CPC分类号： B24B37/345
摘要： An apparatus for the chemical-mechanical polishing of surfaces of circular flat workpieces, in particular semi-conductor wafers, comprising a loading and unloading station for the workpieces which includes a carrier which is supported for rotation about a vertical axis and is driven by a rotary driving means into a predetermined rotary position, at least two horizontal loading surfaces on the carrier means facing upwardly. With a transfer means the workpieces can be placed on the loading surfaces or removed therefrom. At least two polishing tables in corresponding polishing stations are provided which are located at the circumference of the carrier means and at least two chucks for the workpieces, the chucks being adapted to be moved along a vertical and a horizontal axis by moving means to align the chuck with a loading surface, to hold and discharge a workpiece and for the transfer of the workpiece as well to the associated polishing station and away therefrom and for the cooperation with the polishing table of the associated polishing station and a control means for the rotary driving means, the actuation means and the moving means.
摘要翻译：一种用于化学机械抛光圆形平坦工件，特别是半导体晶片的表面的装置，包括用于工件的装载和卸载工位，该装载和卸载工位包括载体，所述载体被支撑为围绕垂直轴线旋转并被旋转驱动驱动装置进入预定的旋转位置，所述载体装置上的至少两个水平加载表面朝上。使用传送装置，工件可以放置在装载表面上或从其上移除。在相应的抛光站中至少设有两个抛光台，它们位于承载装置的圆周和至少两个用于工件的卡盘上，卡盘适于通过移动装置沿垂直轴和水平轴线移动，具有装载表面的卡盘，以保持和排出工件以及用于将工件以及相关联的抛光站传送到相关联的抛光站并远离其并与用于相关联的抛光站的抛光台的配合以及用于旋转驱动的控制装置装置，致动装置和移动装置。

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