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1. 发明授权

US11501129B2 Antenna structure and device using the same 有权
公开(公告)号：US11501129B2
公开(公告)日：2022-11-15
申请号：US16577851
申请日：2019-10-08
申请人： Securitag Assembly Group Co., Ltd
发明人： Kai-Jun Liang
IPC分类号： G06K19/077 , H01Q9/26
摘要： An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.

2. 发明授权

US11050207B2 Crimping apparatus and system for crimping a flexible printed circuit 有权
公开(公告)号：US11050207B2
公开(公告)日：2021-06-29
申请号：US16781954
申请日：2020-02-04
申请人： Securitag Assembly Group Co., Ltd.
发明人： Tung -Sheng Chen , Shih- Ching Chen , Chih- Cheng Chuang
IPC分类号： H01R43/048 , H01R43/042
摘要： A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

3. 发明申请

US20200176940A1 CRIMPING APPARATUS AND SYSTEM FOR CRIMPING A FLEXIBLE PRINTED CIRCUIT 审中-公开
公开(公告)号：US20200176940A1
公开(公告)日：2020-06-04
申请号：US16781954
申请日：2020-02-04
申请人： Securitag Assembly Group Co., Ltd.
发明人： Tung -Sheng Chen , Shih- Ching Chen , Chih- Cheng Chuang
IPC分类号： H01R43/048 , H01R43/042
摘要： A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

4. 发明申请

US20180287324A1 CRIMPING APPARATUS AND SYSTEM FOR CRIMPING A FLEXIBLE PRINTED CIRCUIT 审中-公开
公开(公告)号：US20180287324A1
公开(公告)日：2018-10-04
申请号：US15994543
申请日：2018-05-31
申请人： Securitag Assembly Group Co., Ltd.
发明人： Tung -Sheng Chen , Shih- Ching Chen , Chih- Cheng Chuang
IPC分类号： H01R43/048 , H01R43/042
摘要： A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

5. 发明授权

US11551851B2 Module substrate antenna, and module substrate mounting the same 有权
公开(公告)号：US11551851B2
公开(公告)日：2023-01-10
申请号：US16367787
申请日：2019-03-28
申请人： TODA KOGYO CORP. , Securitag Assembly Group Co., Ltd.
发明人： Jun Koujima , Mark Chang , Yoshiteru Kouno , Peter Yan
IPC分类号： H01F27/28 , H01F17/00 , H01F27/29 , H05K1/02 , H05K1/16 , H05K1/18 , H01Q7/06
摘要： A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.

6. 发明授权

US10166707B2 RFID device and method for making the same 有权
公开(公告)号：US10166707B2
公开(公告)日：2019-01-01
申请号：US15847848
申请日：2017-12-19
申请人： Securitag Assembly Group Co., Ltd
发明人： Cheng hung Chang , Ching Mei Chi , Chun Jun Chuang , Ya Chi Shen , Tian lin Yan
IPC分类号： G06K19/07 , B29C45/16 , B29C45/14 , G06K19/077 , H01Q13/16 , H01Q1/22 , B29K77/00 , B29K509/08 , B29L31/34 , B29K105/12
摘要： The present invention provides an RFID device and manufacturing method. The RFID device comprises a first housing, an antenna module, and a second housing. The antenna module arranged on the first housing comprises a base substrate, and an antenna layer, sticking on an outer surface of the base substrate. The second housing is formed to couple to the first housing by an injection molding process so that the antenna module is arranged between the first and second housings.

7. 发明申请

US20180174017A1 RFID SENSING AND RECORDING DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
公开(公告)号：US20180174017A1
公开(公告)日：2018-06-21
申请号：US15442460
申请日：2017-02-24
申请人： Securitag Assembly Group Co., Ltd
发明人： Tian lin Yan , Cheng hung Chang , Way Yu Chen
IPC分类号： G06K19/077 , G06K7/10 , G06K19/07
CPC分类号： G06K19/07779 , G06K7/10336 , G06K19/0702
摘要： The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.

8. 发明申请

US20160301175A1 CRIMPING APPARATUS AND SYSTEM FOR CRIMPING A FLEXIBLE PRINTED CIRCUIT 有权
标题翻译：用于打击柔性印刷电路的打击装置和系统
公开(公告)号：US20160301175A1
公开(公告)日：2016-10-13
申请号：US14805438
申请日：2015-07-21
申请人： SECURITAG ASSEMBLY GROUP CO., LTD.
发明人： Tung -Sheng Chen , Shih- Ching Chen , Chih- Cheng Chuang
IPC分类号： H01R43/048
CPC分类号： H01R43/0486 , H01R43/0427
摘要： A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.
摘要翻译：公开了一种压接装置，包括与压模连接的压模，平移模块和压力控制模块。压制模块通过流体在压模上产生作用力。翻译模块耦合到印模模块，用于驱动印刷机模块向具有两个隔离电路层的柔性印刷电路移动，使得一个电路层被压制成压接到另一个电路层，其中压力控制模块调节压力所述压制模块在所述压制模具上保持恒定的力，由此所述压模可以在所述压接过程期间产生作用在所述柔性印刷电路上的恒定应力。此外，压接装置可以在卷绕过程中适用于卷曲布置在卷上的每个柔性印刷电路单元的两个隔离电路层。

9. 发明公开

US20230394274A1 RADIO FREQUENCY IDENTIFICATION DEVICE 审中-公开
公开(公告)号：US20230394274A1
公开(公告)日：2023-12-07
申请号：US18175932
申请日：2023-02-28
申请人： Securitag Assembly Group Co., Ltd.
发明人： KAI-JUN LIANG
IPC分类号： G06K19/077 , H01Q1/22 , H01Q9/04
CPC分类号： G06K19/07773 , H01Q1/2225 , H01Q9/0407 , G06K19/07722
摘要： The present invention provides a RFID device arranged on an object surface, comprising a substrate, a first metal layer and a second metal layer. The first metal layer has a first connecting surface having a first adhering layer for adhering to the first surface of the substrate, wherein a RFID element is electrically connected to the first metal layer and a length of the first metal layer is larger than a length of the substrate such that the first metal layer has a first extending part extending outwardly from the lateral surface of the substrate. The second metal layer has a second connecting surface having a second adhering layer formed thereon for adhering the second metal layer on the second surface, wherein the first extending metal layer is attached onto but electrically insulated from the object surface or the second metal layer.

10. 发明申请

US20190304662A1 MODULE SUBSTRATE ANTENNA, AND MODULE SUBSTRATE MOUNTING THE SAME 审中-公开
公开(公告)号：US20190304662A1
公开(公告)日：2019-10-03
申请号：US16367787
申请日：2019-03-28
申请人： TODA KOGYO CORP. , Securitag Assembly Group Co., Ltd.
发明人： Jun KOUJIMA , Mark CHANG , Yoshiteru KOUNO , Peter Yan
IPC分类号： H01F27/28 , H01F17/00 , H01F27/29 , H05K1/02 , H05K1/16 , H05K1/18
摘要： A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.

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