专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070232055A1 Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component 审中-公开
标题翻译：将保护材料应用于与部件相关的互连的方法和装置
公开(公告)号：US20070232055A1
公开(公告)日：2007-10-04
申请号：US11423720
申请日：2006-06-13
申请人： Richard Earl Corley , Shelby Wayne Dennis , Edgar Colin Diaz , Richard Leo Hubert , Jonathan Harold Laurer , Tu Phan , George Allan Ping , Jeanne Marie Saldanha Singh , Mary Claire Smoot , Paul Timothy Spivey
发明人： Richard Earl Corley , Shelby Wayne Dennis , Edgar Colin Diaz , Richard Leo Hubert , Jonathan Harold Laurer , Tu Phan , George Allan Ping , Jeanne Marie Saldanha Singh , Mary Claire Smoot , Paul Timothy Spivey
IPC分类号： H01L21/4763
CPC分类号： H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.
摘要翻译：将保护材料施加到与部件相关联的互连的方法和装置。一种这样的方法包括将模板放置在靠近空腔上延伸的互连件附近。将一定量的保护材料放在模板上。刮水器穿过模板。刮水器的冲击角小于50度。至少所需的保护材料厚度被施加到互连。

2. 发明授权

US07267431B2 Multi-fluid ejection device 有权
标题翻译：多流体喷射装置
公开(公告)号：US07267431B2
公开(公告)日：2007-09-11
申请号：US10881961
申请日：2004-06-30
申请人： Frank Edward Anderson , Jeffery James Buchanan , Curtis Ray Droege , David Emerson Greer , Kin Ming Kwan , Gregory Alan Long , Ganesh Vinayak Phatak , Paul Timothy Spivey , Carl Edmond Sullivan , Kent Lee Ubellacker , Melissa Marie Waldeck
发明人： Frank Edward Anderson , Jeffery James Buchanan , Curtis Ray Droege , David Emerson Greer , Kin Ming Kwan , Gregory Alan Long , Ganesh Vinayak Phatak , Paul Timothy Spivey , Carl Edmond Sullivan , Kent Lee Ubellacker , Melissa Marie Waldeck
IPC分类号： B41J2/05 , B41J2/015
CPC分类号： B41J2/17513
摘要： A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.
摘要翻译：多流体和喷射头基板，其与多流体本体流体连通地连通，用于从其中喷射多个流体。多流体包括至少两个分离的流体室。独立的流体供应路径从每个流体室引导，以提供流体到喷射头基板中的多个流体流动路径。喷射头基板被附接在身体的喷射头部区域附近。喷射头基板中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

3. 发明授权

US06193359B1 Ink jet print head containing a radiation curable resin layer 失效
标题翻译：含有可辐射固化树脂层的喷墨打印头
公开(公告)号：US06193359B1
公开(公告)日：2001-02-27
申请号：US09064019
申请日：1998-04-21
申请人： Girish Shivaji Patil , Paul Timothy Spivey , Gary Raymond Williams
发明人： Girish Shivaji Patil , Paul Timothy Spivey , Gary Raymond Williams
IPC分类号： B41J205
CPC分类号： B41J2/1603 , B41J2/1631 , B41J2/1645 , B41J2202/03
摘要： An ink jet print head having ink passage ways formed in a radiation cured resin layer which is attached to a substrate and to a phenoxy butryal surface of a nozzle plate. The passageways are connected in fluid flow communication to an ink discharging outlet provided by an orifice plate. In order to form the passage ways in the resin layer, a resin composition is exposed to a radiation source in a predetermined pattern to cure certain regions of resin layer while other regions which provide the passage ways remain uncured. The uncured regions are removed from the resin layer leaving the desired passage ways. The resin composition to be used for forming the radiation curable layers is a resin composition including: a first difunctional epoxy compound; a second multifunctional crosslinking epoxy compound; a photoinitiator; a reactive silane, and a non-photoreactive.
摘要翻译：一种喷墨打印头，其具有形成在辐射固化树脂层中的油墨通道，该辐射固化树脂层附接到基板和喷嘴板的苯氧基丁醛表面。通道以流体流动连通的方式连接到由孔板提供的排墨口。为了在树脂层中形成通道，树脂组合物以预定图案暴露于辐射源，以固化树脂层的某些区域，而提供通道的其它区域保持未固化。从树脂层除去未固化的区域，留下所需的通道。用于形成可辐射固化层的树脂组合物是一种树脂组合物，其包括：第一双官能环氧化合物; 第二多功能交联环氧化合物; 光引发剂; 反应性硅烷和非光反应性。

4. 发明授权

US5907333A Ink jet print head containing a radiation curable resin layer 失效
标题翻译：含有可辐射固化树脂层的喷墨打印头
公开(公告)号：US5907333A
公开(公告)日：1999-05-25
申请号：US827564
申请日：1997-03-28
申请人： Girish Shivaji Patil , Paul Timothy Spivey , Gary Raymond Williams
发明人： Girish Shivaji Patil , Paul Timothy Spivey , Gary Raymond Williams
IPC分类号： B41J2/16 , C08F4/06 , C08G59/68 , C08K5/5419 , C08L63/00 , G03F7/038 , B41J2/235
CPC分类号： G03F7/038 , B41J2/1603 , B41J2/1607 , B41J2/1623 , B41J2/1631 , B41J2/1645 , C08G59/68 , C08L63/00 , B41J2202/03
摘要： This invention relates to an ink jet print head having ink passage ways formed in a radiation cured resin layer which is attached to a substrate. The passageways are connected in fluid flow communication to an ink discharging outlet provided by an orifice plate. In order to form the passage ways in the resin layer, a resin composition is exposed to a radiation source in a predetermined pattern to cure certain regions of resin layer while other regions which provide the passage ways remain uncured. The uncured regions are removed from the resin layer leaving the desired passage ways. The resin composition to be used for forming the radiation curable layers is a resin composition comprising: a first multifunctional epoxy compound; a second multifunctional compound; a photoinitiator; and a non-photoreactive solvent.
摘要翻译：本发明涉及一种喷墨打印头，其具有形成在附着于基板的辐射固化树脂层中的墨通道。通道以流体流动连通的方式连接到由孔板提供的排墨口。为了在树脂层中形成通道，树脂组合物以预定图案暴露于辐射源，以固化树脂层的某些区域，而提供通道的其它区域保持未固化。从树脂层除去未固化的区域，留下所需的通道。用于形成可辐射固化层的树脂组合物是一种树脂组合物，其包含：第一多官能环氧化合物; 第二种多功能化合物; 光引发剂; 和非光反应溶剂。

5. 发明授权

US06834937B2 Printhead corrosion protection 有权
标题翻译：打印头防腐蚀
公开(公告)号：US06834937B2
公开(公告)日：2004-12-28
申请号：US10218063
申请日：2002-08-13
申请人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
发明人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
IPC分类号： B41J214
CPC分类号： B41J2/1753 , B41J2/14072 , H05K3/28 , H05K3/361
摘要： A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.
摘要翻译：一种用于将电迹线封装在柔性电路或TAB电路上的方法，以及柔性电路或TAB电路与打印头基板之间的电连接以抑制其油墨腐蚀的方法。该方法包括将第一粘合剂施加到柔性电路或TAB电路的第一表面。将第二粘合剂施加到柔性电路或TAB电路的第一表面，由此第一和第二粘合剂有效地涂覆迹线和连接的暴露部分。第一和第二粘合剂是可热固化的环氧组合物，其彼此可混溶，并且第一粘合剂具有低于第二粘合剂的第二粘度秒触变指数的第一粘度和第一触变指数。在施加粘合剂之后，第一和第二粘合剂被固化。

6. 发明授权

US06357864B1 Tab circuit design for simplified use with hot bar soldering technique 有权
标题翻译： Tab电路设计，简化使用热棒焊接技术
公开(公告)号：US06357864B1
公开(公告)日：2002-03-19
申请号：US09464969
申请日：1999-12-16
申请人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
发明人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
IPC分类号： B41J205
CPC分类号： B41J2/14072 , B41J2/14024 , H05K3/3494 , H05K3/363 , H05K3/4084 , H05K2201/0394 , H05K2201/10681 , H05K2201/10977 , H05K2203/0195 , H05K2203/1311
摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.
摘要翻译：本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

7. 发明授权

US06179417B2 Process for reducing blockage in nozzle holes for ink jet printing 失效
标题翻译：用于减少用于喷墨打印的喷嘴孔中的堵塞的方法
公开(公告)号：US06179417B2
公开(公告)日：2001-01-30
申请号：US08368452
申请日：1995-01-04
申请人： Edwina Floyd Lowry , Paul Timothy Spivey
发明人： Edwina Floyd Lowry , Paul Timothy Spivey
IPC分类号： B41J2175
CPC分类号： B41J2/17559 , B41J2/17513
摘要： Blockage of the holes in an ink jet nozzle is greatly reduced by immersing the polyether polyurethane foam from the ink jet cartridge in cold water for a period of at least six hours.
摘要翻译：将来自喷墨墨盒的聚醚聚氨酯泡沫浸入冷水中至少6小时的时间，大大降低了喷墨嘴中孔的堵塞。

8. 发明授权

US07600853B2 Liquid applied seal for inkjet orifices 有权
标题翻译：用于喷墨孔的液体密封
公开(公告)号：US07600853B2
公开(公告)日：2009-10-13
申请号：US11281091
申请日：2005-11-17
申请人： Paige Anne Reardon Bensing , Karina Anne Krawczyk , Dell T. Rosa , Paul Timothy Spivey
发明人： Paige Anne Reardon Bensing , Karina Anne Krawczyk , Dell T. Rosa , Paul Timothy Spivey
IPC分类号： B41J2/165
CPC分类号： B41J2/1433
摘要： A liquid is applied by a bounded-region applicator such as a needle applicator over nozzle holes and over at least a continuous region close to the nozzle holes. The liquid is then cured to a solid before significant flow of the liquid into the nozzle holes. The liquid is chosen to cure to a solid which is sufficiently compliant that it deforms and leaves the nozzle holes under moderate pressure from a human hand or finger without breaking. Depending upon the material in which the nozzles are formed and the size of the nozzle holes, the liquid may be uniquely designed to incorporate resilient moieties or segments to satisfy these factors.
摘要翻译：液体通过限制区域施加器例如针施加器施加在喷嘴孔上并且在靠近喷嘴孔的至少连续区域上。然后在将液体显着流入喷嘴孔之前将液体固化成固体。选择液体固化成足够柔软的固体，使得其在来自人的手或手指的中等压力下变形并离开喷嘴孔而不破裂。取决于形成喷嘴的材料和喷嘴孔的尺寸，液体可以被独特地设计成结合弹性部分或部分以满足这些因素。

9. 发明申请

US20080312354A1 Removable Radiation Cured Composition And Process For Protecting A Micro-Fluid Ejection Head 审中-公开
标题翻译：可移除的辐射固化组合物和保护微流体喷射头的方法
公开(公告)号：US20080312354A1
公开(公告)日：2008-12-18
申请号：US11752334
申请日：2007-05-23
申请人： Karina Anne Krawczyk , Bart Allan Mansdorf , Dell T. Rosa , Paul Timothy Spivey
发明人： Karina Anne Krawczyk , Bart Allan Mansdorf , Dell T. Rosa , Paul Timothy Spivey
IPC分类号： C08G73/00 , C08F2/46
CPC分类号： C08F2/48 , B41J2/1753 , B41J2/17536 , C09D4/00 , C08F222/1006
摘要： There is disclosed a removable radiation cured member suitable for use in protecting a micro-fluid ejection head. Further, a reactant mixture suitable for sealing a micro-fluid ejection head comprising a vinyl-containing oligomer, a filler, and optionally a reactive diluent and/or a photoinitiator is disclosed.
摘要翻译：公开了适用于保护微流体喷射头的可移除的辐射固化部件。此外，公开了适用于密封包含含乙烯基的低聚物，填料和任选的反应性稀释剂和/或光引发剂的微流体喷射头的反应物混合物。

10. 发明授权

US07018503B2 Manufacturing method for ink jet pen 有权
公开(公告)号：US07018503B2
公开(公告)日：2006-03-28
申请号：US10408543
申请日：2003-04-07
申请人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
发明人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
IPC分类号： B32B7/14
CPC分类号： B41J2/1607 , B41J2/14024 , B41J2/1601 , B41J2/1623 , B41J2002/14362 , B41J2202/20 , Y10T29/42 , Y10T29/49083 , Y10T29/4913 , Y10T29/49401
摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式