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    • 1. 发明授权
    • Polymer memory having a ferroelectric polymer memory material with cell sizes that are asymmetric
    • 聚合物记忆体具有铁电聚合物记忆材料,其电池尺寸是不对称的
    • US07084446B2
    • 2006-08-01
    • US10648538
    • 2003-08-25
    • Mark S. Isenberger
    • Mark S. Isenberger
    • H01L29/94
    • G11C11/22
    • A polymer memory and its method of manufacture are provided. One multi-layer construction of the polymer memory has two sets of word lines and a set of bit lines between the word lines. The word lines of each set of word lines have center lines that are spaced by a first distance from one another, and the bit lines have center lines spaced by a second distance from one another, the second distance being less than the first distance. Three masking steps are required to manufacture the three layers of lines. Older-technology machinery and masks are used to form the two layers of word lines, and new-technology machinery and masks are used to manufacture the bit lines. As such, only 33% of the machinery has to be upgraded for manufacturing one multi-layer construction. The entire polymer memory has four multi-layer constructions having a total of 12 layers of lines, of which four layers require new-technology machinery. The multi-layer constructions are formed on underlying electronics. The underlying electronics are constructed utilizing 28 masking steps, 4 of the 28 masking steps requiring new-technology machinery. As such, the manufacture of the entire polymer memory requires 40 masking steps, 8 of which require new-technology machinery. A 20% machinery upgrade is thus required for manufacturing the entire polymer memory, which is generally regarded as acceptable when upgrading machinery from one generation to the next.
    • 提供聚合物记忆及其制造方法。 聚合物存储器的一个多层结构具有两组字线和字线之间的一组位线。 每组字线的字线具有彼此隔开第一距离的中心线,并且位线具有彼此隔开第二距离的中心线,第二距离小于第一距离。 需要三个掩蔽步骤来制造三层线。 旧技术机械和掩模用于形成两层字线,新技术机械和掩模用于制造位线。 因此,只有33%的机械必须升级制造一个多层建筑。 整个聚合物存储器具有四个多层结构,共有12层线,其中四层需要新技术的机械。 多层结构形成在底层电子设备上。 底层电子设备采用28个屏蔽步骤,28个屏蔽步骤中的4个需要新技术机械。 因此,整个聚合物记忆体的制造需要40个掩模步骤,其中8个需要新技术的机械。 因此,制造整个聚合物记忆体需要20%的机械升级,在将机器从一代升级到下一代时通常被认为是可接受的。