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    • 1. 发明授权
    • LED array capable of reducing uneven brightness distribution
    • LED阵列能够减少不均匀的亮度分布
    • US08937323B2
    • 2015-01-20
    • US13598951
    • 2012-08-30
    • Mamoru MiyachiTatsuma SaitoMitsunori Harada
    • Mamoru MiyachiTatsuma SaitoMitsunori Harada
    • H01L29/18H01L27/15H01L33/20H01L33/38
    • H01L27/153H01L33/20H01L33/385H01L33/387
    • A light emitting element in use for an LED array comprises an electrode layer, a semiconductor light emitting layer consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first wiring layer formed along and in parallel to one side of the semiconductor light emitting layer, and a plurality of second wiring layers extending from the first wiring layer to the semiconductor light emitting layer and electrically connected to the n-type semiconductor layer on a surface of the semiconductor light emitting layer, wherein a plane shape of the semiconductor light emitting layer comprises two short sides including a portion inclined from a line perpendicular to a upper and a lower sides, and a vertical line from a vertex where the upper side and the short side meet crosses the lower side of the adjacent light emitting element.
    • 用于LED阵列的发光元件包括电极层,由p型半导体层,有源层和n型半导体层组成的半导体发光层,沿着并且与 半导体发光层的一侧,以及从第一布线层向半导体发光层延伸并与半导体发光层的表面电连接的n型半导体层的多个第二布线层,其中, 半导体发光层的平面形状包括两个短边,包括从垂直于上侧和下侧的直线倾斜的部分,以及来自上侧和短边相交的顶点的垂直线与 相邻的发光元件。
    • 3. 发明授权
    • Semiconductor light emitting device and vehicle light
    • 半导体发光装置和车灯
    • US08702285B2
    • 2014-04-22
    • US13218960
    • 2011-08-26
    • Mitsunori HaradaYasuyuki Miyake
    • Mitsunori HaradaYasuyuki Miyake
    • F21V1/00
    • H01L33/508F21S41/141H01L33/502H01L2224/13
    • A vehicle light is provided which can form a light distribution pattern having a clear cut-off line. The vehicle light can include a semiconductor light emitting device as a light source. The semiconductor light emitting device can include a semiconductor light emitting element having a light emission surface thereof having a first end and a second end and at least one light extracting layer deposited on the light emission surface and including a wavelength conversion layer, and the light extracting layer includes an optical characteristic that can change from the first end to the second end in a direction parallel to the light emission surface so that the semiconductor light emitting device forms a luminance distribution with a maximum luminance at the first end and a minimum luminance at the second end.
    • 提供一种能够形成具有清晰的切断线的配光图案的车辆用灯。 车辆灯可以包括作为光源的半导体发光器件。 半导体发光器件可以包括其发光表面具有第一端和第二端的半导体发光元件和沉积在发光表面上并包括波长转换层的至少一个光提取层,并且光提取 层包括可以在平行于发光表面的方向上从第一端到第二端改变的光学特性,使得半导体发光器件形成具有第一端处的最大亮度的亮度分布和 第二端
    • 4. 发明授权
    • Sustained-release polymer micelle disruptable by HDL
    • 持续释放的聚合物胶束可被HDL破坏
    • US08574601B2
    • 2013-11-05
    • US13258797
    • 2011-02-07
    • Yasuki KatoMitsunori HaradaMiho Ohuchi
    • Yasuki KatoMitsunori HaradaMiho Ohuchi
    • A61K38/02A61K9/00
    • A61K9/1075A61K9/0019
    • A pharmaceutical composition containing a drug encapsulated in a polymer micelle composition containing a first block copolymer having affinity with HDL and a second block copolymer having affinity with a lipoprotein excluding HDL, each block copolymer having a hydrophobic polymer chain segment and a hydrophilic polymer chain segment such that a plurality of block copolymers arrange radially with the hydrophobic segments directed inward and the hydrophilic segments directed outward. In the composition, a detachment of the first block copolymer is induced by HDL adhesion which forms a gap and promotes the release of a drug encapsulated, while the second block copolymer excluding an affinity with HDL controls a release speed of the drug encapsulated.
    • 一种药物组合物,其包含包含在与HDL亲和性的第一嵌段共聚物的聚合物胶束组合物中的药物和与除了HDL之外的脂蛋白具有亲和性的第二嵌段共聚物,每个嵌段共聚物具有疏水性聚合物链段和亲水性聚合物链段, 多个嵌段共聚物径向布置,其中疏水片段向内指向,亲水片段向外指向。 在组合物中,第一嵌段共聚物的脱离是由HDL粘附引起的,其形成间隙并促进包封的药物的释放,而不包括与HDL的亲和力的第二嵌段共聚物控制包封的药物的释放速度。
    • 6. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE AND VEHICLE LIGHT
    • 半导体发光装置和车辆灯
    • US20120051075A1
    • 2012-03-01
    • US13218960
    • 2011-08-26
    • Mitsunori HaradaYasuyuki Miyake
    • Mitsunori HaradaYasuyuki Miyake
    • B60Q1/04
    • H01L33/508F21S41/141H01L33/502H01L2224/13
    • A vehicle light is provided which can form a light distribution pattern having a clear cut-off line. The vehicle light can include a semiconductor light emitting device as a light source. The semiconductor light emitting device can include a semiconductor light emitting element having a light emission surface thereof having a first end and a second end and at least one light extracting layer deposited on the light emission surface and including a wavelength conversion layer, and the light extracting layer includes an optical characteristic that can change from the first end to the second end in a direction parallel to the light emission surface so that the semiconductor light emitting device forms a luminance distribution with a maximum luminance at the first end and a minimum luminance at the second end.
    • 提供一种能够形成具有清晰的切断线的配光图案的车辆用灯。 车辆灯可以包括作为光源的半导体发光器件。 半导体发光器件可以包括其发光表面具有第一端和第二端的半导体发光元件和沉积在发光表面上并包括波长转换层的至少一个光提取层,并且光提取 层包括可以在平行于发光表面的方向上从第一端到第二端改变的光学特性,使得半导体发光器件形成具有第一端处的最大亮度的亮度分布和 第二端
    • 8. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
    • 半导体发光装置及其制造方法
    • US20100090229A1
    • 2010-04-15
    • US12577714
    • 2009-10-12
    • Mitsunori HARADA
    • Mitsunori HARADA
    • H01L33/00
    • H01L25/0753H01L33/508H01L2224/05553H01L2224/45144H01L2224/49175H01L2224/8592H01L2933/0041H01L2924/00
    • A light emitting apparatus can have a front luminous intensity distribution having a sharp difference at the interface between the light emitting area and the surrounding non-light emitting area (outer environment) so as to suppress or prevent light color unevenness. The semiconductor light emitting apparatus can include a substrate, a plurality of light emitting elements each having a top surface as a light emitting surface and disposed on the substrate with a predetermined gap between the adjacent light emitting elements, bridge portions each disposed at the gap between the adjacent light emitting elements so as to connect the light emitting elements, and a wavelength conversion layer disposed over the top surfaces of the plurality of the light emitting elements and the bridge portions entirely. The wavelength conversion layer can have a decreased thickness at least around its peripheral area and gradually tapering to its end portion.
    • 发光装置可以具有在发光区域和周围的非发光区域(外部环境)之间的界面处具有尖锐差异的前发光强度分布,以便抑制或防止光颜色不均匀。 半导体发光装置可以包括基板,多个发光元件,每个发光元件具有顶表面作为发光表面,并且在相邻的发光元件之间以预定的间隙设置在基板上, 相邻的发光元件,以连接发光元件,以及波长转换层,其设置在多个发光元件和桥接部分的顶表面上。 波长转换层可以至少在其周边区域附近具有减小的厚度,并逐渐变细到其端部。
    • 10. 发明授权
    • Method for manufacturing and semiconductor light emitting device
    • 制造方法和半导体发光装置
    • US07442563B2
    • 2008-10-28
    • US11237805
    • 2005-09-29
    • Mitsunori Harada
    • Mitsunori Harada
    • H01L21/00
    • H01L33/508H01L2224/48091H01L2933/0041H01L2924/00014
    • A method for manufacturing a semiconductor light emitting device can include providing a housing having a cavity and a power feed line, a light emitting element connected to the power feed line on a bottom face of the cavity, and a wavelength conversion layer provided within the cavity and containing a wavelength conversion material. When forming the wavelength conversion layer, a first resin with little or no wavelength conversion material can be filled inside the cavity such that the light emitting element surface is slightly exposed and a surface of the first resin is formed in a bowl shape. Then, a second resin with wavelength conversion material contained therein can be filled inside the cavity over the bowl-shaped first resin. These resins can be heated to be hardened. During heating, the viscosities of the resins are reduced to cause the wavelength conversion material to migrate and deposit around the light emitting element.
    • 一种制造半导体发光器件的方法可以包括提供具有空腔和馈电线的壳体,连接到空腔底面上的馈电线的发光元件,以及设置在空腔内的波长转换层 并含有波长转换材料。 当形成波长转换层时,可以在空腔内填充具有很少或不具有波长转换材料的第一树脂,使得发光元件表面稍微露出,并且第一树脂的表面形成为碗形。 然后,其中容纳有波长转换材料的第二树脂可以填充在碗形第一树脂的空腔内。 这些树脂可被加热硬化。 在加热过程中,树脂的粘度降低,导致波长转换材料迁移并沉积在发光元件周围。