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    • 3. 发明申请
    • SEMICONDUCTOR MATERIAL HANDLING SYSTEM
    • 半导体材料处理系统
    • US20070269302A1
    • 2007-11-22
    • US11751792
    • 2007-05-22
    • Won Geyung KIMHyun Suk JANG
    • Won Geyung KIMHyun Suk JANG
    • B66C23/00
    • H01L21/67766B25J9/042H01L21/68707Y10S414/141
    • A semiconductor material handling system including a frame mounting a wafer cassette and a plurality of load ports thereon, and a wafer moving robot including a robot body which has a lifting member mounted in the frame and vertically moving along a predetermined lifting shaft, an articulated arm which has a driving link mounted in the lifting member and a plurality of driven links whose end part transversely moving along the frame having the load ports, a swing unit which is mounted in the end part of the driven links and rotates along a vertical rotation shaft, and a crossing arm which comprises a base mounted in the swing unit, a plurality of sliding units mounted in the base and reciprocating transversely, and a wafer hand mounted in the sliding units and picking up a wafer from the wafer cassette and storing the wafer back in the wafer cassette.
    • 一种半导体材料处理系统,包括:安装晶片盒和其上的多个负载端口的框架;以及晶片移动机器人,其包括机器人主体,所述机器人主体具有安装在所述框架中的提升构件并沿着预定的提升轴垂直移动;铰接臂 其具有安装在所述提升构件中的驱动连杆和多个从动构件,所述多个从动构件的端部沿着具有所述负载口的框架横向移动;摆动单元,其安装在所述从动连杆的端部中并沿着垂直旋转轴 以及交叉臂,其包括安装在所述摆动单元中的基座,安装在所述基座中并横向往复移动的多个滑动单元,以及安装在所述滑动单元中的晶片手,并从所述晶片盒拾取晶片并将所述晶片 回到晶片盒中。
    • 6. 发明授权
    • Semiconductor material handling system
    • 半导体材料处理系统
    • US07661921B2
    • 2010-02-16
    • US11751792
    • 2007-05-22
    • Won Geyung KimHyun Suk Jang
    • Won Geyung KimHyun Suk Jang
    • B66C23/00
    • H01L21/67766B25J9/042H01L21/68707Y10S414/141
    • A semiconductor material handling system including a frame mounting a wafer cassette and a plurality of load ports thereon, and a wafer moving robot including a robot body which has a lifting member mounted in the frame and vertically moving along a predetermined lifting shaft, an articulated arm which has a driving link mounted in the lifting member and a plurality of driven links whose end part transversely moving along the frame having the load ports, a swing unit which is mounted in the end part of the driven links and rotates along a vertical rotation shaft, and a crossing arm which comprises a base mounted in the swing unit, a plurality of sliding units mounted in the base and reciprocating transversely, and a wafer hand mounted in the sliding units and picking up a wafer from the wafer cassette and storing the wafer back in the wafer cassette.
    • 一种半导体材料处理系统,包括:安装晶片盒和其上的多个负载端口的框架;以及晶片移动机器人,其包括机器人主体,所述机器人主体具有安装在所述框架中的提升构件并沿着预定的提升轴垂直移动;铰接臂 其具有安装在所述提升构件中的驱动连杆和多个从动构件,所述多个从动构件的端部沿着具有所述负载口的框架横向移动;摆动单元,其安装在所述从动连杆的端部中并沿着垂直旋转轴 以及交叉臂,其包括安装在所述摆动单元中的基座,安装在所述基座中并横向往复移动的多个滑动单元,以及安装在所述滑动单元中的晶片手,并从所述晶片盒拾取晶片并将所述晶片 回到晶片盒中。