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1. 发明授权

US5326442A Apparatus for the galvanic treatment of articles 失效
标题翻译：用于电镀处理物品的设备
公开(公告)号：US5326442A
公开(公告)日：1994-07-05
申请号：US26488
申请日：1993-03-04
申请人： Dieter C. Schmid
发明人： Dieter C. Schmid
IPC分类号： C25D17/00 , H05K3/24 , C25D17/28
CPC分类号： H05K3/241 , C25D17/00 , C25D17/005
摘要： An electroplating apparatus (11) has a conveying system (19), which passes the printed circuit boards on a horizontal passage path through the treatment chamber (13). They are contacted by tong-like grippers (32), which run upstream of the leading edge (63) of the circuit board and in this area engage thereon from above and below. The gripers (32) are fixed to transverse beams (29), which are guided on both sides by chains (26) and electrically contacted by contact rails (39). Thus, the circuit boards (12) are moved in a horizontal, central path and simultaneously contacted. Alternatively the circuit boards (12) can be conveyed between electrically connected contact roll pairs (21), which are conveyed by an upper and lower conveyor (20a, b) and automatically rotate in order to convey the circuit boards at high speed.
摘要翻译：电镀设备（11）具有输送系统（19），该输送系统使经过处理室（13）的水平通道的印刷电路板通过。它们通过钳形夹持器（32）接触，该夹持器在电路板的前缘（63）的上游延伸，并且在该区域中从上方和下方接合。夹持器（32）固定到横梁（29）上，横梁（29）在两侧由链条（26）引导并与接触导轨（39）电接触。因此，电路板（12）在水平的中心路径中移动并同时接触。或者，可以在电连接的接触辊对（21）之间传送电路板（12），所述电连接的接触辊对（21）由上部和下部传送器（20a，b）输送并自动旋转以便高速地传送电路板。

2. 发明授权

US5914016A Apparatus for the treatment of articles 失效
标题翻译：用于治疗物品的装置
公开(公告)号：US5914016A
公开(公告)日：1999-06-22
申请号：US892701
申请日：1997-07-15
申请人： Dieter C. Schmid
发明人： Dieter C. Schmid
IPC分类号： C25D17/00 , H05K3/24 , C25D17/28
CPC分类号： H05K3/241 , C25D17/00 , C25D17/005
摘要： In order in a continuous electroplating plant to avoid the problem of undesired metal application or metallization on contact faces (25), which e.g. occur in the case of rolling contacting of the article (13) to be plated, e.g. a printed circuit board, on contact rollers or disks (15) are provided individual contact sectors (24), which are alternately anodically and cathodically supplied with power via a commutator (27) located outside the treatment chamber (11). The contact sectors (24) are mutually overlapping and are staggered e.g. in sloping, arrow-like or step-like manner, so that a continuous contacting with respect to the article (13) is possible.Contacting takes place in a lateral portion (45) of the treatment chamber (11), which is admittedly filled with treatment fluid (40), but is largely shielded with respect thereto, so that the metal application tendency is reduced. A partly permeable partition (56) protects the contact faces (25) from being contaminated by particles detached from the auxiliary, deplating cathode (55).
摘要翻译：为了在连续的电镀设备中以避免在接触面（25）上不期望的金属应用或金属化的问题，在待镀的制品（13）的滚动接触的情况下发生。设置在接触辊或盘（15）上的印刷电路板，单独的接触扇区（24），其经由位于处理室（11）外部的换向器（27）阳极和阴极交替供电。接触扇区（24）相互重叠并且例如交错。以倾斜，箭头状或阶梯状的方式，使得可以对物品（13）进行连续接触。在处理室（11）的横向部分（45）中进行接触，该处理室不可否认地填充有处理流体（40），但是相对于其被大量屏蔽，从而减少了金属施加趋势。部分可渗透的隔板（56）保护接触面（25）免受从辅助脱镀阴极（55）分离的颗粒的污染。

3. 发明授权

US5297568A Process and apparatus for treatment of board-like articles 失效
标题翻译：用于处理板状制品的方法和装置
公开(公告)号：US5297568A
公开(公告)日：1994-03-29
申请号：US847708
申请日：1992-03-06
申请人： Dieter C. Schmid
发明人： Dieter C. Schmid
IPC分类号： B05C9/04 , B05C13/02 , H05K3/00 , H05K13/00 , B08B3/02
CPC分类号： B05C13/02 , B05C9/04 , H05K13/0061 , H05K3/0085 , Y10S134/902
摘要： The process and apparatus more particularly relate to the manufacture of printed circuit boards. They are successively treated with a liquid on their top and bottom and intermediately turned over. The boards (23) are horizontally supplied to the turning over station (16) and after turning over are supplied to the station for the treatment of the second side thereof.
摘要翻译：该方法和装置更具体涉及印刷电路板的制造。它们在其顶部和底部上依次用液体处理并且中间地翻转。板（23）被水平地供给到转向站（16），并且翻转之后被提供给站，用于处理其第二侧。

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