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    • 1. 发明授权
    • Enhancement-depletion mode inverter with two transistor architectures
    • 具有两个晶体管架构的增强耗尽型逆变器
    • US09368490B2
    • 2016-06-14
    • US14526634
    • 2014-10-29
    • Carolyn Rae EllingerShelby Forrester Nelson
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L27/088H01L29/786
    • H01L27/0883H01L27/1225H01L27/1251H01L29/7869
    • An enhancement-depletion-mode inverter includes a load transistor and a drive transistor. The load transistor has a top gate architecture with a first source, a first drain, a load channel region, a first semiconductor layer, and a first gate electrode. A load gate dielectric is in the load channel region, and has a load dielectric thickness. The load transistor is configured to operate in a depletion mode. The drive transistor has a bottom gate architecture with a second source, a second drain, a drive channel region, a second semiconductor layer, and a second gate electrode. A drive gate dielectric is in the drive channel region, and has a drive dielectric thickness that is different from the load dielectric thickness. The drive transistor is configured to operate in a normal mode or an enhancement mode. The first source is electrically connected to the second drain and the first gate.
    • 增强耗尽型逆变器包括负载晶体管和驱动晶体管。 负载晶体管具有顶栅结构,其具有第一源极,第一漏极,负载沟道区域,第一半导体层和第一栅极电极。 负载栅极电介质位于负载沟道区域中,并具有负载介质厚度。 负载晶体管被配置为在耗尽模式下工作。 驱动晶体管具有底栅结构,其具有第二源极,第二漏极,驱动沟道区,第二半导体层和第二栅电极。 驱动栅极电介质位于驱动沟道区域中,并且具有不同于负载介质厚度的驱动电介质厚度。 驱动晶体管被配置为在正常模式或增强模式下操作。 第一源电连接到第二漏极和第一栅极。
    • 2. 发明授权
    • Bottom gate TFT with multilayer passivation
    • 底栅TFT多层钝化
    • US09299853B1
    • 2016-03-29
    • US14487161
    • 2014-09-16
    • Carolyn Rae EllingerShelby Forrester Nelson
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L29/12H01L29/786
    • H01L29/78696H01L29/7869
    • A transistor includes a gate in contact with a substrate. A gate insulating layer is in contact with at least the gate. An inorganic semiconductor layer is in contact with the gate insulating layer. There is a source electrode in contact with a first portion of the inorganic semiconductor layer and a drain electrode in contact with a second portion of the inorganic semiconductor layer, and the source electrode and the drain electrode are separated by a gap. There is a multilayer insulating structure in contact with at least the inorganic semiconductor layer in the gap. The multilayer structure includes an inorganic dielectric layer having a first pattern defining a first area; and a polymer structure having a second pattern defining a second area. The second area is located within the first area and the polymer structure is in contact with the semiconductor layer in the gap.
    • 晶体管包括与衬底接触的栅极。 栅极绝缘层至少与栅极接触。 无机半导体层与栅极绝缘层接触。 存在与无机半导体层的第一部分接触的源电极和与无机半导体层的第二部分接触的漏电极,并且源电极和漏电极被间隙分开。 存在与间隙中的至少无机半导体层接触的多层绝缘结构。 多层结构包括具有限定第一区域的第一图案的无机介电层; 以及具有限定第二区域的第二图案的聚合物结构。 第二区域位于第一区域内,聚合物结构与间隙中的半导体层接触。
    • 5. 发明授权
    • VTFT with polymer core
    • VTFT与聚合物芯
    • US09117914B1
    • 2015-08-25
    • US14198628
    • 2014-03-06
    • Carolyn Rae EllingerShelby Forrester Nelson
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L29/78H01L29/786
    • H01L29/78642H01L29/78603H01L29/7869
    • A transistor includes a polymeric material post on a substrate. An inorganic material cap, covering the post, extends beyond an edge of the post to define a reentrant profile. A conformal conductive material gate layer is over the edge of the post in the reentrant profile. A conformal insulating material layer is on the gate layer in the reentrant profile. A conformal semiconductor material layer is on the insulating material layer in the reentrant profile. A first electrode is in contact with a first portion of the semiconductor layer over the cap. A second electrode is in contact with a second portion of the semiconductor layer over the substrate and not over the post, and adjacent to the edge of the post in the reentrant profile such that a distance between the first electrode and second electrode is greater than zero when measured orthogonally to the substrate surface.
    • 晶体管包括在基板上的聚合材料柱。 覆盖柱的无机材料帽延伸超过柱的边缘以限定折返轮廓。 保形导电材料栅极层位于折返轮廓中的柱的边缘上。 在凹凸轮廓中的栅极层上保形绝缘材料层。 保形半导体材料层位于折入型材中的绝缘材料层上。 第一电极与帽上的半导体层的第一部分接触。 第二电极与衬底上的半导体层的第二部分接触,而不是在柱上,并且邻近在折返轮廓中的柱的边缘,使得第一电极和第二电极之间的距离大于零 当与基底表面正交测量时。
    • 7. 发明申请
    • ENHANCEMENT-DEPLETION MODE INVERTER WITH TWO TRANSISTOR ARCHITECTURES
    • 具有两个晶体管结构的增强型绝缘模式逆变器
    • US20160126241A1
    • 2016-05-05
    • US14526634
    • 2014-10-29
    • Carolyn Rae EllingerShelby Forrester Nelson
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L27/088H01L29/786
    • H01L27/0883H01L27/1225H01L27/1251H01L29/7869
    • An enhancement-depletion-mode inverter includes a load transistor and a drive transistor. The load transistor has a top gate architecture with a first source, a first drain, a load channel region, a first semiconductor layer, and a first gate electrode. A load gate dielectric is in the load channel region, and has a load dielectric thickness. The load transistor is configured to operate in a depletion mode. The drive transistor has a bottom gate architecture with a second source, a second drain, a drive channel region, a second semiconductor layer, and a second gate electrode. A drive gate dielectric is in the drive channel region, and has a drive dielectric thickness that is different from the load dielectric thickness. The drive transistor is configured to operate in a normal mode or an enhancement mode. The first source is electrically connected to the second drain and the first gate.
    • 增强耗尽型逆变器包括负载晶体管和驱动晶体管。 负载晶体管具有顶栅结构,其具有第一源极,第一漏极,负载沟道区域,第一半导体层和第一栅极电极。 负载栅极电介质位于负载沟道区域中,并具有负载介质厚度。 负载晶体管被配置为在耗尽模式下工作。 驱动晶体管具有底栅结构,其具有第二源极,第二漏极,驱动沟道区,第二半导体层和第二栅电极。 驱动栅极电介质位于驱动沟道区域中,并且具有不同于负载介质厚度的驱动电介质厚度。 驱动晶体管被配置为在正常模式或增强模式下操作。 第一源电连接到第二漏极和第一栅极。
    • 8. 发明申请
    • BOTTOM GATE TFT WITH MULTILAYER PASSIVATION
    • 底层门TFT多层钝化
    • US20160079440A1
    • 2016-03-17
    • US14487161
    • 2014-09-16
    • Carolyn Rae EllingerShelby Forrester Nelson
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L29/786
    • H01L29/78696H01L29/7869
    • A transistor includes a gate in contact with a substrate. A gate insulating layer is in contact with at least the gate. An inorganic semiconductor layer is in contact with the gate insulating layer. There is a source electrode in contact with a first portion of the inorganic semiconductor layer and a drain electrode in contact with a second portion of the inorganic semiconductor layer, and the source electrode and the drain electrode are separated by a gap. There is a multilayer insulating structure in contact with at least the inorganic semiconductor layer in the gap. The multilayer structure includes an inorganic dielectric layer having a first pattern defining a first area; and a polymer structure having a second pattern defining a second area. The second area is located within the first area and the polymer structure is in contact with the semiconductor layer in the gap.
    • 晶体管包括与衬底接触的栅极。 栅极绝缘层至少与栅极接触。 无机半导体层与栅极绝缘层接触。 存在与无机半导体层的第一部分接触的源电极和与无机半导体层的第二部分接触的漏电极,并且源电极和漏电极被间隙分开。 存在与间隙中的至少无机半导体层接触的多层绝缘结构。 多层结构包括具有限定第一区域的第一图案的无机介电层; 以及具有限定第二区域的第二图案的聚合物结构。 第二区域位于第一区域内,聚合物结构与间隙中的半导体层接触。
    • 10. 发明授权
    • Offset independently operable VTFT electrodes
    • 偏移可独立操作的VTFT电极
    • US09236486B2
    • 2016-01-12
    • US14198647
    • 2014-03-06
    • Shelby Forrester NelsonCarolyn Rae Ellinger
    • Shelby Forrester NelsonCarolyn Rae Ellinger
    • H01L29/80H01L29/76H01L29/94H01L29/66H01L29/786H01L27/12
    • H01L29/78642H01L27/1218H01L27/1222H01L27/1262H01L29/42384H01L29/66969H01L29/78603H01L29/7869H01L29/78696
    • A multiple vertical transistor device includes a polymeric material post on a substrate. An inorganic material cap extends beyond first and second edge of the post to define first and second reentrant profiles. First and second portions of a conformal conductive gate layer define first and second gates in the first and second reentrant profiles, respectively. A conformal electrically insulating layer maintains the first and second reentrant profiles and is in contact with the first and second gates. First and second portions of a semiconductor layer, maintaining the first and second reentrant profiles, are in contact with the conformal electrically insulating layer that is in contact with the first and second gates, respectively. The first and second portions of the semiconductor layer are electrically independent from each other. First and second electrodes are associated with the first gate. Third and fourth electrodes are associated with the second gate.
    • 多垂直晶体管器件包括在衬底上的聚合物材料柱。 无机材料帽延伸超过柱的第一和第二边缘以限定第一和第二折痕轮廓。 共形导电栅极层的第一部分和第二部分分别在第一和第二折入轮廓中限定第一和第二栅极。 保形电绝缘层保持第一和第二凹槽轮廓并与第一和第二闸门接触。 保持第一和第二折入轮廓的半导体层的第一和第二部分分别与与第一和第二栅极接触的保形电绝缘层接触。 半导体层的第一和第二部分彼此电独立。 第一和第二电极与第一栅极相关联。 第三和第四电极与第二栅极相关联。