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    • 3. 发明公开
    • 레이저 다이오드 및 그 제조방법
    • 激光二极管及其制造方法
    • KR1020070092030A
    • 2007-09-12
    • KR1020060021929
    • 2006-03-08
    • 엘지전자 주식회사
    • 최윤호
    • H01S5/22
    • H01S5/2216H01S5/0205H01S5/1237
    • A laser diode and a manufacturing method thereof are provided to improve the thermal-stress resistant property of the laser diode by effectively radiating the heat from an activation layer through a metal layer and to improve the reliability of laser diode. Plural grooves are formed at a lower portion of a substrate. A metal layer fills in the plural grooves and is formed at the lower portion of the substrate. An n-contact layer(121) is formed on the substrate. A portion of the n-contact layer is etched to a predetermined depth. An n-electrode(140b) is formed on the etched portion on the n-contact layer. An n-cladding layer(122) is formed on the rest portion of the n-contact layer. A thin structure is formed on the n-cladding layer and contains an n-transport layer, an activation layer, an electron blocking layer, and a p-transport layer. A p-cladding layer(127) is formed on the p-transport layer and contains a ridge on an upper portion thereof. A p-contact layer(128) is formed on the ridge of the p-cladding layer. An insulation film(130) is formed to enclose an exposed surface of the p-cladding layer and an external surface of the p-contact layer. An insulation film includes an aperture for exposing the p-contact layer. A p-electrode(140a) fills in the aperture of the insulation film and is electrically connected to the p-contact layer.
    • 提供一种激光二极管及其制造方法,通过有效地通过金属层辐射活化层的热量,提高激光二极管的耐热性,提高激光二极管的可靠性。 多个槽形成在基板的下部。 金属层填充在多个槽中并形成在基板的下部。 在基板上形成n接触层(121)。 n接触层的一部分被蚀刻到预定深度。 n电极(140b)形成在n接触层上的蚀刻部分上。 n包覆层(122)形成在n接触层的其余部分上。 在n包层上形成薄的结构,并且包含n-传输层,活化层,电子阻挡层和p-传输层。 在p-传输层上形成p包覆层(127),并在其上部包含脊。 p接触层(128)形成在p包覆层的脊上。 形成绝缘膜(130)以包围p包覆层的露出表面和p接触层的外表面。 绝缘膜包括用于露出p接触层的孔。 p电极(140a)填充绝缘膜的孔径并电连接到p接触层。