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    • 4. 发明公开
    • 반도체 디바이스 제조 방법 및 반도체 디바이스
    • 制造半导体器件的方法和通过方法获得的半导体器件
    • KR1020050057398A
    • 2005-06-16
    • KR1020057004582
    • 2003-08-21
    • 코닌클리케 필립스 엔.브이.
    • 데커로날드반더푸텐잔비피에이치하벤스라몬제이
    • H01L21/335H01L27/00
    • H01L29/66712H01L21/78H01L29/6631H01L29/781
    • The invention relates to a method of manufacturing a semiconductor device (10) in which, in a semiconductor body (1) with a temporary substrate (2), at least one semiconductor element (3) is formed which, on a side of the semiconductor body (1) opposite to the substrate (2), is provided with at least one connection region (4), and, on the said side, a dielectric (5) is formed and patterned to leave free the connection region (4), after which a metal layer (6) is deposited over the dielectric (5) so as to be in contact with the connection region (4), which metal layer (6) serves as an electric connection conductor of the connection region (4), after which the temporary substrate (2) is removed and the metal layer (6) also serves as a substrate of the device (10). According to the invention, before the metal layer (6) is deposited, there is formed, around the patterned part of the dielectric (5) and around the semiconductor element (3), an annular region (7) of a resin having a larger thickness than the dielectric (5), and the metal layer (6) is deposited within the rectangular annular region (7). In this way, an individual device (10) can readily be formed after the metal layer (6) has been deposited, preferably by pushing the device (10) out of the region (7). Preferably, a (different) photoresist is chosen for the dielectric (5) and the region (7). The invention also comprises a semiconductor device (10) obtained in this way.
    • 本发明涉及一种制造半导体器件(10)的方法,其中在具有临时衬底(2)的半导体本体(1)中,形成至少一个半导体元件(3),其在半导体 本体(1)与基板(2)相对设置有至少一个连接区域(4),并且在所述侧面上形成有电介质(5)并图案化以使连接区域(4)免费, 之后将金属层(6)沉积在电介质(5)上以与连接区域(4)接触,该金属层(6)用作连接区域(4)的电连接导体, 之后移除临时衬底(2),金属层(6)也用作器件(10)的衬底。 根据本发明,在金属层(6)沉积之前,在电介质(5)的图案化部分周围形成围绕半导体元件(3)的环形区域(7),具有较大的 厚度比电介质(5)厚,并且金属层(6)沉积在矩形环形区域(7)内。 以这种方式,优选地,通过将​​装置(10)推出区域(7)之后,可以在沉积金属层(6)之后容易地形成单个装置(10)。 优选地,为电介质(5)和区域(7)选择(不同的)光致抗蚀剂。 本发明还包括以这种方式获得的半导体器件(10)。