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    • 1. 发明公开
    • 다층 인쇄회로기판의 절연 조성물, 및 이를 절연층으로 포함하는 다층 인쇄회로기판
    • 用于多层印刷电路板的绝缘组合物和包含绝缘层的多层印刷电路板
    • KR1020140030890A
    • 2014-03-12
    • KR1020120097617
    • 2012-09-04
    • 삼성전기주식회사
    • 정형미심지혜전기수이화영
    • H01B3/40H01B17/62H05K1/02
    • H01B3/40H01B3/446
    • The present invention relates to an interlayer insulation composition for a multilayer printed circuit board comprising: an epoxy-based resin including a naphthalene deformation epoxy resin, a cresol novolac epoxy resin and a rubber deformation epoxy resin; a thermoplastic resin; a curing agent; a hardening accelerator; and an inorganic filler, and a multilayer printed circuit board comprising the same as an insulation layer. The present invention is able to provide an insulation composition which exhibits excellent adhesive strength of an insulation layer and a Cu layer in order to secure reliability and operate a final board normally. Additionally, the present invention is able to secure the reliability of the board, even when the content of the inorganic filer is increased, by maintaining a low coefficient of thermal expansion by including appropriate amounts of epoxy resins and thermoplastic resins and increasing toughness of an insulation film without brittleness. [Reference numerals] (AA) Exfoliation (mm/mm); (BB) Example 2; (CC) Comparative example 2
    • 本发明涉及一种用于多层印刷电路板的层间绝缘组合物,包括:包含萘变形环氧树脂,甲酚酚醛环氧树脂和橡胶变形环氧树脂的环氧树脂; 热塑性树脂; 固化剂; 硬化促进剂; 和无机填料,以及包含与绝缘层相同的多层印刷电路板。 本发明能够提供绝缘组合物,其绝缘层和Cu层具有优异的粘合强度,以便确保可靠性并正常地操作最终板。 此外,即使通过包含适量的环氧树脂和热塑性树脂保持低的热膨胀系数,并且提高绝缘性的韧性,本发明也能确保板的可靠性,即使无机填料的含量增加 电影没有脆性。 (附图标记)(AA)剥离(mm / mm); (BB)实施例2; (CC)比较例2