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    • 6. 发明公开
    • 염 및 포토레지스트 조성물
    • 盐和光电组合物
    • KR1020120033224A
    • 2012-04-06
    • KR1020110073918
    • 2011-07-26
    • 스미또모 가가꾸 가부시끼가이샤
    • 안류유카코이치카와코지
    • C07D333/46C07C309/70G03F7/004G03F7/00
    • C07D333/46C07C309/70G03F7/00G03F7/0045G03F7/0046
    • PURPOSE: A photoresist composition and salt are provided to be used as an acid generator and to obtain photoresist pattern. CONSTITUTION: A salt for an acid generator is denoted by chemical formula I. The acid generator contains the salt of chemical formula I. A photoresist composition contains the acid generator and instable group in acid. The composition additionally contains basic compounds. A method for preparing a photoresist pattern comprises: a step of applying the photoresist composition on a substrate to form a photoresist composition layer; a step of drying the layer to form a photoresist film; a step of exposing the photoresist film; a step of heating the photoresist film; and a step of developing the photoresist film.
    • 目的:提供光致抗蚀剂组合物和盐以用作酸产生剂并获得光致抗蚀剂图案。 构成:酸产生剂的盐由化学式I表示。酸产生剂含有化学式I的盐。光致抗蚀剂组合物含有酸产生剂和酸不稳定基团。 该组合物另外含有碱性化合物。 制备光致抗蚀剂图案的方法包括:将光致抗蚀剂组合物施加在基底上以形成光致抗蚀剂组合物层的步骤; 干燥该层以形成光致抗蚀剂膜的步骤; 曝光光刻胶膜的步骤; 加热光致抗蚀剂膜的步骤; 以及显影光致抗蚀剂膜的步骤。
    • 10. 发明公开
    • 포토레지스트 제거용 조성물
    • 光电剥离组合物
    • KR1020110026199A
    • 2011-03-15
    • KR1020090083994
    • 2009-09-07
    • 동우 화인켐 주식회사
    • 유경욱최경미김상태
    • G03F7/42
    • G03F7/425C07C381/12C07D243/08C07D333/46C07D413/14C11D7/5013G03F7/0045G03F7/32G03F7/422
    • PURPOSE: A photo-resist eliminating composition is provided to effectively eliminate photo-resists and photo-resist residues remained after hard-baking, plasma etching, high temperature ashing processes. CONSTITUTION: An organic photo-resist eliminating composition includes the following: One or more compounds are selected from a group including a compound represented by chemical formula 1 and quaternary ammonium hydroxide. A compound is represented by chemical formula 2. One or more compounds are selected from a group including saccharides, sugar alcohols, C3-C10 hydroxyl cycloalkane compounds, aromatic hydroxyl compounds, acetylene alcohols, carboxylic acid compounds, anhydrides of the carboxylic acid compounds, and triazole compounds. One or more organic solvents are selected from a group including alkylene glycol-based compounds. Deionized water is prepared.
    • 目的:提供光致抗蚀剂消除组合物,以有效消除硬烘烤,等离子体蚀刻,高温灰化处理后残留的光致抗蚀剂和光致抗蚀剂残留物。 构成:有机光致抗蚀剂消除组合物包括:一种或多种化合物选自由化学式1表示的化合物和季铵氢氧化物组成的组。 化合物由化学式2表示。一种或多种化合物选自包括糖类,糖醇,C 3 -C 10羟基环烷烃化合物,芳族羟基化合物,乙炔醇,羧酸化合物,羧酸化合物的酸酐和 三唑化合物。 一种或多种有机溶剂选自包括亚烷基二醇类化合物的组。 去离子水已经准备好了。