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    • 7. 发明公开
    • 전자기기용 하우징 제조방법
    • 生产电子设备房屋的方法
    • KR1020070116595A
    • 2007-12-10
    • KR1020077020174
    • 2006-03-08
    • 닛샤 가부시키가이샤
    • 하마오카,코이치
    • B29C45/16B29C45/14
    • B29C45/1671B29C45/14688B29C45/1675B29C2045/14696
    • A process for producing a housing for electronic equipment, comprising the steps of with the use of injection molding dies (1) having a combination of common die (4) and exchange die (2,3) so as to be able to create primary molding cavity (11) and secondary molding cavity (12), disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin of >= 80% visible ray transmittance pursuant to JIS-K7105 and >= F pencil hardness pursuant to JIS-K5600-5-4 to thereby obtain primary molding (53) corresponding to a transparent window portion and simultaneously bringing the same into contact with the decorative layer of the transfer material; and subsequently injecting a resin of >= 10 KJ/m^2 Izod impact strength pursuant to ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary molding disposed to thereby form secondary molding (54) fixed to the primary molding and simultaneously bringing the same into contact with the decorative layer of the transfer material; and detaching the transfer material from the primary molding and secondary molding.
    • 一种电子设备用壳体的制造方法,其特征在于,包括使用具有共模(4)和交换模(2,3)的组合的注射成型模具(1)的步骤,以便能够产生一次成型 空腔(11)和二次成型腔(12),在初级模制腔中设置具有叠加在基片上的装饰层的转印材料,然后根据JIS-K7105注入≥80%可见光线透射率的透明树脂 根据JIS-K5600-5-4的> = =铅笔硬度,由此获得与透明窗口部分相对应的一次成型(53),同时使其与转印材料的装饰层接触; 并随后在保持一次成型设备的同时将根据ASTM-D256的≥10KJ/ m 2悬臂梁式冲击强度的树脂注入到初级模制件周围的次级模制腔中,从而形成固定到初级模制件的二次模塑(54) 同时使其与转印材料的装饰层接触; 并从第一次模塑和二次模塑中分离转移材料。