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    • 6. 发明公开
    • 와이어집합체,그것을이용한절단방법및그장치
    • 线路聚合,切割方法和使用它的设备
    • KR1020000016914A
    • 2000-03-25
    • KR1019990027479
    • 1999-07-08
    • 히다찌 케이블 리미티드
    • 오하시세이시로마쓰자와미사오
    • B26D3/00
    • B23D61/185B23D57/0053B23D57/0061B23D57/0069B28D5/045Y10T83/696
    • PURPOSE: A wire aggregate is provided to easily process plural polishing particle bonding wires when cutting a material to be processed with plural polishing particle bonding wires. CONSTITUTION: The cutting device(11) with a wire aggregate includes:a left-off reel(12) where a wire aggregate(1) is rolled to be used for continuously or intermittently leaving off the aggregate; a tape base material release roll(14) placed in the middle between the left-off reel and a material to be processed(19) to be used for releasing a tape base material(2) from the wire aggregate; a roll-up reel(16) for rolling up the released tape base material; another roll-up reel(21) for rolling up each polishing particle bonding wire(4) after cutting the material to be processed; and a tension feed piece for feeding the tension to the moving wire aggregate as well as each polishing particle bonding wire.
    • 目的:提供一种线集合体,用多个研磨粒子接合线切割待加工材料时容易处理多个研磨粒子接合线。 构成:具有线集合体的切割装置(11)包括:用于连续或间歇地离开骨料的卷材(1)的离开卷轴(12); 放置在所述左侧卷轴和待加工材料(19)之间的中间的带状基材释放辊(14),用于从所述线集合体释放带状基材(2); 卷起卷轴(16),用于卷起释放的带状基材; 另一个用于在切割待处理材料之后卷绕每个抛光颗粒接合线(4)的卷起卷轴(21) 以及用于将张力供给到移动线集合体以及每个抛光颗粒接合线的张力馈送片。