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    • 3. 发明授权
    • 보상패턴을 구비한 포토마스크 및 보상패턴을 이용한반도체 제조 방법
    • 如果您有任何疑问,请与我们联系。
    • KR100378961B1
    • 2003-04-08
    • KR1020000044107
    • 2000-07-29
    • 주식회사 에이티아이
    • 윤의식
    • H01L21/027
    • PURPOSE: A photomask having a compensation pattern is provided to easily design the photomask for manufacturing a semiconductor having a corner part or convex part, by using the photomask wherein the compensation pattern of a relatively narrower width is added to an original pattern having a corner part. CONSTITUTION: The original pattern(40) has the corner part. The compensation pattern(52) is extended from the original pattern. One side(52a) of the compensation pattern is extended from one side(51) of the corner part, and the other side(52b) of the compensation pattern has a predetermined length in the direction of the one side and by a predetermined width.
    • 目的:提供具有补偿图案的光掩模,以通过使用光掩模容易地设计用于制造具有角部或凸部的半导体的光掩模,其中将具有较窄宽度的补偿图案添加到具有角部的原始图案 。 构成:原始图案(40)具有角落部分。 补偿模式(52)从原始模式延伸。 补偿图案的一侧(52a)从角部的一侧(51)延伸,并且补偿图案的另一侧(52b)在一侧的方向上具有预定长度并且具有预定宽度。
    • 4. 发明授权
    • 비절단형 광섬유 케이블망
    • 非光纤电缆网络
    • KR101799457B1
    • 2017-12-20
    • KR1020150116664
    • 2015-08-19
    • 주식회사 에이티아이
    • 전완진김만진
    • G02B6/44G08B13/12
    • 본발명은비절단형광섬유케이블망(100)에관한것이다. 본발명은다수의제1 케이블(C1)들과다수의제2 케이블(C2)들이서로꼬임구조(C)를이루고, 다시인접되어있는다수의제1 케이블(C1)들과다수의제2 케이블(C2)들이서로꼬임구조(C)를이룬다음, 다시최초의위치로되돌아와서처음의다수의제1 케이블(C1)들과다수의제2 케이블(C2)들이서로꼬임구조(C)를이루게되고, 이러한과정을반복적으로수행하고있는광섬유케이블망에있어서, 상기광섬유케이블망의최초의시작지점에있는다각형상의케이블망눈은하나의케이블로형성된것으로서제1 케이블(C1)들과연결케이블(C3)들및 제2 케이블(C2)들에의하여 5각형망눈(110)들로형성되어있고, 그이후에는상기제1 케이블(C1)들과상기제2 케이블(C1)들에의해통상적인방식으로 6각형망눈(120)들로연속적이고계속적반복적으로형성되어있는것을특징으로한다.
    • 切割光缆网络(100)技术领域本发明涉及一种切割光缆网络(100)。 本发明的特征在于,多个第一电缆(C1)和多个第二电缆(C2)形成相互扭绞的结构(C)和多个第一电缆(C1) 第一线缆C2和第二线缆C2形成绞合结构C,然后返回到原始位置,使得第一多个线缆C1和多个第二线缆C2形成绞合结构C 在反复进行该处理的光缆网络中,光缆网络初始起点的多边形电缆网由一根电缆形成,第一电缆(C1)和连接电缆(C3) 通过第一电缆C1和第二电缆C1和C2由五边形网110形成,然后通过第一电缆C1和第二电缆C1以常规方式形成 并且在六边形网120中连续重复地形成。
    • 8. 发明授权
    • 광 모드 크기 변환기
    • 광모드크기변환기
    • KR100397320B1
    • 2003-09-06
    • KR1020000058582
    • 2000-10-05
    • 주식회사 에이티아이
    • 윤의식전홍준고한준최민호
    • H01L31/12G02B6/02
    • G02B6/4206G02B6/1228
    • A optical mode size converter may increase alignment error allowance in an optical input unit combined with a semiconductor optical element as well as in an optical output unit combined with an optical fiber. The optical mode size converter positioned between a semiconductor light source and an optical transfer medium for receiving output light from the light source, converting its size and outputting includes a substrate, a buffer layer laminated on the substrate, a lower waveguide formed on a predetermined area on the buffer layer, a lower clad layer formed on the lower waveguide and the buffer layer, an upper waveguide formed on the lower clad layer corresponding to the lower waveguide and having a branched optical input unit, and an upper clad layer formed on the upper waveguide and the lower clad layer.
    • 光学模式尺寸转换器可以增加与半导体光学元件组合的光学输入单元以及与光纤组合的光学输出单元中的对准误差容限。 位于半导体光源和用于接收来自光源的输出光并转换其大小并输出的半导体光源和光学传输介质之间的光学模式尺寸转换器包括衬底,层叠在衬底上的缓冲层,形成在预定区域上的下部波导 在所述缓冲层上形成有在所述下部波导和所述缓冲层上形成的下部包覆层,在与所述下部波导对应的下部包层上形成的上部波导,所述上部波导具有分支光输入部,在所述上部包层上形成 波导和下部包层。
    • 9. 发明公开
    • 상이한 깊이를 가진 박막층에 의한 3차원 실리콘 웨이퍼제조 방법
    • 通过使用具有不同深度的薄膜制造三维硅波的方法
    • KR1020020010403A
    • 2002-02-04
    • KR1020000044108
    • 2000-07-29
    • 주식회사 에이티아이
    • 윤의식
    • H01L21/02
    • PURPOSE: A method for manufacturing a three-dimensional silicon wafer by using a thin films having different depths is provided to simplify a manufacturing process, by omitting the repeated process for forming and removing the thin film, wherein a new thin film is formed, a remaining thin film is eliminated after the shape of a silicon wafer is formed and a new thin film is formed again. CONSTITUTION: The thin films(31) having different heights corresponding to various types of three-dimensional shapes to be formed on the silicon wafer(30) are formed. The thin films having the different heights are sequentially removed to selectively expose the silicon wafer. The exposed silicon wafer is etched.
    • 目的:提供通过使用具有不同深度的薄膜制造三维硅晶片的方法,以简化制造工艺,通过省略形成和去除薄膜的重复工艺,其中形成新的薄膜, 在形成硅晶片的形状之后,剩余的薄膜被消除,并再次形成新的薄膜。 构成:形成与在硅晶片(30)上形成的各种三维形状对应的具有不同高度的薄膜(31)。 依次去除具有不同高度的薄膜以选择性地暴露硅晶片。 暴露的硅晶片被蚀刻。
    • 10. 发明公开
    • 보상패턴을 구비한 포토마스크 및 보상패턴을 이용한반도체 제조 방법
    • 具有补偿图案的光电元件及使用补偿图案制造半导体的方法
    • KR1020020010402A
    • 2002-02-04
    • KR1020000044107
    • 2000-07-29
    • 주식회사 에이티아이
    • 윤의식
    • H01L21/027
    • PURPOSE: A photomask having a compensation pattern is provided to easily design the photomask for manufacturing a semiconductor having a corner part or convex part, by using the photomask wherein the compensation pattern of a relatively narrower width is added to an original pattern having a corner part. CONSTITUTION: The original pattern(40) has the corner part. The compensation pattern(52) is extended from the original pattern. One side(52a) of the compensation pattern is extended from one side(51) of the corner part, and the other side(52b) of the compensation pattern has a predetermined length in the direction of the one side and by a predetermined width.
    • 目的:提供具有补偿图案的光掩模,以容易地设计用于制造具有角部或凸部的半导体的光掩模,通过使用光掩模,其中相对较窄宽度的补偿图案被添加到具有角部分的原始图案 。 规定:原始图案(40)具有角部。 补偿图案(52)从原始图案延伸。 补偿图案的一侧(52a)从角部的一侧(51)延伸,并且补偿图案的另一侧(52b)在一侧的方向上具有预定的长度并且具有预定的宽度。