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1. 发明公开

KR20180072258A 플라즈마 처리 장치의 온도 조절기 및 이를 포함하는 플라즈마 처리 장치 审中-公开
公开(公告)号：KR20180072258A
公开(公告)日：2018-06-29
申请号：KR20160175643
申请日：2016-12-21
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： HA SEONG MOON , SUNG MIN KYU , CHO SEUNG HEE , CHOI SEONG CHUL , KIM KYUNG SUN , LEE SANG HO
IPC分类号： H01J37/32
CPC分类号： H01L21/67069 , H01J37/32522 , H01J2237/002 , H01J2237/24507 , H01L21/67248 , H01L21/67253
摘要： 플라즈마처리장치의온도조절기는가열유닛및 냉각유닛을포함할수 있다. 상기가열유닛은플라즈마가형성되는공간을한정하는플라즈마챔버의내벽에배치된라이너(liner)를가열할수 있다. 상기냉각유닛은상기플라즈마의파워에따라상기라이너를선택적으로냉각하여, 상기플라즈마챔버내에배치된상부전극의온도를조절할수 있다. 따라서, 플라즈마의파워에따라라이너의온도가조절되므로, 상부전극의온도를공정온도에부합되도록일정하게유지시킬수 있다.

2. 发明公开

KR20200134582A 압력 측정 장치 审中-公开
公开(公告)号：KR20200134582A
公开(公告)日：2020-12-02
申请号：KR20190060217
申请日：2019-05-22
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： WON IN HO , MOON MIN SEOK , PARK BYOUNG KON , LEE SANG HO , JEONG JAE WON
IPC分类号： G01L9/00 , H01L21/67
摘要： 본개시의일 실시예는노즐로부터분사되는액체의분사압력을측정하기위한압력측정장치를포함할수 있다. 상기압력측정장치는상기노즐을향하는제1 면및 상기제1 면에대향하는제2 면을포함하는플레이트; 상기액체의분사위치및 상기분사위치에서의분사압력의세기를감지하고, 상기분사압력의세기에기초하여감지신호를생성하도록구성된압력센서부; 상기감지신호를전달받고, 상기분사압력의세기의데이터를수집하는제어부; 상기데이터를외부장치에전송하도록구성된통신부; 및상기압력측정장치에전력을공급하도록구성된전원부;를포함하고, 상기압력센서부는상기플레이트의상기제1 면상에있고, 상기제어부, 상기통신부, 및상기전원부는상기플레이트의상기제2 면상에있는것을특징으로한다.

3. 发明公开

KR20180055189A 자연어 처리 방법 및 장치와 자연어 처리 모델을 학습하는 방법 및 장치 审中-公开
公开(公告)号：KR20180055189A
公开(公告)日：2018-05-25
申请号：KR20160152712
申请日：2016-11-16
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE SANG HO , PARK HYOUNG MIN
IPC分类号： G06F17/28 , G06F17/27
CPC分类号： G10L15/1815 , G06F17/273 , G06F17/2735 , G10L15/02 , G10L15/063 , G10L15/14 , G10L15/16 , G10L15/19 , G10L15/22 , G10L2015/025
摘要： 자연어처리방법이개시된다. 일실시예는음성인식된문장데이터의워드들을워드벡터들로변환하고, 상기문장데이터의캐릭터들을캐릭터벡터들로변환하며, 상기워드벡터들과상기캐릭터벡터들을기초로상기문장데이터에대한문장벡터를생성하고, 상기문장벡터를기초로상기문장데이터의의도(intent) 정보를결정한다.

4. 发明公开

KR20070118807A APPATURUS AND METHOD FOR HANDOFF USING DIVERSITY GAIN IN MOBILE COMMUNICATION SYSTEM 审中-公开
标题翻译：在移动通信系统中使用多样性增益的手段和方法
公开(公告)号：KR20070118807A
公开(公告)日：2007-12-18
申请号：KR20060052980
申请日：2006-06-13
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE SANG JUN , WEE PYEONG HWAN , KWON JAE YEONG , CHOI YOUNG HAK , LEE SANG HO
IPC分类号： H04B7/26
CPC分类号： H04W36/30 , H04B7/0404
摘要： A handoff device using a diversity gain in a mobile communication system and a method thereof are provided to use 2 antennas with a serving base station during handoff, so as to move a handoff start point to a target base station from the serving base station, thereby lowering generation frequency of ping-pong as reducing delay time. Signal strength of a signal with a serving base station is measured(410). It is checked whether a value of the measured signal strength is less than a reference value(420,430). If so, a user terminal starts handoff to a target base station(440). The preset reference value is a minimum signal strength value capable of transceiving the signal between the user terminal and the serving base station.
摘要翻译：提供一种在移动通信系统中使用分集增益的越区切换装置及其方法，用于在切换期间使用具有服务基站的2个天线，以便从服务基站将切换起点移动到目标基站，从而降低乒乓球的发生频率，减少延迟时间。测量与服务基站的信号的信号强度（410）。检查测量信号强度的值是否小于参考值（420,430）。如果是，则用户终端开始切换到目标基站（440）。预设参考值是能够收发用户终端和服务基站之间的信号的最小信号强度值。

5. 发明公开

KR20070080523A APPARATUS AND METHOD FOR TREATING A WAFER 审中-公开
标题翻译：用于处理波形的装置和方法
公开(公告)号：KR20070080523A
公开(公告)日：2007-08-10
申请号：KR20060011889
申请日：2006-02-07
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE KWAN HEUM , LEE SANG HO
IPC分类号： H01L21/66 , H01L21/677
CPC分类号： H01L21/67028 , B08B7/0042 , H01L21/6704 , H01L21/68714 , H01L22/24
摘要： A wafer processing apparatus and a method are provided to remove completely particles from a wafer loading portion of a wafer stage by using a laser module capable of generating shock waves against the particles. A wafer processing apparatus includes a wafer stage and a laser module. The wafer stage includes a wafer loading portion capable of loading stably a wafer in a predetermined process. The laser module(420) removes particles attached onto the wafer loading portion by generating shock waves against the particles using a laser irradiation. The wafer processing apparatus further includes a measurement unit for measuring the flatness of the wafer loading portion, a transfer unit for transferring the wafer stage, and a control unit for controlling the transfer unit on the basis of the measurement value received from the measurement unit.
摘要翻译：提供了一种晶片处理装置和方法，其通过使用能够产生针对颗粒的冲击波的激光模块来从晶圆台的晶片装载部分中完全除去颗粒。晶片处理装置包括晶片台和激光模块。晶片台包括能够以预定工艺稳定地加载晶片的晶片装载部分。激光模块（420）通过使用激光照射产生对颗粒的冲击波来去除附着在晶片装载部分上的颗粒。晶片处理装置还包括用于测量晶片装载部分的平坦度的测量单元，用于传送晶片台的传送单元和用于基于从测量单元接收的测量值来控制传送单元的控制单元。

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