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    • 3. 发明公开
    • Non-volatile memory device
    • 非易失性存储器件
    • KR20100075098A
    • 2010-07-02
    • KR20080133714
    • 2008-12-24
    • SAMSUNG ELECTRONICS CO LTD
    • KIM JIN GYUNSHIN SEUNG MOKCHAE SOO DOOLEE SEUNG YUP
    • H01L27/115
    • H01L27/11551H01L27/0688H01L27/11548H01L27/11556H01L27/11575H01L27/11578H01L27/11582H01L29/42332H01L29/7881H01L29/792H01L29/7926H01L27/2463
    • PURPOSE: A nonvolatile memory device is provided to improve the reliability of a nonvolatile memory cell by preventing charges stored in a charge storage pattern from moving up and down. CONSTITUTION: A plurality of gate patterns and Insulation patterns between a plurality of gates are alternatively stacked on a substrate. An active pattern(140a) is arranged on a substrate and is extended along the sidewalls of the cell gate patterns and the insulation patterns between the gates. A plurality of charge storage patterns is arranged between the plurality of cell gate patterns and an active pattern and is separated with each other. Tunnel insulation patterns are arranged between the plurality of charge storage patterns and the active pattern and are directly connected to each other. A plurality of blocking insulation patterns is interposed between the plurality of cell gate patterns and the plurality of charge storage patterns.
    • 目的:提供一种非易失性存储装置,通过防止存储在电荷存储模式中的电荷上下移动来提高非易失性存储单元的可靠性。 构成:在多个栅极之间的多个栅极图案和绝缘图案交替地层叠在基板上。 有源图案(140a)布置在衬底上并沿着单元栅极图案的侧壁和栅极之间的绝缘图案延伸。 多个电荷存储图案被布置在多个单元栅极图案和活动图案之间并且彼此分离。 隧道绝缘图案布置在多个电荷存储图案和有源图案之间并且彼此直接连接。 多个隔离绝缘图案插入在多个单元栅极图案和多个电荷存储图案之间。
    • 4. 发明公开
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • KR20070079115A
    • 2007-08-06
    • KR20060009536
    • 2006-02-01
    • SAMSUNG ELECTRONICS CO LTD
    • NOH JIN TAEYANG SANG RYOLHWANG KI HYUNKIM JIN GYUNLEE SUNG HAEKIM HONG SUK
    • H01L21/336
    • A method for manufacturing a semiconductor device is provided to control effectively off-current of a cell transistor by increasing a work function of a gate electrode. A gate insulating layer(102) and a polysilicon layer doped with a P type impurity are formed on a substrate(100) including a cell area having a pin type active area and a peri/core area including a flat type active area. A photoresist pattern for exposing an NMOS transistor region of the peri/core area is formed on the polysilicon layer doped with the P type impurity. The exposed polysilicon layer is converted to an N type impurity-doped polysilicon layer by counter-doping an N type impurity on the polysilicon layer. A first polysilicon pattern(110) doped with the P type impurity, a second polysilicon pattern(112) doped with the P type impurity, and a third polysilicon pattern(114) doped with the N type impurity are formed by patterning the polysilicon layer doped with the P type impurity and the N type impurity. Source/drains are formed at both sides of the first to the third polysilicon patterns.
    • 提供一种用于制造半导体器件的方法,通过增加栅电极的功函数来有效地控制单元晶体管的截止电流。 在包括具有引脚型有源区域的单元区域和包括平面型有源区域的区域/核心区域的基板(100)上形成栅极绝缘层(102)和掺杂有P型杂质的多晶硅层。 在掺杂有P型杂质的多晶硅层上形成用于暴露周边/核心区域的NMOS晶体管区域的光致抗蚀剂图案。 曝光的多晶硅层通过在多晶硅层上相互掺杂N型杂质而转换成N型杂质掺杂多晶硅层。 掺杂有P型杂质的第一多晶硅图案(110),掺杂有P型杂质的第二多晶硅图案(112)和掺杂有N型杂质的第三多晶硅图案(114)通过将多晶硅层掺杂 具有P型杂质和N型杂质。 源极/漏极形成在第一至第三多晶硅图案的两侧。