会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明公开
    • 탄성파 디바이스 및 그 제조 방법
    • 弹性波装置及其制造方法
    • KR1020080009626A
    • 2008-01-29
    • KR1020070041530
    • 2007-04-27
    • 후지쓰 메디아 데바이스 가부시키가이샤후지쯔 가부시끼가이샤
    • 이노우에가즈노리마쯔다다까시이노우에쇼고미시아오유기무라죠우지
    • H03H9/64
    • H03H9/72H03H3/08H03H9/0576H03H2250/00
    • An elastic wave device and a manufacturing method thereof are provided to form a dual filter by adhering and integrating the side of a wafer level packaged single filter. An elastic wave device is formed by charging the gap between at least two elastic surface wave devices with resin. The surface acoustic wave device includes a substrate, a functional part, a package(2), a recess, and a cutout. The functional part is formed on the surface of the substrate. The recess forms a space for the operation of the functional part. The package covers the surface of the substrate. The cutout is placed on the side of each package of the surface acoustic wave device which corresponds to the part connected by the charging of the resin between the surface acoustic wave devices. A part of the side, the rear, and the front of the two elastic surface wave devices is covered by the first resin charged in more than one cutout of the side of the package.
    • 提供一种弹性波器件及其制造方法,通过粘合并整合晶片级封装的单一滤波器的侧面来形成双重滤波器。 通过在至少两个弹性表面波装置之间的间隙对树脂进行充电来形成弹性波装置。 表面声波装置包括基板,功能部件,封装(2),凹部和切口。 功能部件形成在基板的表面上。 凹部形成用于功能部件的操作的空间。 该封装覆盖基板的表面。 该切口位于表面声波装置的每个包装的与通过表面声波装置之间的树脂充电连接的部分相对应的一侧上。 两个弹性表面波装置的侧面,后部和前部的一部分被填充在包装侧的多于一个切口中的第一树脂覆盖。
    • 6. 发明授权
    • 전자 부품
    • 电子元件
    • KR100766213B1
    • 2007-10-10
    • KR1020060111007
    • 2006-11-10
    • 후지쯔 가부시끼가이샤
    • 마쯔모또쯔요시미즈노요시히로미시아오유오꾸다히사오우에다사또시
    • H01L27/04
    • H01G4/008H01G4/232H01G4/33H01L24/18H01L28/10H01L28/75
    • 하위 전극막과 유전체막과의 밀착성이 우수함과 함께 고내전압을 실현하는데에도 알맞은 캐패시터부를 가지는 전자 부품을 제공한다. 본 발명의 전자 부품은, 기판 및 캐패시터부를 구비한다. 캐패시터부는, 기판 위에 형성된 전극막(11)(하위 전극막), 해당 전극막(11)에 대향하는 전극막(12)(상위 전극막), 및, 해당 전극막(11, 12) 사이의 유전체막(13)으로 이루어지는 적층 구조를 가진다. 전극막(11)은, 유전체막(13)측에 산화 피막(11c')을 가지며 해당 유전체막(13)과 접합하고 있는 밀착 금속층(11c)을 포함하는 다층 구조를 가진다.
      집적형 전자 부품, 기판, 캐패시터, 전극막, 기초 밀착층, 주도전층, 밀착 금속층, 산화 피막, 유전체막, 코일 인덕터, 전극 패드, 배선, 보호막
    • 本发明提供一种电子部件,该电子部件具有下部电极膜和电介质膜的密合性优异的电容器部,并且适合实现高耐压。 本发明的电子部件包括衬底和电容器部分。 电容器部分包括形成在基板上的电极膜11(下电极膜),面对电极膜11的电极膜12(上电极膜)和电介质 还有一部电影(13)。 电极膜11具有多层结构,该多层结构包括在电介质膜13侧具有氧化膜11c'并且与电介质膜13接合的粘合金属层11c。
    • 7. 发明公开
    • 전자 부품
    • 电子元件
    • KR1020070067598A
    • 2007-06-28
    • KR1020060111007
    • 2006-11-10
    • 후지쯔 가부시끼가이샤
    • 마쯔모또쯔요시미즈노요시히로미시아오유오꾸다히사오우에다사또시
    • H01L27/04
    • H01G4/008H01G4/232H01G4/33H01L24/18H01L28/10H01L28/75
    • An electronic component is provided to improve adhesion of a lower electrode layer and a dielectric layer and include a capacitor proper for embodying a high voltage by including a first electrode layer having a multilayered structure that has an oxide coating layer at a side of a dielectric layer and an adhesion metal layer in contact with a corresponding dielectric layer. An electronic component includes a substrate and a capacitor part. The capacitor part has a stacked structure of a first electrode layer(11) formed on the substrate, a second electrode layer(12) confronting the first electrode layer, and a dielectric layer(13) between the first and the second electrode layers. The first electrode layer includes a multilayered structure which has an oxide coating layer at a side of the dielectric layer and an adhesion metal layer in contact with the corresponding dielectric layer. An interconnection layer can be further included on the substrate, having a structure in which the adhesion metal layer is excepted from the multilayered structure of the first electrode layer.
    • 提供电子部件以提高下电极层和电介质层的粘附性,并且包括适用于体现高电压的电容器,包括具有多层结构的第一电极层,该多层结构在电介质层侧具有氧化物涂层 以及与相应介电层接触的粘附金属层。 电子部件包括基板和电容器部。 电容器部分具有形成在基板上的第一电极层(11),与第一电极层相对的第二电极层(12)和第一和第二电极层之间的电介质层(13)的堆叠结构。 第一电极层包括在电介质层侧具有氧化物被覆层和与相应的电介质层接触的粘附金属层的多层结构。 可以在衬底上进一步包括互连层,其具有除了第一电极层的多层结构之外的附着金属层的结构。
    • 9. 发明公开
    • 집적형 전자 부품 및 집적형 전자 부품 제조 방법
    • 集成电子元件和制造集成电子元件的方法
    • KR1020070026027A
    • 2007-03-08
    • KR1020060079679
    • 2006-08-23
    • 후지쯔 가부시끼가이샤
    • 미시아오유미즈노요시히로마쯔모또쯔요시오꾸다히사오우에다사또시
    • H03H7/38
    • H01L27/0688H01F17/0006H01L23/5227H01L2924/0002H01L2924/09701H01L2924/3011H01L2924/00
    • An integrated electronic component and a manufacturing method thereof are provided to obtain high Q value by suppressing loss of a wiring for connecting between components. In an integrated electronic component(X), a plurality of passive components includes a multistage coil inductor(10A). The multistage coil inductor(10A) is formed on a substrate(S). The multistage coil inductor(10A) has a plurality of coils arranged in a multistage manner and separated from each other by a gap. A plurality of pad parts(40C) are for connection with the outside. A solid wiring(30) has first, second, and third wiring parts(31,32,33). The first wiring part(31) is elongated with contacting the substrate(S). The second wiring part(32) is elongated along the corresponding substrate(S) by being separated from the substrate(S). The third wiring part(33) is connected to the first and second wiring parts(31,32).
    • 提供一种集成电子部件及其制造方法,通过抑制用于连接部件的配线的损失来获得高Q值。 在集成电子部件(X)中,多个无源部件包括多级线圈电感器(10A)。 多级线圈电感器(10A)形成在基板(S)上。 多级线圈电感器(10A)具有以多级布置的多个线圈,并且通过间隙彼此分离。 多个垫部件(40C)用于与外部连接。 实线(30)具有第一,第二和第三布线部(31,32,33)。 第一布线部分31与衬底(S)接触而伸长。 第二配线部分(32)通过与衬底(S)分离而沿对应的衬底(S)伸长。 第三配线部33被连接到第一和第二配线部31,32。