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    • 6. 发明公开
    • 다이아몬드 와이어쏘의 제조방법
    • 制造金刚石涂层线的方法
    • KR1020130111758A
    • 2013-10-11
    • KR1020120033886
    • 2012-04-02
    • 한국생산기술연구원
    • 이준균심진섭윤영세양세훈이원식
    • B23D61/18C23C24/08B22F7/08
    • B23D61/185B23P5/00C23C24/08
    • PURPOSE: A method for manufacturing a diamond coated wire saw is provided to manufacture a wire saw firmly coated with diamond particles at low costs in comparison with a nickel electro deposition method and to ensure excellent adhesion by attaching diamond particles using sintered metal powder. CONSTITUTION: A method for manufacturing a diamond coated wire saw comprises the following steps: applying a mixture of metal powder, diamond powder, and an organic binder on the surface of a pre-treated metal wire; heating the metal wire to remove the organic binder; and sintering the metal powder. [Reference numerals] (a) Mixed powder (60%)-binder (40%); (b) Mixed powder (65%)-binder (35%)
    • 目的:提供用于制造金刚石涂层线锯的方法,以与镍电沉积方法相比较,以低成本制造牢固涂覆有金刚石颗粒的线锯,并且通过使用烧结金属粉末附着金刚石颗粒来确保优异的附着力。 构成:金刚石涂层线锯的制造方法包括以下步骤:将金属粉末,金刚石粉末和有机粘合剂的混合物施加到预处理的金属丝的表面上; 加热金属丝以去除有机粘合剂; 并烧结金属粉末。 (附图标记)(a)混合粉末(60%) - 粘合剂(40%); (b)混合粉末(65%) - 粘合剂(35%)
    • 7. 发明授权
    • 진동 발전장치 제작용 지그
    • 使用振动制造生成装置的JIG
    • KR101180852B1
    • 2012-09-07
    • KR1020110016985
    • 2011-02-25
    • 한국생산기술연구원
    • 김준기이원식손성호고세현조규섭이창우
    • H02K35/02H02K15/00B06B1/10
    • PURPOSE: A jig for manufacturing a vibration generator is provided to reduce processes and production costs by attaching a first magnet and a second magnet on a vibrator with only one operation. CONSTITUTION: An upper unit(200) is located on the upper side of a lower unit(100). A first receiving hole(110) is formed on the lower unit. A second receiving hole(220) and a third receiving hole(210) are alternatively formed on the upper unit. A bottom plate(300) is located under the lower unit. A connection protrusion(340) is formed on the bottom plate. An upper plate(400) is located above the upper unit.
    • 目的:提供一种用于制造振动发生器的夹具,用于仅通过一次操作将第一磁体和第二磁体附着在振动器上来降低工艺和生产成本。 构成:上部单元(200)位于下部单元(100)的上侧。 第一容纳孔(110)形成在下部单元上。 交替地在上部单元上形成第二容纳孔(220)和第三容纳孔(210)。 底板(300)位于下部单元下方。 连接突起(340)形成在底板上。 上板(400)位于上部单元上方。