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1. 发明公开

KR1020010094021A 쉴드백 내의 습도표시지 또는 방습제 봉입 누락을 방지할수 있는 습도표시지, 방습제 및 반도체 칩 패키지 포장방법 无效
标题翻译：在不包含湿度指示剂或清洁剂的情况下，在防护袋中包装湿度指示剂，阻燃剂和半导体芯片的方法
公开(公告)号：KR1020010094021A
公开(公告)日：2001-10-31
申请号：KR1020000017379
申请日：2000-04-03
申请人： 최문수
发明人： 최문수 , 랄프브루스오코너
IPC分类号： B65B7/00
CPC分类号： B65B61/20 , B65B51/00 , B65B57/10 , B65B61/025 , B65B2220/16
摘要： PURPOSE: A packing method of a shield bag including a humidity indicator, a desiccant and semiconductor chip package is provided to prevent a humidity indicator or a desiccant in the shield bag from being omitted by detecting the absence conveniently in packing semiconductor chips or electronic components. CONSTITUTION: Semiconductor chips or electronic components are packed with a first package such as a tube, a tray or carrier tape. A humidity indicator(10) is attached to a packing bag of a desiccant(20) to prevent the humidity indicator from being omitted. The desiccant and the humidity indicator are put in a second package with the packed electronic components, and the second package is sealed. The humidity indicator is put in a shield bag with being stuck to the desiccant packing bag. The absence of the humidity indicator or the desiccant is checked with detecting the weight of the sealed shield bag or with sticking an electromagnetic sensing label or an electromagnetic sensing tag to the humidity indicator or the desiccant.
摘要翻译：目的：提供一种包括湿度指示器，干燥剂和半导体芯片封装的屏蔽袋的包装方法，以通过检测在封装半导体芯片或电子部件的方便性方面来防止屏蔽袋中的湿度指示器或干燥剂被省略。规定：半导体芯片或电子部件装有诸如管，托盘或载带之类的第一封装。湿度指示器（10）附接到干燥剂（20）的包装袋上，以防止湿度指示器被省略。将干燥剂和湿度指示器放入具有包装的电子部件的第二包装中，并且第二包装被密封。湿度指示器放在屏蔽袋中，粘在干燥剂包装袋上。通过检测密封的保护袋的重量或者将电磁感应标签或电磁感应标签贴在湿度指示器或干燥剂上，检查湿度指示器或干燥剂的不存在。

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